Fluorescence Auger electron spectroscopy

A popular electron-based teclmique is Auger electron spectroscopy (AES), which is described in section Bl.25.2.2. In AES, a 3-5 keV electron beam is used to knock out iimer-shell, or core, electrons from atoms in the near-surface region of the material. Core holes are unstable, and are soon filled by either fluorescence or Auger decay. In the Auger... 

Accompanying the photoemission process, electron reorganisation can result in the ejection of a photon (X-ray fluorescence) or internal electronic reorganisation leading to the ejection of a second electron. The latter is referred to as the Auger process and is the basis of Auger electron spectroscopy (AES). It was Harris at General Electric s laboratories at Schenectady, USA, who first realised that a conventional LEED experiment could be modified easily to... 

Auger electron spectroscopy Phosphorous/nitrogen-selective alkali/flame ionisation detector Atomic force microscopy Atomic fluorescence spectrometry All-glass heated inlet system... 

The interaction of an electron with an atom gives rise to two types of X-rays characteristic emission lines and bremsstrahlung. The atom emits element-characteristic X-rays when the incident electron ejects a bound electron from an atomic orbital. The core-ionized atom is highly unstable and has two possibilities for decay X-ray fluorescence and Auger decay. The first is the basis for electron microprobe analysis, and the second is the basis of Auger electron spectroscopy, discussed in Chapter 3. 

All analytical methods that use some part of the electromagnetic spectrum have evolved into many highly specialized ways of extracting information. The interaction of X-rays with matter represents an excellent example of this diversity. In addition to straightforward X-ray absorption, diffraction, and fluorescence, there is a whole host of other techniques that are either directly X-ray-related or come about as a secondary result of X-ray interaction with matter, such as X-ray photoemission spectroscopy (XPS), surface-extended X-ray absorption fine structure (SEXAFS) spectroscopy, Auger electron spectroscopy (AES), and time-resolved X-ray diffraction techniques, to name only a few [1,2]. 

GD-OES (glow discharge optical emission spectrometry) are applied. AES (auger electron spectroscopy), AFM (atomic force microscopy) and TRXF (transmission reflection X-ray fluorescence analysis) have been successfully used, especially in the semiconductor industry and in materials research. 

XRF = X-ray fluorescence spectroscopy, XPS = X-ray photoelectron spectroscopy, AES = Auger electron spectroscopy, XANES = X-ray absorption near edge spectroscopy, RAIR = Reflectance-absorbance infrared spectroscopy, EXAFS = X-ray absorption fine-structure spectroscopy, ECR = Electric contact resistance, NMR = Nuclear magnetic resonance spectroscopy, IPS = Imaging photoelectron spectromicroscopy. 

Acronyms abound in photoelectron and related spectroscopies but we shall use only XPS, UPS and, in Sections 8.2 and 8.3, AES (Auger electron spectroscopy), XRF (X-ray fluorescence) and EXAFS (extended X-ray absorption fine structure). In addition, ESCA is worth mentioning, briefly. It stands for electron spectroscopy for chemical analysis in which electron spectroscopy refers to the various branches of spectroscopy which involve the ejection of an electron from an atom or molecule. However, because ESCA was an acronym introduced by workers in the field of XPS it is most often used to refer to XPS rather than to electron spectroscopy in general. 

Hegde RI, Tobin J, Fiordalice RW, Travis EO (1993) Nucleation and growth of chemical vapor deposition TiN films on Si (100) as studied by total reflection X-ray fluorescence, atomic force microscopy, and Auger electron spectroscopy. J Vac Sci Technol A 11 1692-1695 Henderson MA (2002) The interaction of water with sohd surfaces fundamental aspects revisited. Surf. Sci. Rep. 46 1-308... 

X-ray induced Auger electron spectroscopy X-ray absorption near edge structure X-ray photoelectron spectroscopy X-ray diffraction X-ray fluorescence... 

Abstract Surface analyses have been one of the key technologies for corrosion control and surface finishing. It is very important that the most appropriate apparatus for the purpose of the analyses should be selected from various analytical techniques. In this chapter, surface analytical methods for corrosion control and surface finishing, such as X-ray fluorescence analysis (XRF), X-ray diffraction analysis (XRD), X-ray photo-electron spectroscopy (XPS), scanning electron microscopy (SEM), transmission electron microscopy (TEM), Auger electron spectroscopy (AES), Secondary ion mass spectrometry (SIMS), Rutherford back-scattering spectrometry (RBS), Surface-enhanced Raman spectroscopy (SERS), Fourier-transform infrared spectroscopy (FTIR), and so on, are briefly introduced. 

Inductively Coupled Plasma. Mass Spectrometry Archaeological Applications. Microscopy Techniques Scanning Electron Microscopy. Surface Analysis X-Ray Photoelectron Spectroscopy Particle-Induced X-Ray Emission Auger Electron Spectroscopy. X-Ray Absorption and Diffraction X-Ray Diffraction - Powder. X-Ray Fluorescence and Emission X-Ray Fluorescence Theory. 

The analysis of metals by X-ray fluorescence has been widely used on geological and sediment samples, either deposited on filters or as thin films. The method can be made quantitative by using geological standards and transition metals can be determined in the 1-5 tg per g range. The surfaces of sediment particles can be examined by the direct use of electron microprobe X-ray emission spectrometry and Auger electron spectroscopy. Although these methods are not particularly sensitive, they can allow the determination of a depth-profile of trace metals within a sediment particle. 

Commonly used spectroscopic or analytical techniques for characterizing surfaces and coating layers on porous silicon are Fourier transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), Auger electron spectroscopy, energy dispersive X-ray spectrometry, fluorescence spectroscopy, UV-Vis absorption/reflectance spectroscopy, thin film optical interference spectroscopy, impedance spectroscopy, optical microscopy, scanning electron microscopy, transmission electron microscopy, atomic force microscopy, ellipsometry, nitrogen adsorption/desorp-tion analysis, and water contact angle. 

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