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Polyimides aromatic heterocyclic

A relatively large quantity (approximately 200 gm) of an aromatic heterocyclic material was available and was used to develop a fracture test method that could be used to characterize materials limited in available quantities. This material is an acetylene-terminated polyimide, known as Thermid 600, which has the molecular structure shown in Figure 1. Although the material is a bit difficult to work with in the 100% solid form, this form was used to fabricate specimens. Cure kinetics and rheological data were measured and used to guide specimen fabrication. [Pg.246]

Aromatic, heterocyclic polyimides (Figure 6.20) have outstanding mechanical properties and thermal-oxidative stabilities. They are mostly used for high performance applications in place of metals and glass. Howeveg they have one disadvantage their price is rather high. [Pg.222]

Polyimide fiber is made from an aromatic heterocyclic polymer, and P84 is the brand name of the polyimides manufactured by Evonik Fibers with a trilobal fiber cross section (Fig. 2.25). P84 is a fully imidized polyimide derived from aromatic dianhydrides and aromatic diisocyanates and has a glass transition temperature of 315°C. The fibers start to carbonize at temperatures beyond 370°C. Due to the aromatic structure, the polymer and fibers are inherently nonflammable. An FOl of 38% can be measured. P84 can be used for temperatures up to 260°C, depending on the environment [71]. Typical properties of P84 are introduced in Table 2.67. [Pg.87]

The acetylenic biphenyl moiety was incorporated into the polymer backbone of two aromatic heterocyclic systems, the polyphenylquinoxaline and aromatic polyimide. The introduction was carried out via the amino monomers, 2,2 -bis(phenylethynyl)-U,U, 5,5 -tetraminobiphenyl and 2,2 -bis(phenylethynyl)-5,5 -diaminobiphenyl. The IMG type of reaction depends only upon a rotational movement of the polymer backbone which requires substantially less molecular mobility than the translational movement needed for the intermolecular cure. Therefore, the curing reaction can continue to completion long after the resin is essentially vitrified, and the resultant use temperature should be substantially higher than the cure temperature. [Pg.243]

Polyimides were developed during the 1960s and early 1970s in response to the demands of the aerospace industry for high temperature performance polymers, as matrix materials for laminates and other composites. Most aromatic/heterocyclic polymer systems that have a small number of oxidisable C-H bonds per molecule exhibit excellent oxidative stability, but tend to be intractible and extremely difficult to process. In the case of polyimides, however, this limitation has been largely overcome. Some of the materials now in use for structural applications can withstand continuous exposures in air to temperatures above 300°C (approximately 600°F). [Pg.298]

Thermosetting polyimides are commercially available as uncured resins, thin sheets, and laminates. Thermoplastic polyimides are very often called pseudothermoplastic. There are two general types of polyimides. One type is linear polyimides which are made by combining imides into long chains. Aromatic heterocyclic polyimides are the other usual kind, where R and R" are two carbon atoms of an aromatic ring. Examples of polyimide films include Apical, Kapton, and Kaptrex. Polyimide parts and shapes include Meldin, Vespel, and Plavis. Polyimides have been in mass production since 1955. [Pg.832]

Compared with epoxy adhesives, polyimides share a very small part of the global market, limited to military, aerospace, and geothermal applications requiring long-term stability at elevated temperatures. Owing to their aromatic heterocyclic structure, virtually all polyimides are stable at 300 °C. When loaded with inorganic particles such as alumina, silica, silicon nitride, or aluminum, the thermal stability is still better. By contrast, some metals used in the composition of conductive adhesives, in particular silver and nickel, dramatically decrease the thermal resistance. This means that the adhesive strength of most polyimides is excellent at 200 °C,... [Pg.274]

A considerable number of non-cross-linked aromatic and heterocyclic polymers has been produced. These include polyaromatic ketones, aromatic and heterocyclic polyanhydrides, polythiazoles, polypyrazoles, polytriazoles, poly-quinoxalines, polyketoquinolines, polybenzimidazoles, polyhydantoins, and polyimides. Of these the last two have achieved some technical significance, and have already been considered in Chapters 21 and 18 respectively. The most important polyimides are obtained by reacting pyromellitic dianhydride with an aromatic diamine to give a product of general structure (Figure 29.17). [Pg.847]

Polyimides are thermally stable, heterocyclic aromatic materials of desirable engineering properties. They are, however, insoluble. A typical mode of preparation1 18 11is given in Fig. 29 where reactants (a) as well as the polyamic acid or pyrrone prepolymers (b) are maintained in solution. [Pg.191]

As aromatic compounds have been exhausted as building blocks for life science products, A-heterocyclic structures prevail nowadays. They are found in many natural products, such as chlorophyll hemoglobin and the vitamins biotin (H), folic acid, niacin (PP), pyridoxine HCl (Be), riboflavine (B2), and thiamine (Bi). In life sciences 9 of the top 10 proprietary drugs and 5 of the top 10 agrochemicals contain A-heterocycIic moieties (see Tables 11.4 and 11.7). Even modern pigments, such as diphenylpyrazolopyrazoles, quinacri-dones, and engineering plastics, such as polybenzimidazoles, polyimides, and triazine resins, exhibit an A-heterocydic structure. [Pg.24]

Considerable research effort has been devoted in recent years to the use of chloral derivatives for the synthesis of linear heterocyclic polymers. Of these, the most common are aromatic polyimides [1-12], Many of these polymers have been synthesised from compounds like 4,4 -diaminobenzophenone, and other diamines, which, as demonstrated in the previous chapter, can be obtained from chloral. Polyimides prepared from these diamines were largely synthesised by the conventional two-step procedure [11, 12] involving mild reaction of the diamines with the bis(phthalic)anhydrides, isolation of poly(o-carboxy)amide (PCA) prepolymers, and then processing into products followed by thermal or chemical imidisation [13—16] (Scheme 3.1). Some properties of polyimides prepared from 4,4 -diaminobenzophenone are provided in Table 3.1. [Pg.15]

Structural modifications to attain soluble aromatic polyimides have also been carried out by introducing bulky substituents, aryl or heterocyclic rings. One of the first references to this approach was made by Korschak and Rusanov, who synthesized soluble aromatic polyimides containing side phthalimide groups [85 ]. More recent work by Rusanov et al. has enriched this topic with new soluble polyimides containing pendent imide groups [86,87]. [Pg.40]

In recent years, remarkable progress has been made in the syntheses of aromatic and heterocyclic polymers to search a new type of radiation resistant polymers. Sasuga and his coworkers extensively investigated the radiation deterioration of various aromatic polymers at ambient temperature [55-57] and reported the order of radiation resistivity evaluated from the changes in tensile properties as follows polyimide > polyether ether ketone > polyamide > polyetherimide > polyarylate > polysulfone. [Pg.128]

Aromatic polyimides have glass transition temperatures in excess of 400 °C, excellent toughness and elongation properties and dielectric constants comparable to that of inorganic dielectrics, about 3.5. An important feature relative to these applications is their ability to planarize the topography when spun on as the soluble precursor polyamic acid. The subsequent intramolecular condensation reaction to form the heterocyclic imide is typically a thermal "curing" process. [Pg.30]

The polyimide molecule consists of heterocyclic rings bracketed by aromatic rings resulting in a stable, rigid construction which will withstand temperatures up to 600°C. As a result of this high temperature, films are made by a solvent process, which also involves the final stages of a reaction. It is an expensive material. [Pg.197]

Cold wall heats of ablation values ranged between 7700 and 13,800 Btu/lb. The best performance was obtained with the heterocyclic polyimide and polybenzimidazole and the aromatic polyphenylene resins, all of which exceed the heat of ablation for the widely used phenol formaldehyde (phenolic) resin. The superior charring characteristics of these polymers contributed greatly to their high heats of ablation. The various plastic materials, with their inherently low thermal conductivities, greatly restricted the flow of heat from the surface region into the specimen substrate. [Pg.601]

Many polymers with enhanced heat stability can be prepared simply by direct condensation. These aromatic polymers often contain a heterocyclic unit. The materials are high melting, somewhat infusible, and usually low in solubility. Many aromatic polyimides belong here. Polyimides, as a separate class of polymers, were discussed in an earlier section, because many are common commercial niaterials. On the other hand, the materials described in this section might be considered special and, perhaps, at this point, still too high priced for common usage. [Pg.364]

The novel polymers (end of 1960s and early 1970s) belong mostly to the HT group and their overall utility is limited. Many appear as special fibers, like aromatic polyamides and polyesters, polyimides and Parylene. The novel structures have rings (either aromatic or heterocyclic), in the main chain (para-phenylene is preferred over meta-phenylene). Substituting C—H bonds... [Pg.186]


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See also in sourсe #XX -- [ Pg.22 , Pg.507 ]




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Aromatic polyimide

Aromatic polyimides

Aromaticity aromatic heterocycles

Aromaticity heterocyclics

Heterocycles aromatic

Heterocycles aromatization

Heterocyclic aromatics

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