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Epoxy resins fillers

A general operative is about to use an epoxy resin filler with a peroxide hardener. Outline the health... [Pg.304]

In Figure 5.23 the finite element model predictions based on with constraint and unconstrained boundary conditions for the modulus of a glass/epoxy resin composite for various filler volume fractions are shown. [Pg.187]

ASTM D883 defines a filler as "...a relatively inert material added to a plastic to modify its strength, permanence, working properties, or other quaHties or to lower costs." EiHers (qv) that modify the properties and characteristics of epoxies are employed in epoxy resins for a variety of reasons. Then principal functions are to control viscosity, reduce shrinkage and the coefficient of thermal expansion, effect a cost reduction, and color the epoxy resins. [Pg.530]

A variety of materials has been proposed to modify the properties of asphaltic binders to enhance the properties of the mix (112), including fillers and fibers to reinforce the asphalt—aggregate mixture (114), sulfur to strengthen or harden the binder (115,116), polymers (98,117—121), mbber (122), epoxy—resin composites (123), antistripping agents (124), metal complexes (125,126), and lime (127,128). AH of these additives serve to improve the properties of the binder and, ultimately, the properties of the asphalt—aggregate mix. [Pg.373]

This resin, usually a viscous Hquid, is mixed with fillers, pigments, and a curing agent. The mix is then appHed to the substrate, and cure is obtained in a few hours. The product is strong, tough, and resistant to chemicals and abrasion. It is used for industrial and other doors subject to hard water. The use of epoxy resins for this purpose is only a small fraction of its total use. [Pg.327]

The addition—reaction product of bisphenol A [80-05-07] and glycidyl methacrylate [106-91-2] is a compromise between epoxy and methacrylate resins (245). This BSI—GMA resin polymerizes through a free-radical induced covalent bonding of methacrylate rather than the epoxide reaction of epoxy resins (246). Mineral fillers coated with a silane coupling agent, which bond the powdered inorganic fillers chemically to the resin matrix, are incorporated into BSI—GMA monomer diluted with other methacrylate monomers to make it less viscous (245). A second monomer commonly used to make composites is urethane dimethacrylate [69766-88-7]. [Pg.493]

Owing to relatively low viscosity, these resins offer advantages for 100% soHds (solvent-free) systems. Higher filler levels are possible because of the low viscosity. Faster bubble release is also achieved. Higher epoxy content and functionaHty of bisphenol F epoxy resins can provide improved chemical resistance compared to conventional epoxies. [Pg.363]

The higher molecular-weight soHd epoxy resins are used in formulations that usually consist of a resin, hardener, reinforcing filler, pigments, flow control agents, and other modifiers. In addition to using conventional hardeners in these formulations, epoxy resins can also be hardened with other resins, ie, acryhcs or polyesters. [Pg.370]

This includes wire enamels on a base of polyvinyl formal, polyurethane or epoxy resins as well as moulding powder plastics on phenol-formaldehyde and similar binders, with cellulose fillers, laminated plastics on paper and cotton cloth base, triacetate cellulose films, films and fibres of polyethylene terephthalate. [Pg.221]

With the exception of epoxy resins, when a resin is fully polymerized it loses any irritant properties. However, associated materials, e.g. glass fibre used as a filler, or the dust from plywood or veneers, may promote initation. Partially-cured resins will retain some uritant properties. Traces of cutaneous or respiratory sensitizers liberated, e.g. by heating or machinery, may be problematic. [Pg.144]

Elastomers, plastics, fabrics, wood and metals can be joined with themselves and with each other using nitrile rubber/epoxy resin blends cured with amines and/or acidic agents. Ethylene-propylene vulcanizates can also be joined using blends of carboxylated nitrile rubber, epoxy resin and a reactive metal filler (copper, nickel, cobalt). However, one of the largest areas of use of nitrile rubber modified epoxy systems is in the printed circuit board area [12]. [Pg.660]

When formulating a system for optimum abrasion resistance, both the epoxy/resin hardener binder system and the filler blends used appear to have an influence. The simulation of abrasive service loads on industrial floor toppings in a laboratory is not simple, and numerous wear test machines have been devised. Correlation between different wear test machines is not always good, although most... [Pg.105]

As soon as the Ar s were determined and the values of r s are found, the values of the adhesion coefficient A may be readily defined by using relation (27). The values of A s for the different fiber-volume contents studied are given in Table II for E-glass fiber-epoxy resin composites with different amounts of fillers, up to 70 percent 22 >. [Pg.178]

Eillers used in epoxy resins are normally inert, finely divided powders. Common fillers include calcium carbonate, clay (bentonite), talc, silica, diatomaceous earth, and asbestos. Workers exposed to excessive amounts of some of these dusts may experience lung damage. ... [Pg.300]

Filler Vol% Filler Filler Epoxy Resin Composite... [Pg.334]

The gluability of the lignin-epoxy resin adhesives was found to be improved by the addition of calcium carbonate (50% by weight) to the liquid resin. This must be attributed to the nature of the weak alkali in calcium carbonate as a cure accelerator, and to the reinforcement effect of fillers. Since wood surfaces are acidic, the addition of alkaline fillers effectively alters the pH of the glue line. [Pg.491]

This structure has superior water-resistant properties in comparison to conventional polyols used for PU synthesis. Room temperature cures are easily obtained with typical urethane catalysts. Short chain diols, fillers and plasticizers may also be used in their formulations in order to vary physical properties. Formulations usually with NCO/OH ratio of 1.05 are used for this purpose. Such urethanes are reported to be flexible down to about -70 °C. HTPB is regarded as a work horse binder for composite propellants and PBXs. HTPB also successfully competes with widely used room temperature vulcanizing (RTV) silicones and special epoxy resins for the encapsulation of electronic components. HTPB-based PUs are superior in this respect as epoxy resins change their mechanical properties widely with temperature. [Pg.246]

Similar to composite propellants, flexibilized epoxy or novolac epoxy resins reinforced with fillers or fibers are used for inhibition of fuel-rich propellants. [Pg.294]

The inhibition of composite propellants is somewhat easier than that of DB propellants. The binders used for composite propellants (with or without fillers) have been reported for inhibition of composite propellants. Such inhibition systems possess stronger bonds with composite propellants and prove to be more compatible coupled with better shelf-life of the inhibited propellants. However, epoxy or novolac epoxy resin with or without inert fillers is generally preferred for the inhibition of composite propellants due to a combination of properties possessed by them. The inhibition is usually done by casting technique and inhibition thickness is usually required on higher side in order to make the missions successful. In India, thread winding technique or inhibitor sleeve technique is preferred where 2.5-3.0mm inhibition thickness is sufficient as against 3.5-4.0 mm in case of inhibition by casting technique . [Pg.302]


See other pages where Epoxy resins fillers is mentioned: [Pg.148]    [Pg.148]    [Pg.530]    [Pg.531]    [Pg.144]    [Pg.163]    [Pg.319]    [Pg.400]    [Pg.493]    [Pg.362]    [Pg.371]    [Pg.371]    [Pg.144]    [Pg.105]    [Pg.36]    [Pg.173]    [Pg.216]    [Pg.97]    [Pg.753]    [Pg.679]    [Pg.314]    [Pg.362]    [Pg.330]    [Pg.338]    [Pg.241]    [Pg.299]    [Pg.209]    [Pg.121]    [Pg.115]    [Pg.294]    [Pg.304]   
See also in sourсe #XX -- [ Pg.17 ]




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