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Resistor integration

The first, -40 to 170 °C, covers the requirements in the passenger compartment, climate control system, and powertrain applications. The sensors are mostly based on negative thermal coefficient resistors (NTCs). Other technologies are capable of meeting the technical requirements in this temperature range (PTCs, Pt 1000 resistors, integrated circuits with linear outputs (KTY-series) or copper or nickel resistors) but none of these has a major market share so far. [Pg.343]

Equally important as tape casting in the fabrication of multilayer ceramics is thick film processing. Thick film technology is widely used in microelectronics for resistor networks, hybrid integrated circuitry, and discrete components, such as capacitors and inductors along with metallization of MLC capacitors and packages as mentioned above. [Pg.313]

Electronic Applications. The PGMs have a number of important and diverse appHcations in the electronics industry (30). The most widely used are palladium and mthenium. Palladium or palladium—silver thick-film pastes are used in multilayer ceramic capacitors and conductor inks for hybrid integrated circuits (qv). In multilayer ceramic capacitors, the termination electrodes are silver or a silver-rich Pd—Ag alloy. The internal electrodes use a palladium-rich Pd—Ag alloy. Palladium salts are increasingly used to plate edge connectors and lead frames of semiconductors (qv), as a cost-effective alternative to gold. In 1994, 45% of total mthenium demand was for use in mthenium oxide resistor pastes (see Electrical connectors). [Pg.173]

Even the tight controls in siUcon integrated circuit manufacturing are not yet sufficient to produce absolutely identical sensors on a single wafer. Cahbration of the final product is usually necessary, often by adjusting the value of a circuit element on the IC such as a resistor. The caUbration process can be automated, but it stiU adds to the cost of batch-fabricated sensors. Clever means of self-caUbration, particularly in field use, are constantiy being sought. [Pg.391]

On the analog side, tbe filter is often the conventional resistor-capacitor or RC filter. However, other possibihties exist. For example, one type of A/D converter is called an integrating A/D because the converter basically integrates the input signal over a fixed intei val of time. By making the intei val I/60th second, this approach provides excellent rejection of any 60-Hz electrical noise. [Pg.769]

Integrated circuits (IC s) are circuits in which bipolar transistors, field-effect transistors (FET), resistors, capacitors, and their required connections are combined on a single chip of semiconductor material which is usually made of single-crystal silicon. [Pg.348]

Devices for converting one type of electrical signal to others. This group includes various integration and storage devices, timing relays, remote-controlled resistors, modulators for electric-current parameters, and so on. [Pg.375]

For controlled-potential coulometry the voltage drop over a standard resistor is measured as a function of time by means of a voltage-to-frequency converter the output signal consists of a time-variant and integrally increasing number of counts (e.g., 10 counts mV-1), which by means of an operational amplifier-capacitor yields the current-time curve and integral158. [Pg.234]

Manufacture of Printed Wiring Boards. Printed wiring boards, or printed circuit boards, are usually thin flat panels than contain one or multiple layers of thin copper patterns that interconnect the various electronic components (e.g. integrated circuit chips, connectors, resistors) that are attached to the boards. These panels are present in almost every consumer electronic product and automobile sold today. The various photopolymer products used to manufacture the printed wiring boards include film resists, electroless plating resists (23), liquid resists, electrodeposited resists (24), solder masks (25), laser exposed photoresists (26), flexible photoimageable permanent coatings (27) and polyimide interlayer insulator films (28). Another new use of photopolymer chemistry is the selective formation of conductive patterns in polymers (29). [Pg.7]

One temperature-sensitive resistor as compensator and another one as detector are integrated into adjoining strings of a Wheatstone bridge circuit the voltage can be measured. Since both resistors are exposed to the test gas flow, disturbances caused by changes in temperature and humidity are compensated. [Pg.43]

In addition to absolute pressure measurements, pressure sensors can be used to determine flow rates when combined with a well-defined pressure drop over a microfluidic channel. Integration of optical waveguide structures provides opportunities for monitoring of segmented gas-liquid or liquid-liquid flows in multichannel microreactors for multiphase reactions, including channels inside the device not accessible by conventional microscopy imaging (Fig. 2c) (de Mas et al. 2005). Temperature sensors are readily incorporated in the form of thin film resistors or simply by attaching thin thermocouples (Losey et al. 2001). [Pg.68]

The cells shown in Figs. 28 and 29 all operate according to the same principles, which have been developed by Arup. The interior of the cell acts as the anode chamber, and a metal oxide cathode placed inside the cell in an alkaline electrolyte acts as the counter electrode. The hydrogen flux across the integrated membrane (coated with palladium on the internal surface) can be measured as the potential drop across a resistor placed between the membrane and the counter electrode. [Pg.309]

The following chapter includes the description of different types of microhotplates that feature resistor and transistor heating elements. Three of them were specifically designed to be monolithically integrated with circuitry, and one was a testing device that was used for the assessment of temperature distributions on the microhotplates. [Pg.29]

Fig.4.16. Heating approaches for monolithicaUy integrated microhotplates (pHP) (a) shows a resistive heater with power transistor and (b) shows a PMOS transistor heater fiheat denotes the heating resistor R is the metal-oxide chemiresistor, and Rj is a resistor used as temperaturesensor (see Fig. 4.4)... Fig.4.16. Heating approaches for monolithicaUy integrated microhotplates (pHP) (a) shows a resistive heater with power transistor and (b) shows a PMOS transistor heater fiheat denotes the heating resistor R is the metal-oxide chemiresistor, and Rj is a resistor used as temperaturesensor (see Fig. 4.4)...
The limit for the operating temperature of CMOS-microhotplates can be extended by using the microhotplate that was presented in Sect. 4.3. We now detail high-temperature microhotplates with Pt-resistors that have been realized as a single-chip device with integrated circuitry. While the aluminum-based devices presented in Sect. 4.1 were limited to 350 °C, these improved microhotplates can be heated to temperatures up to 500 °C. As the typical resistance value of the Pt-resistor is between 50 and 100 Q, a chip architecture adapted to the low temperature sensor resistance was developed. The system performance was assessed, and chemical measurements have been performed that demonstrate the full functionality of the chip. [Pg.78]

After passing through the magnetic field, the separated ions are collected in ion detectors, where the input is converted into an electrical impulse, which is then fed into an amplifier. The use of multiple detectors to simultaneously integrate the ion currents was introduced by Nier et al. (1947). The advantage of the simultaneous measurement with two separate amplifiers is that relative fluctuations of the ion currents as a function of time are the same for all m/e beams. Each detector channel is fitted with a high ohmic resistor appropriate for the mean natural abundance of the ion current of interest. [Pg.26]

Rittersma ZM, Benecke W (1999) A novel capacitive porous sihcon humidity sensor with integrated thermo- and refresh resistors gas sensors. In Proceedings of 13th European conference on solid-state transducers Eurosensors XIH , The Hague, Netherlands, pp 371-374, 12-15 Sept 1999... [Pg.97]


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See also in sourсe #XX -- [ Pg.3 , Pg.25 ]




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