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Dielectric high

Prepared from ethyne and ammonia or by dehydration of ethanamide. Widely used for dissolving inorganic and organic compounds, especially when a non-aqueous polar solvent of high dielectric constant is required, e.g. for ionic reactions. [Pg.11]

Another way of calculating the electrostatic component of solvation uses the Poisson-Boltzmann equations [22, 23]. This formalism, which is also frequently applied to biological macromolecules, treats the solvent as a high-dielectric continuum, whereas the solute is considered as an array of point charges in a constant, low-dielectric medium. Changes of the potential within a medium with the dielectric constant e can be related to the charge density p according to the Poisson equation (Eq. (41)). [Pg.365]

The final class of methods that we shall consider for calculating the electrostatic compone of the solvation free energy are based upon the Poisson or the Poisson-Boltzmann equatior Ihese methods have been particularly useful for investigating the electrostatic properties biological macromolecules such as proteins and DNA. The solute is treated as a body of co stant low dielectric (usually between 2 and 4), and the solvent is modelled as a continuum high dielectric. The Poisson equation relates the variation in the potential (f> within a mediu of uniform dielectric constant e to the charge density p ... [Pg.619]

Tables 1 and 2 Hst the important physical properties of formamide. Form amide is more highly hydrogen bonded than water at temperatures below 80°C but the degree of molecular association decreases rapidly with increa sing temperature. Because of its high dielectric constant, formamide is an excellent ionizing solvent for many inorganic salts and also for peptides, proteias (eg, keratin), polysaccharides (eg, cellulose [9004-34-6] starch [9005-25-8]) and resias. Tables 1 and 2 Hst the important physical properties of formamide. Form amide is more highly hydrogen bonded than water at temperatures below 80°C but the degree of molecular association decreases rapidly with increa sing temperature. Because of its high dielectric constant, formamide is an excellent ionizing solvent for many inorganic salts and also for peptides, proteias (eg, keratin), polysaccharides (eg, cellulose [9004-34-6] starch [9005-25-8]) and resias.
In addition to the obvious effect of high dielectric constant glasses on the capacitance of the circuit elements iato which they enter, their dielectric strengths maybe more important. Siace the amount of energy a capacitor can store varies as the first power of the dielectric constant and the second power of the voltage, a glass with twice the dielectric strength is as effective as one with four times the dielectric constant. [Pg.300]

Most glass-ceramics have low dielectric constants, typically 6—7 at 1 MHz and 20°C. Glass-ceramics comprised primarily of network formers can have dielectric constants as low as 4, with even lower values (K < 3) possible in microporous glass-ceramics (13). On the other hand, very high dielectric constants (over 1000) can be obtained from relatively depolymerized glasses with crystals of high dielectric constant, such as lead or alkaline earth titanate (11,14). [Pg.320]

Perovskites have the chemical formula ABO, where A is an 8- to 12-coordinated cation such as an alkaU or alkaline earth, and B is a small, octahedraHy coordinated high valence metal such as Ti, Zr, Nb, or Ta. Glass-ceramics based on perovskite crystals ate characteri2ed by their unusual dielectric and electrooptic properties. Examples include highly crystalline niobate glass-ceramics which exhibit nonlinear optical properties (12), as well as titanate and niobate glass-ceramics with very high dielectric constants (11,14). [Pg.325]

Sheet Miea. Good quahty sheet mica is widely used for many iadustrial appHcations, particularly ia the electrical and electronic iadustries, because of its high dielectric strength, uniform dielectric constant, low power loss (high power factor), high electrical resistivity, and low temperature coefficient (Table 6). Mica also resists temperatures of 600—900°C, and can be easily machined iato strong parts of different si2es and shapes (1). [Pg.291]

Alumina, or aluminum oxide [1344-28-17, has a thermal conductivity 20 times higher than that of most oxides (5). The flexural strength of commercial high alumina ceramics is two to four times greater than those of most oxide ceramics. The drawbacks of alumina ceramics are their relatively high thermal expansion compared to the chip material (siUcon) and their moderately high dielectric constant. [Pg.526]

Single-crystal sUicon has also been employed as substrate material, particularly in multichip module (MGM)-Si appUcations. As a substrate, sUicon offers good thermal conductivity and matches the GTE of the devices mounted on it it does, however, have a relatively high dielectric constant and is very britde. [Pg.526]


See other pages where Dielectric high is mentioned: [Pg.179]    [Pg.219]    [Pg.191]    [Pg.329]    [Pg.132]    [Pg.177]    [Pg.364]    [Pg.613]    [Pg.621]    [Pg.635]    [Pg.346]    [Pg.346]    [Pg.1014]    [Pg.218]    [Pg.85]    [Pg.80]    [Pg.207]    [Pg.131]    [Pg.241]    [Pg.365]    [Pg.385]    [Pg.389]    [Pg.507]    [Pg.512]    [Pg.290]    [Pg.290]    [Pg.320]    [Pg.322]    [Pg.374]    [Pg.533]    [Pg.72]    [Pg.324]    [Pg.325]    [Pg.327]    [Pg.328]    [Pg.329]    [Pg.203]    [Pg.483]    [Pg.499]    [Pg.528]    [Pg.532]   
See also in sourсe #XX -- [ Pg.365 ]




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