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Epoxy resins with fillers

Fig. 13. Thermal conductivities of epoxy resins with fillers of different sizes. Fig. 13. Thermal conductivities of epoxy resins with fillers of different sizes.
Thermoset Epoxy resins with fillers, EP Thermoset Plastics... [Pg.2343]

The inhibition of composite propellants is somewhat easier than that of DB propellants. The binders used for composite propellants (with or without fillers) have been reported for inhibition of composite propellants. Such inhibition systems possess stronger bonds with composite propellants and prove to be more compatible coupled with better shelf-life of the inhibited propellants. However, epoxy or novolac epoxy resin with or without inert fillers is generally preferred for the inhibition of composite propellants due to a combination of properties possessed by them. The inhibition is usually done by casting technique and inhibition thickness is usually required on higher side in order to make the missions successful. In India, thread winding technique or inhibitor sleeve technique is preferred where 2.5-3.0mm inhibition thickness is sufficient as against 3.5-4.0 mm in case of inhibition by casting technique . [Pg.302]

Solvent addition or blending the epoxy resin with low-molecular-weight diluents is another method of lowering the viscosity so that fillers can be efficiently added to the epoxy adhesive formulation. However, in these cases the formulator must address the high vapor pressures of the solvent or diluent (as well as various health, safety, and environmental issues). In the case of diluent addition, the reduction in crosslinking density and thermal or... [Pg.158]

Epoxy resins are not ideal adhesives in their natural form so they are mixed with materials to improve and enhance their properties and, thereby, make them more useful in a variety of applications. This process is called compounding or formulating. Compounding is the combining of a base epoxy resin with curing agents, modifiers, additives, reinforcement, fillers, and other polymers to make the base polymer perform better, cost less, and process more easily. [Pg.391]

We have also dispersed polypyrrole powder in an elastomeric material, or an epoxy resin. Mixing of the conductive filler with the elastomer has been performed using a roll mixer and the composite is then vulcanised. Polypyrrole has been dispersed in epoxy resin with a turbine. [Pg.415]

Figure 5.25. Spectra of relaxation times of specimens containing epoxy resin with quartz filler at concentrations 1-0, 2-0.04, 3-0.31, 4-0.44. Figure 5.25. Spectra of relaxation times of specimens containing epoxy resin with quartz filler at concentrations 1-0, 2-0.04, 3-0.31, 4-0.44.
Figu re 5.366 Property changes in glycidyl ester-based epoxy resins with silica and aluminum fillers as a function of water absorption, see Table 5.118 [881]... [Pg.825]

Bulk Molding Compoimd, BMC, (Dough Molding Compound in Europe) is produced by first mixing pre-catalyzed liquid resin with fillers, mainly calcium carbonate and talc, in a heavy duty low speed sigma blade mixer. This is compression molded at 500 psi and 300 to 400°F. The resin most commonly used is unsaturated styrene-diluted polyester. Other BMC resins are alkyds, phenolics, urea, melamine, diallyl phthallate, silicones and epoxy. All are highly filled with calcium carbonate, talc, mica or alumina to improve mechanical properties and reduce shrinkage. [Pg.393]

In Figure 5.23 the finite element model predictions based on with constraint and unconstrained boundary conditions for the modulus of a glass/epoxy resin composite for various filler volume fractions are shown. [Pg.187]

This resin, usually a viscous Hquid, is mixed with fillers, pigments, and a curing agent. The mix is then appHed to the substrate, and cure is obtained in a few hours. The product is strong, tough, and resistant to chemicals and abrasion. It is used for industrial and other doors subject to hard water. The use of epoxy resins for this purpose is only a small fraction of its total use. [Pg.327]

The addition—reaction product of bisphenol A [80-05-07] and glycidyl methacrylate [106-91-2] is a compromise between epoxy and methacrylate resins (245). This BSI—GMA resin polymerizes through a free-radical induced covalent bonding of methacrylate rather than the epoxide reaction of epoxy resins (246). Mineral fillers coated with a silane coupling agent, which bond the powdered inorganic fillers chemically to the resin matrix, are incorporated into BSI—GMA monomer diluted with other methacrylate monomers to make it less viscous (245). A second monomer commonly used to make composites is urethane dimethacrylate [69766-88-7]. [Pg.493]

The higher molecular-weight soHd epoxy resins are used in formulations that usually consist of a resin, hardener, reinforcing filler, pigments, flow control agents, and other modifiers. In addition to using conventional hardeners in these formulations, epoxy resins can also be hardened with other resins, ie, acryhcs or polyesters. [Pg.370]

This includes wire enamels on a base of polyvinyl formal, polyurethane or epoxy resins as well as moulding powder plastics on phenol-formaldehyde and similar binders, with cellulose fillers, laminated plastics on paper and cotton cloth base, triacetate cellulose films, films and fibres of polyethylene terephthalate. [Pg.221]

With the exception of epoxy resins, when a resin is fully polymerized it loses any irritant properties. However, associated materials, e.g. glass fibre used as a filler, or the dust from plywood or veneers, may promote initation. Partially-cured resins will retain some uritant properties. Traces of cutaneous or respiratory sensitizers liberated, e.g. by heating or machinery, may be problematic. [Pg.144]

Elastomers, plastics, fabrics, wood and metals can be joined with themselves and with each other using nitrile rubber/epoxy resin blends cured with amines and/or acidic agents. Ethylene-propylene vulcanizates can also be joined using blends of carboxylated nitrile rubber, epoxy resin and a reactive metal filler (copper, nickel, cobalt). However, one of the largest areas of use of nitrile rubber modified epoxy systems is in the printed circuit board area [12]. [Pg.660]

Epoxy-polyamide resin with a powdered oxide filler... [Pg.119]

As soon as the Ar s were determined and the values of r s are found, the values of the adhesion coefficient A may be readily defined by using relation (27). The values of A s for the different fiber-volume contents studied are given in Table II for E-glass fiber-epoxy resin composites with different amounts of fillers, up to 70 percent 22 >. [Pg.178]


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See also in sourсe #XX -- [ Pg.295 ]




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Epoxy resin Fillers

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