Nitride aluminum nitride

Special Refractories.— Under certain conditions refractories of special qualities may be employed such as zirconium oxide, zirconium silicate, chromite, fused silica, boron nitride, aluminum nitride, lime, beryllium oxide, cerium dioxide, thoria, asbestos and various synthetic combinations. 

Boron nitride Aluminum nitride Alumina Staystik 1172 Staystik 682 TP 8550 AI Technology 8.0-10.0 1.0-1.5 6.4... 

Nitride, Aluminum Nitride and Composite Powders Based on these Nitrides, PhD Thesis, Chernogolovka. 

Strite, S.C. Ill (1993) Investigation of the Gallium Nitride, Aluminum Nitride and Indium Nitride Semiconductors Structural, Optival, Electronic and Interfacial Properties, UMI Company, 118. 

Nitrides Aluminum Nitride (AIN) 2xl0ll-10l room temp. 

Nitrides Aluminum Nitride (AIN) (thick film) (thin film) Mohs 5 5.5 Knoop lOOg 1225 1230 kg/mm Rockwell 15N 94.5 Rockwell 15N 94.0... 

Although some of these saltlike nitrides have high melting points (for instance, thorium nitride 2820"C uranium nitride 2800°C plutonium nitride 2550 beryllium nitride 2200 C barium nitride 2200"C), they are sensitive to hydrolysis and react readily with water or moisture to give ammonia and the corresponding metal oxide or hydroxide. Consequently, they do not meet the refractory requirements as interpreted here. Some of these nitrides are useful industrial materials particularly as sintering additives for the production of silicon nitride, aluminum nitride, and cubic boron nitride (see Ch. 14). 

The previous chapter was a review of the structure and composition of the three refractory covalent nitrides boron nitride, aluminum nitride, and silicon nitride. This chapter is an assessment of the properties and a suimnary of the fabrication processes and applications of these three materials. 

Until recently, the great majority of ceramic fibers were made from oxides such as alumina or mullite. But in the last few years, much woric has been done to develop practical processes for the production of other fiber materials, especially the refr actory carbides and nitrides. This work is beginning to bear results especially with silicon carbide fibers vt4iich have now reached full-scale production. Other materials such as silicon nitride, boron nitride, aluminum nitride, titanium carbide, hafriium carbide, and hafiiium nitride are at die development stage or in pre-production.l d... 

Four materials play an increasingly important part in the design of advanced electronic and optical products titanium nitride, silicon nitride, aluminum nitride, and silicon carbide. These materials have contributed to a sizeable extent to the dramatic progress of the semiconductor and optical industries in the last few years. The major applications are as follows. 

Aluminum Nitride. Aluminum nitride multilayer circuits are formed by combining AIN powder with yttria or calcium oxide. Glass may also be added. Sintering may be accomplished in three ways ... 

Like silicon nitride, aluminum nitride is not easy to sinter. The high covalent bonding character (60% covalent-40% ionic (13)) of AIN limits the atomic mobility and prevents complete densi-fication. The condition of the starting materials—purity, particle size, particle-size distribution, oxygen content and specific surface area—influences the sinterability and properties of AIN ceramics (14). 

Evans R, Smith I, Munz W D, Williams K J P and Yanwood J 1996 Raman microscopic studies of ceramic coatings based on titanium aluminum nitride ICORS 96 XVth Int. Conf. on Raman Spectroscopy ed S A Asher and P B Stein (New York Wiley) pp 596-7... 

ALUMDIUMCOMPOUNDS - ALUMINIUMOXIDE(ALUMINA) - CALCINED, TABULAR, AND ALUMINATE CETffiNTS] (Vol 2) -aluminum nitride for [NITRIDES] (Vol 17)... 

Metal powder—glass powder—binder mixtures are used to apply conductive (or resistive) coatings to ceramics or metals, especially for printed circuits and electronics parts on ceramic substrates, such as multichip modules. Multiple layers of aluminum nitride [24304-00-5] AIN, or aluminay ceramic are fused with copper sheet and other metals in powdered form. The mixtures are appHed as a paste, paint, or slurry, then fired to fuse the metal and glass to the surface while burning off the binder. Copper, palladium, gold, silver, and many alloys are commonly used. 

The nitrides of Groups 4(IVB) and 5(VB) elements form at ca 1200°C. The nitrides of magnesium and aluminum form at 800°C. Aluminum nitride, obtained by beating aluminum powder in the presence of ammonia or nitrogen at 800—1000°C, is formed as a white to grayish blue powder. A grade of... 

Annual production of aluminum nitride is 50—100 t and it is sold for ca 40/kg. Extra high purity, ie, high heat conductive aluminum nitride, is sold... 

Materials used for substrates can be broadly classified into ceramics and metals. Gommonly used ceramics, ie, alumina, aluminum nitride, and beryUia, can be easily incorporated into a hermetic package, ie, a package permanently sealed by fusion or soldering to prevent the transmission of moisture, air, and other gases. 

Although beryllium oxide [1304-56-9] is in many ways superior to most commonly used alumina-based ceramics, the principal drawback of beryUia-based ceramics is their toxicity thus they should be handled with care. The thermal conductivity of beryUia is roughly about 10 times that of commonly used alumina-based materials (5). BeryUia [1304-56-9] has a lower dielectric constant, a lower coefficient of thermal expansion, and slightly less strength than alumina. Aluminum nitride materials have begun to appear as alternatives to beryUia. Aluminum nitride [24304-00-5] has a thermal conductivity comparable to that of beryUia, but deteriorates less with temperature the thermal conductivity of aluminum nitride can, theoreticaUy, be raised to over 300 W/(m-K) (6). The dielectric constant of aluminum nitride is comparable to that of alumina, but the coefficient of thermal expansion is lower. 

Magnesium reacts slowly at lower temperatures to give the amide, as do all active metals this reaction is catalyzed by transition metal ions. Aluminum nitride [24304-00-5] AIN, barium nitride [12047-79-9] Ba2N2, calcium nitride [12013-82-0] Ca2N2, strontium nitride [12033-82-8], Sr2N2, and titanium nitride [25583-20-4], TiN, may be formed by heating the corresponding amides. 

Table 3 summarizes the properties of the so-called nonmetallic hard materials, including diamond and the diamondlike carbides B C, SiC, and Be2C. Also iacluded ia this category are comadum, AI2O2, cubic boroa nitride, BN, aluminum nitride, AIN, siUcon nitride, Si N, and siUcon boride, SiB (12). 

Next to Cr C2, TiC is the principal component for heat and oxidation-resistant cemented carbides. TiC-based boats, containing aluminum nitride, AIN, boron nitride, BN, and titanium boride, TiB2, have been found satisfactory for the evaporation of metals (see Boron compounds, refractory boron compounds Nitrides). 

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