Polyimides poly

VDP Polyimides. Polyimide films have also been prepared by a kind of VDP (16). The poly(amic acid) layer is first formed by the coevaporation and condensation of two monomers, followed by copolymerization on the substrate. The imidization is carried out in a separate baking step (see POLYIMIDES). 

Polyimide. Polyimide is a biaxiaHy oriented high performance film that is tough, flexible, and temperature- and combustion-resistant. Its room temperature properties compare to poly(ethylene terephthalate), but it retains these good characteristics at temperatures above 400°C. Its electrical resistance is good and it is dimensionally stable. The principal detriment is fairly high moisture absorbance. The main uses are for electrical insulation, particularly where high temperatures are prevalent or ionizing radiation is a problem. The films may be coated to reduce water absorption and enhance... 

BiaxiaHy oriented films have excellent tensile strength properties and good tear and impact properties. They are especially well regarded for their brilliance and clarity. Essentially all poly(ethylene terephthalate) film is biaxiaHy oriented, and more than 80% of polypropylene film is biaxiaHy oriented. Polystyrene film is oriented, and a lesser amount of polyethylene, polyamide, poly(vinyl chloride), and other polymers are so processed. Some of the specialty films, like polyimides (qv), are also oriented. 

Synthesis and Properties. Several methods have been suggested to synthesize polyimides. The predominant one involves a two-step condensation reaction between aromatic diamines and aromatic dianhydrides in polar aprotic solvents (2,3). In the first step, a soluble, linear poly(amic acid) results, which in the second step undergoes cyclodehydration, leading to an insoluble and infusible PL Overall yields are generally only 70—80%. 

In addition to carbon and glass fibers ia composites, aramid and polyimide fibers are also used ia conjunction with epoxy resias. Safety requirements by the U.S. Federal Aeronautics Administration (FAA) have led to the development of flame- and heat-resistant seals and stmctural components ia civiUan aircraft cabias. Wool blend fabrics containing aramids, poly(phenylene sulfide), EDF, and other inherently flame-resistant fibers and fabrics containing only these highly heat- and flame-resistant fibers are the types most frequently used ia these appHcations. 

Other Polymers. Besides polycarbonates, poly(methyl methacrylate)s, cycfic polyolefins, and uv-curable cross-linked polymers, a host of other polymers have been examined for their suitabiUty as substrate materials for optical data storage, preferably compact disks, in the last years. These polymers have not gained commercial importance polystyrene (PS), poly(vinyl chloride) (PVC), cellulose acetobutyrate (CAB), bis(diallylpolycarbonate) (BDPC), poly(ethylene terephthalate) (PET), styrene—acrylonitrile copolymers (SAN), poly(vinyl acetate) (PVAC), and for substrates with high resistance to heat softening, polysulfones (PSU) and polyimides (PI). 

A variety of cellular plastics exists for use as thermal iasulation as basic materials and products, or as thermal iasulation systems ia combination with other materials (see Foamed plastics). Polystyrenes, polyisocyanurates (which include polyurethanes), and phenoHcs are most commonly available for general use, however, there is increasing use of other types including polyethylenes, polyimides, melamines, and poly(vinyl chlorides) for specific appHcations. 

The newer open-ceU foams, based on polyimides (qv), polyben2imida2oles, polypyrones, polyureas, polyphenylquinoxalines, and phenoHc resins (qv), produce less smoke, are more fire resistant and can be used at higher temperatures. These materials are more expensive and used only for special appHcations including aircraft and marine vessels. Rigid poly(vinyl chloride) (PVC) foams are available in small quantities mainly for use in composite panels and piping appHcations (see Elame retardants Heat-RESISTANTPOLYA rs). 

The two-step poly(amic acid) process is the most commonly practiced procedure. In this process, a dianhydride and a diamine react at ambient temperature in a dipolar aprotic solvent such as /V,/V-dimethy1 acetamide [127-19-5] (DMAc) or /V-methy1pyrro1idinone [872-50-4] (NMP) to form apoly(amic acid), which is then cycHzed into the polyimide product. The reaction of pyromeUitic dianhydride [26265-89-4] (PMDA) and 4,4 -oxydiani1ine [101-80-4] (ODA) proceeds rapidly at room temperature to form a viscous solution of poly(amic acid) (5), which is an ortho-carboxylated aromatic polyamide. 

Polymerization by Transimidization Reaction. Exchange polymerization via equihbrium reactions is commonly practiced for the preparation of polyesters and polycarbonates. The two-step transimidization polymerization of polyimides was described in an early patent (65). The reaction of pyromellitic diimide with diamines in dipolar solvents resulted in poly(amic amide)s that were thermally converted to the polyimides. High molecular weight polyimides were obtained by employing a more reactive bisimide system (66). The intermediate poly(amic ethylcarboamide) was converted to the polyimide at 240°C. 

Pubhcations on curing polymers with TAIC include TEE—propylene copolymer (135), TEE—propylene—perfluoroaHyl ether (136), ethylene—chlorotrifluoroethylene copolymers (137), polyethylene (138), ethylene—vinyl acetate copolymers (139), polybutadienes (140), PVC (141), polyamide (142), polyester (143), poly(ethylene terephthalate) (144), sdoxane elastomers (145), maleimide polymers (146), and polyimide esters (147). 

Cycloahphatic diamines react with dicarboxyUc acids or their chlorides, dianhydrides, diisocyanates and di- (or poly-)epoxides as comonomers to form high molecular weight polyamides, polyimides, polyureas, and epoxies. Polymer property dependence on diamine stmcture is greater in the linear amorphous thermoplastic polyamides and elastomeric polyureas than in the highly crosslinked thermo set epoxies (2—4). 

Other organic—inorganic hybrids include poly(ethyloxazoline)—siUca, poly(vinyl alcohol)—siUca, poly(arylene ether) ketone—siUca, polyimide—siUca, polyozoline—sihca, poly(ethylene oxide)—siUca, and polymers—modified alkoxysilane. 

Fig. 1. Engineering resins cost vs annual volume (11) (HDT, °C) A, polyetheretherketone (288) B, polyamideimide (>270) C, polyarylether sulfone (170- >200) D, polyimide (190) E, amorphous nylons (124) F, poly(phenylene sulfide) (>260) G, polyarylates (170) H, crystalline nylons (90—220) I, polycarbonate (130) J, midrange poly(phenylene oxide) alloy (107—150) K, polyphthalate esters (180—260) and L, acetal resins (110—140).

Other Polyimides. In 1979, Rohm Haas introduced Kamax resin, which was thought to be an /V-methylamine imidization product of poly(methyl methacrylate) (118). The product was then withdrawn, but was reintroduced in the late 1980s. The partly imidized resins are similar to poly(methyl methacrylate) but have a higher glass-transition temperature. 

The melt viscosity of a polymer at a given temperature is a measure of the rate at which chains can move relative to each other. This will be controlled by the ease of rotation about the backbone bonds, i.e. the chain flexibility, and on the degree of entanglement. Because of their low chain flexibility, polymers such as polytetrafluoroethylene, the aromatic polyimides, the aromatic polycarbonates and to a less extent poly(vinyl chloride) and poly(methyl methacrylate) are highly viscous in their melting range as compared with polyethylene and polystyrene. 

The presence of the either linkages is sufficient to allow the material to be melt processed, whilst the polymer retains many of the desirable characteristics of polyimides. As a consequence the material has gained rapid acceptance as a high-temperature engineering thermoplastics material competitive with the poly-sulphones, poly(phenylene sulphides) and polyketones. They exhibit the following key characteristics ... 

A considerable number of non-cross-linked aromatic and heterocyclic polymers has been produced. These include polyaromatic ketones, aromatic and heterocyclic polyanhydrides, polythiazoles, polypyrazoles, polytriazoles, poly-quinoxalines, polyketoquinolines, polybenzimidazoles, polyhydantoins, and polyimides. Of these the last two have achieved some technical significance, and have already been considered in Chapters 21 and 18 respectively. The most important polyimides are obtained by reacting pyromellitic dianhydride with an aromatic diamine to give a product of general structure (Figure 29.17). 

Over the years polymers have been produced suitable for use at progressively higher temperatures. Where this is a requirement, it is usual first to decide whether a rubbery or a rigid material is required. If the former, this has been dealt with by the author elsewhere." If the latter, it is usually convenient to look in turn at polycarbonates, PPO-based materials, polyphenylene sulphides, polysul-phones, polyketones such as PEEK and PEK, polyamide-imides, poly-phthalamides, fluoropolymers, liquid crystal polymers and polyimides. 

Poly(ethylene terephtlhalate) Phenol-formaldehyde Polyimide Polyisobutylene Poly(methyl methacrylate), acrylic Poly-4-methylpentene-1 Polyoxymethylene polyformaldehyde, acetal Polypropylene Polyphenylene ether Polyphenylene oxide Poly(phenylene sulphide) Poly(phenylene sulphone) Polystyrene Polysulfone Polytetrafluoroethylene Polyurethane Poly(vinyl acetate) Poly(vinyl alcohol) Poly(vinyl butyral) Poly(vinyl chloride) Poly(vinylidene chloride) Poly(vinylidene fluoride) Poly(vinyl formal) Polyvinylcarbazole Styrene Acrylonitrile Styrene butadiene rubber Styrene-butadiene-styrene Urea-formaldehyde Unsaturated polyester... 

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