Scotch tape adhesion test

Removing the PDMS stamp (to which gold has poor adhesion) from the plastic substrate transfers the gold/titania metal from the raised regions of the stamp to the substrate. The entire procedure occurs at ambient conditions with contact times less than 15 sec. Scotch tape adhesion tests further confirm that the transferred patterns are strongly bonded to the substrate. Since aluminum also readily forms surface oxides, the same interfacial chemistry can be used to generate aluminum patterns... 

The adhesion of titania can be tuned by the choice of the ligand. For example, as phenylphosphonic acid can strongly bind the titanium dioxide it results in the deposition of titania films that can pass the Scotch tape adhesion test [101]. 

Scotch Tape adhesion tests of 50 nm Au films on the MPS dipped samples revealed complete removal of the Au. Similar adhesion studies of the refluxed MPS samples demonstrated no removal of Au. We feel that the multilayers... 

Adhesion Micro-Indentation, Scotch-tape peeling test... 

There are some standard adhesion tests used by the paint and coatings industry, which we have adopted for our work. The most common is the Scotch tape test, which is described by an ASTM D3359, method B. 

Figure 3 presents results of adhesion for LBG1025/PVDF composites. As one can see, in the particular testing conditions, LBG1025 has a poor adhesion (100% of the coating has been removed by the Scotch tape even without a need to make cross-cut scratches on the surface of current collector). 

Figure 3. Adhesion (Scotch tape test) of PVDF/LBG1025 coating showing poor adhesion ofgraphite to copper current collector.

The adhesion of the UVC lacquer was tested immediately after radiation with Scotch tape in a "peel back" puU-adhesion test and was evaluated by a... 

Adhesion tests can be broken into two categories qualitative and quantitative. They vary from a simple Scotch tape test to a complicated flyer tape test, which requires precision-machined specimens and a very expensive testing facility. Quantitative (such as peeling) tests have been developed for coatings on plastics (12), but not to the same extent for metal-to-metal systems. The quantitative testing systems in limited use, mainly in the electronics industry, are not commonly present in production plants but have been used to aid in process development. For quality control purposes, qualitative tests for metal-to-metal adhesion (13) are usually adequate. The adhesion of some plated metal parts is improved with baking for 1 to 4 h at relatively low (120 to 320°C) temperatures. 

Required on front folder in a clear, sharp, permanent-type print in black ink. Permanent adhesive labels may be used in a clear, sharp print. Printing must withstand a Scotch Tape Test, which consists of pressing a strip of Scotch tape firmly on the printed area and removing it. There should be no transfer of the printed area on the tape. 

With the help of complementary surface analysis techniques such as XPS, Static SIMS and AES, we have been able to show how a short (23 msfilms leads to a slight oxidation of the surface as well as to the formation of N2 containing species. These modifications are necessary for the improvement of the adhesion observed with a scotch-tape test. However, the presence of oxygen is not the only factor responsible for a good adhesion, since the AES profiles of die deposited aluminium, show the same oxidized interface in the case of the non treated metallized polymeric film. The films are pretreated in a corona discharge configuration (hollow electrode-grounded cylinder) and the aluminium is deposited onto the film in situ. 

Analysis of the Non Metallized. Pretreated Polypropylene. In a previous paper (1), we have shown that for very short treatment times (23 ms) in N2 or NH3 plasma, the first observed effect of the plasma was an increase of the dispersive component (y ) of the polypropylene surface tension. Since almost no nitrogen nor oxygen were detected by XPS for treatment times shorter than 0.7 s, it was concluded that the plasma had first a physical effect rather than a chemical one, although the efficiency of the treatment on the Al-PP adhesion was high (as proven by the use of a scotch-tape test). 

Thermal cycling was performed on the eoatings aeeording to ASTM G5342-1972, followed by a semiquantitative tape test to eheek the adhesion strength. The temperature was cyeled five times from 85°C to —40°C, unless failure oeeurred earlier. Adhesive scotch tape of peel strength lON/em was used for the tape test. 

When tungsten is deposited by means of CVD there is almost no adhesion to dielectric materials like silicon dioxide and silicon nitride. To overcome this problem an adhesion promoting layer prior to the tungsten deposition is deposited. Sputtered films such as TiW and TiN have received the most attention [Ellwanger et al.7, Rana et al.8] and have proven to provide adequate adhesion. With respect to this it must be emphasized that macroscopic adhesion (Scotch tape test or bond pull test) in itself is not a valid proof of adhesion. The ultimate evidence can only be obtained when... 

Scotch tape test" - qualitative test that measures film adhesion a piece of adhesive tape is pressed to the film, pulled off, and examined for the presence of film. 

The principal aim of the present work was to study the modification of polymer surfaces by plasma treatment as well as the interaction of a metal film with these treated surfaces by surface analytical techniques. As shown above, the results indeed show increased interaction after surface treatment under certain conditions. However, ultimately, improved adhesion should also be observed. For this purpose preliminary expenments with aluminum films on plasma treated polypropylene were carried out. These films were not evaporated under in-situ conditions, but in a separate electron beam evaporator under identical conditions for the different polymer surfaces. A simple Scotch tape test was performed in order to characterize the adhesion qualitatively. In agreement with the surface analytical results, the as-received polypropylene surfaces show poor adhesion as the aluminum film and can be peeled off completely. A five second nitrogen plasma treatment however leads to a film which adheres well and cannot be lifted off by the same tape. Hnally, a 120 s ocatment in a nitrogen plaana leads to an oveitreatmcntof the surface characterized by a low adherion again. 

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