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Ceramic capacitors

T. L. Rutt andJ. A. Syne, "Fabrication of Multilayer Ceramic Capacitor by Metal Impregnation," IEEE Trans. Parts Hybrids Packag., PHP-9, 144-147 (1973). [Pg.316]

Approximately 40% of the U.S. electronic ceramics industry is represented by ferroelectrics. Table 3 shows U.S. consumption of ceramic capacitors and piezoelectric materials (109). [Pg.209]

Table 3. U.S. Ceramic Capacitor and Ceramic Piezoelectric Material Consumption ... Table 3. U.S. Ceramic Capacitor and Ceramic Piezoelectric Material Consumption ...
Japanese suppHers generally dominate the electronic ceramic business. Japanese production of ferroelectric devices in the first nine months of 1990 was valued at 711 x 10 for ceramic capacitors and 353 x 10 for piezoelectric devices, representing growths of 7 and 10.8%, respectively, over the previous year. [Pg.209]

The most significant commercial product is barium titanate, BaTiO, used to produce the ceramic capacitors found in almost all electronic products. As electronic circuitry has been rniniaturized, demand has increased for capacitors that can store a high amount of charge in a relatively small volume. This demand led to the development of highly efficient multilayer ceramic capacitors. In these devices, several layers of ceramic, from 25—50 ]lni in thickness, are separated by even thinner layers of electrode metal. Each layer must be dense, free of pin-holes and flaws, and ideally consist of several uniform grains of fired ceramic. Manufacturers are trying to reduce the layer thickness to 10—12 ]lni. Conventionally prepared ceramic powders cannot meet the rigorous demands of these appHcations, therefore an emphasis has been placed on production of advanced powders by hydrothermal synthesis and other methods. [Pg.500]

Electronic Applications. The PGMs have a number of important and diverse appHcations in the electronics industry (30). The most widely used are palladium and mthenium. Palladium or palladium—silver thick-film pastes are used in multilayer ceramic capacitors and conductor inks for hybrid integrated circuits (qv). In multilayer ceramic capacitors, the termination electrodes are silver or a silver-rich Pd—Ag alloy. The internal electrodes use a palladium-rich Pd—Ag alloy. Palladium salts are increasingly used to plate edge connectors and lead frames of semiconductors (qv), as a cost-effective alternative to gold. In 1994, 45% of total mthenium demand was for use in mthenium oxide resistor pastes (see Electrical connectors). [Pg.173]

Other. Insoluble alkaline-earth metal and heavy metal stannates are prepared by the metathetic reaction of a soluble salt of the metal with a soluble alkah—metal stannate. They are used as additives to ceramic dielectric bodies (32). The use of bismuth stannate [12777-45-6] Bi2(Sn02)3 5H20, with barium titanate produces a ceramic capacitor body of uniform dielectric constant over a substantial temperature range (33). Ceramic and dielectric properties of individual stannates are given in Reference 34. Other typical commercially available stannates are barium stannate [12009-18-6] BaSnO calcium stannate [12013 6-6] CaSnO magnesium stannate [12032-29-0], MgSnO and strontium stannate [12143-34-9], SrSnO. ... [Pg.66]

Capacitors. Ceramic materials suitable for capacitor (charge storage) use are also dependent on the dielectric properties of the material. Frequently the goal of ceramic capacitors is to achieve maximum capacitance in minimum volume. The defining equation for capacitance is given by ... [Pg.342]

A high frequeney eapaeitor eould also be plaeed in parallel with the larger eapaeitors. This is beeause the aluminum eleetrolytie and tantalum eapaeitors eannot absorb the very high frequency current components being presented to them. A. 01 or. 1 pF ceramic capacitor is well suited for this purpose. [Pg.63]

It is unusual to be able to And one capacitor to handle the entire ripple current of the supply. Typically one should consider paralleling two or more capacitors (n) of I/n the capacitance of the calculated capacitance. This will cut the ripple current into each capacitor by the number of paralleled capacitors. Each capacitor can then operate below its maximum ripple current rating. It is critical that the printed circuit board be laid out with symmetrical traced to each capacitor so that they truly share the current. A ceramic capacitor ( 0.I pF) should also be placed in parallel with the input capacitor(s) to accommodate the high frequency components of the ripple current. [Pg.89]

The capacitors used for this function are high-voltage Aim or ceramic capacitors that exliibit very good high frequency characteristics. These capacitors... [Pg.89]

Yongyi Oh really I just changed a tiny ceramic capacitor—the one connected between the timing capacitor pin of the IC and the current sense pin. In fact I only reduced it from 47pF to 33pF Or maybe 22pF, I can t remember exactly, but a verrry minor change, sir. [Pg.25]

Don t Forget to Place that 0.1 flF Ceramic Capacitor Really Close to the IC... [Pg.64]

Single Ceramic Capacitor for Both Noise and Ripple ... [Pg.73]

Yes, we could simply place a high-frequency ceramic capacitor directly across the output to kill the noise appearing there. But remember, many switchers (like the BJT-based switcher family mentioned previously) are actually relying on some minimum ESR at the output to... [Pg.82]

In such cases, we could try to reduce the high-frequency output noise by suppressing it at the input. So that could be a valid reason to place a small ceramic capacitor at the input of an older-generation switcher IC (i.e., one with a BJT switch). Its primary purpose is then not to ensure that the control does not go into chaos because of switch transient noise, but to reduce the output noise in noise-sensitive applications. [Pg.83]

Most of the evaluation boards of such ESR-sensitive parts are shipped out to customers with only aluminum electrolytic or tantalum capacitors at their outputs. But what really happens is that the customer happily connects the eval board (rather expectantly) into his or her system, and completely forgets there are a bunch of ceramic capacitors all over the system board (for local decoupling at different points). In effect, the switcher can lose that valuable zero in its control loop and break into oscillations (see Figure 3-5). More so if the connecting leads are short. [Pg.83]

In this particular chapter, we will focus a great deal on ceramic capacitors since these have become extremely popular today. However, in commercial AC-DC power supplies, the aluminum electrolytic (or elko) is still king, so we will talk about that component too. Unfortunately, we will have to pretend none of the others even exist. We just don t have the space for all of them here. [Pg.94]

Figure 4-4 Cross-section of a Multilayer Ceramic Capacitor... Figure 4-4 Cross-section of a Multilayer Ceramic Capacitor...
In Table 4-2, we have the standard SMD component sizes. Note that usually, most pick and place machines cannot mount anything bigger than size 1515. So larger components may need to be hand-soldered. For ceramic capacitors, reliability requirements call for a certain... [Pg.109]


See other pages where Ceramic capacitors is mentioned: [Pg.310]    [Pg.209]    [Pg.65]    [Pg.128]    [Pg.433]    [Pg.482]    [Pg.307]    [Pg.342]    [Pg.173]    [Pg.58]    [Pg.773]    [Pg.64]    [Pg.64]    [Pg.70]    [Pg.72]    [Pg.72]    [Pg.73]    [Pg.73]    [Pg.75]    [Pg.76]    [Pg.83]    [Pg.95]    [Pg.97]    [Pg.108]    [Pg.108]    [Pg.110]    [Pg.110]    [Pg.113]   
See also in sourсe #XX -- [ Pg.10 , Pg.49 , Pg.55 , Pg.57 , Pg.58 , Pg.59 , Pg.60 , Pg.67 , Pg.68 , Pg.75 , Pg.79 , Pg.80 , Pg.81 , Pg.84 , Pg.93 , Pg.94 , Pg.98 , Pg.102 , Pg.103 , Pg.109 , Pg.120 , Pg.127 , Pg.128 , Pg.135 , Pg.136 , Pg.141 , Pg.144 , Pg.152 , Pg.175 , Pg.185 , Pg.186 , Pg.229 , Pg.230 , Pg.232 , Pg.242 , Pg.244 , Pg.257 , Pg.270 , Pg.271 , Pg.285 , Pg.289 ]

See also in sourсe #XX -- [ Pg.10 , Pg.49 , Pg.55 , Pg.57 , Pg.58 , Pg.59 , Pg.60 , Pg.67 , Pg.68 , Pg.75 , Pg.79 , Pg.80 , Pg.81 , Pg.84 , Pg.93 , Pg.94 , Pg.98 , Pg.102 , Pg.103 , Pg.109 , Pg.120 , Pg.127 , Pg.128 , Pg.135 , Pg.136 , Pg.141 , Pg.144 , Pg.152 , Pg.175 , Pg.185 , Pg.186 , Pg.229 , Pg.230 , Pg.232 , Pg.242 , Pg.244 , Pg.257 , Pg.270 , Pg.271 , Pg.285 , Pg.289 ]

See also in sourсe #XX -- [ Pg.10 , Pg.49 , Pg.55 , Pg.57 , Pg.58 , Pg.59 , Pg.60 , Pg.67 , Pg.68 , Pg.75 , Pg.79 , Pg.80 , Pg.81 , Pg.84 , Pg.93 , Pg.94 , Pg.98 , Pg.102 , Pg.103 , Pg.109 , Pg.120 , Pg.127 , Pg.128 , Pg.135 , Pg.136 , Pg.141 , Pg.144 , Pg.152 , Pg.175 , Pg.185 , Pg.186 , Pg.229 , Pg.230 , Pg.232 , Pg.242 , Pg.244 , Pg.257 ]

See also in sourсe #XX -- [ Pg.389 ]

See also in sourсe #XX -- [ Pg.906 ]

See also in sourсe #XX -- [ Pg.906 ]




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Barium multilayer ceramic capacitors

Capacitors

Ceramic capacitors additives

Ceramic capacitors barium titanate

Ceramic capacitors fabrication

Ceramic capacitors lead titanate

Ceramic capacitors materials

Ceramic capacitors perovskite

Clock stability with ceramic capacitors

Curie point/temperature for ceramic capacitors

Dissipation of ceramic capacitors

Multilayer Ceramic Capacitor

Multilayer ceramic capacitors titanate

Multilayered Ceramic Capacitors

Non-ceramic capacitors

Reliability of ceramic capacitors

Resonant frequency table for ceramic capacitor geometries

Single Ceramic Capacitor for Both Noise and Ripple

Voltage Coefficient of ceramic capacitors

Voltage rating of ceramic capacitors

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