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Epoxy-laminated paper

A typical length measurement by thermomechanical analysis, TMA (see Sect. 4.5), is shown in Fig. 4.17 on the change in dimensions of a printed circuit board made of an epoxy-laminated paper. Measurements of this type are important for matching the expansivities of the electronic components to be fused to the board, so that strain and... [Pg.298]

Verette, R. M. Temperature/humidity effects on the strength of graphite epoxy laminates, A1AA Paper No. 75-1011 (1975)... [Pg.44]

Marsden W, Boniface L, Ogin SL, Smith PA. Quantifying damage in woven glass fibre/ epoxy laminates. In Proceedings FRC 94, sixth international conference on fibre reinforced composites, Newcastle upon Tyne. Institute of Materials 1994. paper 31,31/1-31/9. [Pg.23]

Figure 22.3 Elastic constants of 0 angle ply of Type I high modulus carbon fiber epoxy laminates. At 9 = 0°, Eai=Eii Ea2 = and 6312= G. The maximum value of Gai2 occurs at 9 = 45°. Source Reprinted from Sinclair JH, Chamis CC, Proceedings of the 35" SPI/RP Annual Technology Conf, Paper 12A, Society of the Plastics Institute, New York, 1980. Figure 22.3 Elastic constants of 0 angle ply of Type I high modulus carbon fiber epoxy laminates. At 9 = 0°, Eai=Eii Ea2 = and 6312= G. The maximum value of Gai2 occurs at 9 = 45°. Source Reprinted from Sinclair JH, Chamis CC, Proceedings of the 35" SPI/RP Annual Technology Conf, Paper 12A, Society of the Plastics Institute, New York, 1980.
When paper-based laminates are to be punched, it must be remembered that the materials are resilient and that their tendency to spring back will result in a hole slightly smaller than the punch that prcxluced the hole. The difference in size will depend on the thickness of the material. Table 35.1 shows the amount by which the punch should exceed the print size in order to make the holes within tolerance. The values listed should not be used for the design of tools for glass-epoxy laminates, the shrinkage of which is only about one-third that of paper-based materials. [Pg.826]

Aqueous dispersions are used in fiber bonding, paper coating, friction and abrasive appHcations, and laminates and wood bonding. PhenoHc dispersions improve the strength of latex-contact adhesive appHcations. Epoxy-modified phenoHc dispersions are prepared by dispersion of the phenoHc epoxy resin. The systems are used for baked primer appHcations and bonding requirements. Minimum baking conditions are 20 min at 150°C (25). [Pg.303]

This includes wire enamels on a base of polyvinyl formal, polyurethane or epoxy resins as well as moulding powder plastics on phenol-formaldehyde and similar binders, with cellulose fillers, laminated plastics on paper and cotton cloth base, triacetate cellulose films, films and fibres of polyethylene terephthalate. [Pg.221]

There are now commercially available a large range of laminated plastics materials. Resins used include the phenolics, the aminoplastics, polyesters, epoxies, silicones and the furane resins, whilst reinforcements may be of paper, cotton fibre, other organic fibres, asbestos, carbon fibre or glass fibre. Of these the phenolics were the first to achieve commercial significance and they are still of considerable importance. [Pg.654]

Silicone release liners are used as a nonadhering surface to which adhesive materials, such as, for example, pressure-sensitive adhesives, can be laminated. UV curable release coatings are based on poly(dimethylsiloxane) oligomers functionalized with acrylate or epoxy groups and are mostly coated onto papers or thin films. [Pg.152]

This refers to many different fabricated RP products such as high or contact/low pressure laminates. It usually identifies flat or curved panels using high pressure rather than contact or low pressure. It is a product made by bonding together two or more layers of laminate materials. The usual resins are thermoset such as epoxies, phenolics, melamines, and TS polyesters. A modification of this process uses TPs. The type of materials can be endless depending on market requirements. Included are one or more combinations of different woven and/or nonwoven fabrics, aluminum, steel, paper, plastic film, etc. [Pg.478]

Materials for rigid laminates include paper-phenolic (the original material), paper-epoxy, and glass-epoxy. Composite laminates, which contain two or more types of reinforcing... [Pg.25]

The combination of an adhesive and adherend is a laminate. Commercial laminates are produced on a large scale with wood as the adherend and phenolic, urea, epoxy, resorcinol, or polyester resins as the adhesives. Many wood laminates are called plywood. Laminates of paper or textile include items under the trade names of Formica and Micarta. Laminates of phenolic, nylon, or silicone resins with cotton, asbestos, paper, or glass textile are used as mechanical, electrical, and general purpose structural materials. Composites of fibrous glass, mat or sheet, and epoxy or polyester resins are widely employed as reinforced plastic (FRP) structures. [Pg.30]


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See also in sourсe #XX -- [ Pg.329 ]




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