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Oxidation technologies, silicon

Many of the materials used in the most advanced technologies are made from one of the oldest known materials, common clay. Most clays used commercially are oxides of silicon, aluminum, and magnesium. China clay contains primarily kaoli-nite, a form of aluminum aluminosilicate that can be obtained reasonably free of the iron impurities that make many clays look reddish brown, and so it is white. However, other clays contain the iron oxides that cause the orange color of terra cotta tiles and flower pots. [Pg.736]

Appels JA, Kooi E, Paffen MM, Schatorje JJH, Verkuylen WHCG. Local oxidation of silicon and its application in semiconductor-device technology. Phil Res Rep 1970 25 118-132. [Pg.366]

CMOS Complementary metal oxide (on) silicon a chip fabrication technology that layers metal oxides and silicon to create logic devices with low power consumption and moderate switching speeds. [Pg.284]

Numerous ceramics are deposited via chemical vapor deposition. Oxide, carbide, nitride, and boride films can all be produced from gas phase precursors. This section gives details on the production-scale reactions for materials that are widely produced. In addition, a survey of the latest research including novel precursors and chemical reactions is provided. The discussion begins with the mature technologies of silicon dioxide, aluminum oxide, and silicon nitride CVD. Then the focus turns to the deposition of thin films having characteristics that are attractive for future applications in microelectronics, micromachinery, and hard coatings for tools and parts. These materials include aluminum nitride, boron nitride, titanium nitride, titanium dioxide, silicon carbide, and mixed-metal oxides such as those of the perovskite structure and those used as high To superconductors. [Pg.168]

Planar processing technology derives its success from the ability to grow high quality, passivating insulators on the semiconductor surface. This is particularly true in the case of silicon technology, where the thermal oxidation of silicon in oxygen and/or steam at 1000°-1200°C is used almost exclusively to... [Pg.178]

The abbreviation LOCOS stands for local oxidation of silicon, in which selective areas on a wafer are oxidized for electrical insulation purposes in semiconductor technology. This process is used for isolating two adjacent devices with a feature size of greater than 0.25 pm. [Pg.1587]

Jun K (2011) Iron-oxide catalyzed silicon photoanode for water splitting. Thesis (PhD) Massachusetts Institute of Technology, Department of Mechanical Engineering, pp 130-139... [Pg.60]

These results demonstrate some interesting chemical principles of the use of acrylic adhesives. They stick to a broad range of substrates, with some notable exceptions. One of these is galvanized steel, a chemically active substrate which can interact with the adhesive and inhibit cure. Another is Noryl , a blend of polystyrene and polyphenylene oxide. It contains phenol groups that are known polymerization inhibitors. Highly non-polar substrates such as polyolefins and silicones are difficult to bond with any technology, but as we shall see, the initiator can play a big role in acrylic adhesion to polyolefins. [Pg.824]

Chemical vapor deposition (C VD) is a versatile process suitable for the manufacturing of coatings, powders, fibers, and monolithic components. With CVD, it is possible to produce most metals, many nonmetallic elements such as carbon and silicon as well as a large number of compounds including carbides, nitrides, oxides, intermetallics, and many others. This technology is now an essential factor in the manufacture of semiconductors and other electronic components, in the coating of tools, bearings, and other wear-resistant parts and in many optical, optoelectronic and corrosion applications. The market for CVD products in the U.S. and abroad is expected to reach several billions dollars by the end of the century. [Pg.25]

It is very clear that silicon is one of the most important materials in modern technologies, especially in electronics. Silicon is also one of most common element on the earth. Silicon surface is readily oxidized under ambient condition. A silicon substrate is covered by a silica (SiO c) layer. This silica layer can be controlled easily by chemical reagents, heating, electrochemical treatment, and so on. [Pg.456]

This demand for new devices initiated worldwide research and development programs in the field of "sensors and actuators". Many generic sensor technologies were examined, from which the thin- and thick-film, glass fiber, metal oxides, polymers, quartz and silicon technologies are the most prominent. [Pg.406]

Use of 29Si NMR can generally be avoided in favour of 1II NMR. For example, Narayan et al. [253] have used proton NMR for the detection of a HALS stabiliser based on silicon technology, after extraction from a PP matrix. 170 1-NMR and s-NMR have been used for the study of PP, EPDM, PIP and NR oxidatively degraded with enriched 02 [204,254]. [Pg.336]

One of the most important interfaces in semiconductor technology is the Si02/Si interface, whose properties determine the operation of metal-oxide-silicon (MOS) devices. Hydrogen is believed to play an important... [Pg.212]


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See also in sourсe #XX -- [ Pg.43 ]




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Oxidation silicones

Oxidation technologies

Oxides silicon oxide

Oxidized silicon

Silicon oxidation

Silicon oxides

Silicon technology

Silicon-processing technology oxides

Silicone technology

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