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Resist Materials and Processes

Kobayashi, N., Yoshida, K., Sagawa. K., and Ishibara, S. 1995. Intumescent fire resistant coating, fire resistant material, and process. U.S. Patent, 5,401,793. [Pg.236]

Despite the considerable advances that have been made in exposure and etching systems and in the area of resist materials and processing for the various advanced lithographic technologies, photolithography continues to... [Pg.101]

The evolution of resist materials and resist processes over time has closely paralleled the evolution of lithography. Generally, the evolution of resists can be divided into two main eras, namely, the dichromate era and the modern era (see Fig. 6.1). There have been many important discoveries in resist materials and processes, some of the most significant of which are covered in this chapter and the next. [Pg.195]

Formation of the desired high-resolution resist pattern during the wet development step is in fact only part of the challenge in developing resist materials and processes for sub-lOO-nm lithography. As feature sizes have continued to shrink, pattern collapse induced by capillary forces created during the drying... [Pg.66]

The advantages of miniaturization are now being exploited in areas beyond microelectronics. Adaptation of materials and processes originally devised for semiconductor manufacture has allowed fabrication of sensors (for example, pressure meters and accelerometers used in the automotive industry) (6,7), complex optical (8) and micromechanical (6,7,9) assembHes, and devices for medical diagnostics (6,7,10) using Hthographic resists. [Pg.113]

Determine that materials produced in actual fabrication process will have the minimum structural properties and resistance to service environment assumed in the design. Extent of testing, if any, depends on available information about specific materials and processes to be used... [Pg.9]

Material and processing. As covered particularly in Chapters 6 and 7, the various material types and compositions as well as their processing methods, influence their properties including creep. When properly processed, in general crystalline materials have lower creep rates than the amorphous type, and RPs as a whole have significantly improved creep resistance. [Pg.74]

The basic concepts employed in early photolithography, both in materials and processing, have been extrapolated to modern lithographic technologies including x-ray and electron beam. In the remainder of this book we will discuss in detail the fundamental principles of chemistry and physics as they apply to the design and use of resist materials. [Pg.12]

In addition, there are four other resist-related criteria, viz., adhesion, shelf life, supply and quality assurance that must be taken into account. Lithographic performance with respect to these parameters is dictated and/or limited by the hardware, materials, and processing used to generate the requisite pattern as summarized in Table I. [Pg.164]

So why aren t today s engines made of ceramics The short answer is that, unlike metals, ceramics cannot bend and deform to absorb impacts. Intense research is currently under way to solve the problem of ceramic brittleness, with some success. Improved resistance to fracturing, for example, can be attained by careful quality control of starting materials and processing. As we shall see in the next section, brittleness can also be combated by compositing ceramics with other materials. [Pg.628]

Bi>m materials and proeatse mnm materials and processes Mask making resists... [Pg.29]

EUV materials ar d processes (UTR) Charged beam materials and processes Innovative beam materials and processes Mask making resists and processes... [Pg.29]

As already illustrated by a previous paper (5 ) on the structure of high modulus fibers, electron microscopy can be very successful when applied to these beam-resistant materials, and so constitutes an essential complement to x-ray studies. In the present work, electron diffraction coupled with BF and DF imaging has allowed detection of the best ordered zones within PBT fibers which illustrates the structure possibly obtainable by fiber processing refinement. The well ordered structures observed thus far compare rather well, with the exception of their fibrillar texture, to the structure of PPT high-modulus fibers. The two dimensional character of the crystallites is likely due to the freedom of axial translation of the molecules. Future work should determine if this feature is a direct consequence of the chemical structure of the PBT molecule or is simply the result of non-optimized processing conditions. [Pg.314]

Whisker-reinforced glass-ceramic matrices are expected to find several applications in automotive components, metal forming, cutting tools, etc., due to their low thermal expansion, high thermal shock resistance, high reliability and low material and processing costs. Some industrial applications for continuous fibre-reinforced ceramic matrix composites (CMCs) are listed below. [Pg.94]

The parameters which affect the spread of both capacitance and parallel resistance values are material and process variability, temperature gradient in the module, aging state, etc. [Pg.442]

Before examining his reasoning, we should remind ourselves of the Example 9 in which the drag resistance, F, of a ship s hull was treated. It has been pointed out that its dependence on the geometric, material and process related parameters can be represented by... [Pg.201]


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