Hybrid electronic packaging

Markstein, H.W., Firing thick film hybrids. Electronic Packaging and Production, Vol. 26, No. 9, 30-32, September 1986. 

X Priest, E. Xacobs, C. Smith, P. DuBois, B. Holt, and B. Hammerschlag, Liquid metal-jetting technology application issues for hybrid technology. International Journal of Microcircuits and Electronic Packaging, 15(3) (1994) 2X9-221. 

Unno Y. High density, low-mass hybrid and associated technologies, Proc. Sixth Workshop on Electronics for LHC Experiments, Krakow, Poland (Sep. 2000) Japan Institute of Electronic Packaging (JIEP) Dictionary of Electronic Packaging Technology, ISBN 4-7693-7089-X 63555. 

Takahashi A, Satsu Y, Nagai A, Umino M and Nakamura Y (2005), Heat-resistant epoxy-silicon hybrid materials for printed wiring boards , IEEE Trans Electron Packag Manuf 28, 163-167. doi 10.1109/TEPM.2005.846831. 

Ohsaki, T. 1991. Electronic packaging in the 1990s The perspective from Asia. IEEE Trans. Comp., Hybrids, and Manuf Technol. 14(2) 254-261. 

Anon., Software Enables Screen Printer to Communicate with Pick-and-Place Machine, Hybrid Circuit Technology, Vol. 7, No. 2, February 1990, pp. 23-24. Hall, S., Screen Printer Requirements for Low Defect Process Capability, Electronic Packaging and Production, Vol. 34(Suppl.), August 1994, pp. 4-6. 

Krum, A. and Greiner, S., Selecting a Substrate Technology for Power Hybrid Applications, in Electronic Packaging and Production, May, 1992, pp. 54—57. Nguyen, N.B., Adoption of advanced materials in hybrid packaging technique for ultra high power semiconductor devices, in International Symposium on Microelectronics, San Francisco, CA, 1992. 

Ceramic capacitors are fabricated in four general processes thin-fihn, thick-film, single layer, and multilayer. Thin-fihn capacitors were developed out of a need to embed passive components into electronic packaging in hybrid circuits. Dielectrics such as SiO, SiOj, Ta20j, Ti02, titanates, and aluminosihcates can be vacuum deposited with a variety of electrode metallizations. 

S. Fuchs and P. Barnwell, A Review of Substrate Materials for Power Hybrid Circuits, MAPS Journal of Microcircuits and Electronic Packaging, vol. 20, no. 1, 1st quarter, 1997. 

Materials classified as thick-film conductors play a major role in hybrid microelectronics, electronic packaging, components, displays, and photovoltaic apphcalions. Generally speaking, the functionality of thick film conductors is analogous to wiring in predecessor technologies. 

Several review articles, emphasizing electro-optic properties of liquid crystals are available R. A. Soref, Liquid Crystal Light Control Experiments, in The Physics of Opto-Electronic Materials, ed. W. A. Albers, Jr., Plenum Press, New York (1971) A. Sussman, Electro-Optic Liquid Crystal Devices Principles and Applications, IEEE Trans. Parts, Hybrids, and Packaging, Vol. PHP8, p. 24 (1972) and A. Sussman, Liquid Crystals in Display Systems, in Liquid Crystalline Systems, ed. G. W. Gray and P. A. Winsor, Ellis Norwood, London (in press). 

Presentiy, multilayer capacitors and packaging make up more than half the electronic ceramics market. For multilayer capacitors, more than 20 biUion units are manufactured a year, outnumbering by far any other electronic ceramic component. Multilayer ceramics and hybrid packages consist of alternating layers of dielectric and metal electrodes, as shown in Figures 5 and 6, respectively. The driving force for these compact configurations is miniaturization. 

Majid, N. Dabral, S. McDonald, J. F., The parylene aluminum multilayer interconnection system for wafer scale integration and wafer scale hybrid packaging, J. Electron. Mater. 1989, 18, 301 311... 

An inexpensive access to electron correlation is provided by density functional and hybrid functional techniques. A range of these techniques is implemented in quantum chemistry packages such as Gaussian [193]. They... 

The electronic structure calculations were carried out using the hybrid density functional method B3LYP [15] as implemented in the GAUSSIAN-94 package [16], in conjunction with the Stevens-Basch-Krauss (SBK) [17] effective core potential (ECP) (a relativistic ECP for Zr atom) and the standard 4-31G, CEP-31 and (8s8p6d/4s4p3d) basis sets for the H, (C, P and N), and Zr atoms, respectively. 

Polymer-clay nanocomposites (PCN) are a class of hybrid materials composed of organic polymer matrices and organophilic clay fillers, introduced in late 1980s by the researchers of Toyota (Kawasumi, 2004). They observed an increase in mechanical and thermal properties of nylons with the addition of a small amount of nano-sized clays. This new and emerging class of pol miers has found several applications in the food and non-food sectors, such as in constmction, automobiles, aerospace, military, electronics, food packaging and coatings, because of its superior mechanical strength, heat and flame resistance and improved barrier properties (Ray et al., 2006). 

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