Polymerization electroless

Recently, acidic (0.6 M H2S04) aniline solutions have been reported to undergo slow (10 d), spontaneous polymerization on platinum or palladium foil surfaces, providing a novel, electroless polymerization route to PAn.113 X-ray photoelectron spectroscopy and FTIR spectral studies suggest that the deposited PAn materials are in the rarely reported nigraniline oxidation state, intermediate between the well-known emeraldine and pemigraniline states. 

PANI and its derivatives can be synthesized by the electrochemical polymerization or chemical polymerization of aniline although some other approaches have also been reported such as solid-state polymerization [313], electroless polymerization [314], plasma polymerization [315], and emulsion polymerization [307], Various oxidants were used for oxidation of aniline monomer, such as ammonium peroxy-disulfate, sodium peroxydisulfate, potassium bichromate, and hydrogen peroxide. 

According to Ref. [12], template for synthesis of nanomaterials is defined as a central structure within which a network forms in such a way that removal of this template creates a filled cavity with morphological or stereochemical features related to those of the template. The template synthesis was applied for preparation of various nanostructures inside different three-dimensional nanoporous structures. Chemically, these materials are presented by polymers, metals, oxides, carbides and other substances. Synthetic methods include electrochemical deposition, electroless deposition, chemical polymerization, sol-gel deposition and chemical vapor deposition. These works were reviewed in Refs. [12,20]. An essential feature of this... 

The hybridizing component can also be formed directly on the surface of a pristine or modified nanocarbon using molecular precursors, such as organic monomers, metal salts or metal organic complexes. Depending on the desired compound, in situ deposition can be carried out either in solution, such as via direct network formation via in situ polymerization, chemical reduction, electro- or electroless deposition, and sol-gel processes, or from the gas phase using chemical deposition (i.e. CVD or ALD) or physical deposition (i.e. laser ablation, electron beam deposition, thermal evaporation, or sputtering). 

One strategy is to fabricate a template structure using polymeric material (thus, using the same chemistry as described in Sects. 5.2 and 5.3) and back-fill or coat this structure with inorganic materials. For example, surface modification, followed by electroless deposition of Ag [217-219] or Cu [220], or by chemical reduction of Au solutions by surface functionalities [220], has been used to obtain metallized structures, while infiltration of polymeric photonic bandgap-type structures with Ti(0 Pr)4 solution, followed by hydrolysis and calcination, has been used to obtain highly refractive inverted Xi02 structures [221]. Au has also been deposited onto multiphoton-patterned matrices of biomaterials [194]. 

Control of a given pM value, (i) Electroplating or electroless plating (see Chapter 57) (ii) control of the activity of metal-dependent polymerization catalysts [for styrene and butadiene NaFe(edta)] (iii) biological growth systems supplying micronutrient metal ions (Fe3+ NaFe(edta),... 

This paper describes a process for activating polyimide surfaces for electroless metal plating. A thin surface region of a polyimide film can be electro-chemically reduced when contacted with certain reducing agent solutions. The electroactivity of polyimides is used to mediate electron transfer for depositing catalytic metal (e.g., Pd, Pt, Ni, Cu) seeds onto the polymer surface. The proposed metal deposition mechanism presented is based on results obtained from cyclic voltammetric, UV-visible, and Rutherford backscattering analysis of reduced and metallized polyimide films. This process allows blanket and full-additive metallization of polymeric materials for electronic device fabrication. 

The design of the interstices filling in colloidal crystals with appropriate media and subsequently fluid-solid transformation is central to the whole synthesis. Fluid precursors in the voids of crystal arrays can solidify by polymerization and sol-gel hydrolysis. More recently, many methods have been developed including salt precipitation and chemical conversion, chemical vapor deposition (CVD), spraying techniques (spray pyrolysis, ion spraying, and laser spraying), nanocrystal deposition and sintering, oxide and salt reduction, electrodeposition, and electroless deposition. 

If the film, layered by the plasma polymerization technique, is sufficiently conductive and adheres to the substrate, direct electroplating can be performed. This simplifies the conventional process even further by removing the necessity of several presteps such as etching, neutralization, catalyzing, acceleration, and electroless plating. Five different process schemes were tried to further investigate the effectiveness of... 

Electroless plating on polymeric substrates activated by the sputter deposition of electrode material with simultaneous plasma polymerization is possible. 

Use Electroless coatings on plastics, textiles, fibers, other metals polymerization catalyst reducing agent. 

Copper was electrolessly deposited on suspended AI2O3 nanoparticles by the addition of Cu(II)-EDTA alkaline solution and formaldehyde as a reducing agent.97 This approach can be used for various ceramic or polymeric nanoparticles and different metals. 

MOLDING/METALLIZATION. Molded thermoplastic circuit board substrates may be rendered selectively conductive by several additive process techniques including conductive polymeric thick film inks (PTF), and semi and fully additive electroless/electrolytic platings. Of the various chemical process methods developed to produce circuitry on a molded plastic substrate, one method practiced by Pathtek, A Kodak Company, combines both "catalytic" and "non-catalytic" resins in a highly automated commercialized two-shot molding/selective metallization process. 

Similar to photolithography, subsequent processing steps are required to define features. For this reason, j,CP is also typically limited to the fabrication of electrodes in bottom-contact OTFTs. The subsequent processing steps can be classified into three categories selective etching [29,33-35], selective electroless plating [36-39], and selective chemical and electrochemical polymerization [40-43]. Depending on... 

A holographic polymeric substrate Is formed by casting and curing a polymer precursor in contact with a holographic relief-patterned mold to form a polymeric substrate with a holographic relief-patterned surface. Once cured, the web containing the hologram can be stored or run Into a second print station which applies the catalyst for electroless metal deposition. 

Nanostructured and planar films of poly(p-xylylene) have been fabricated by an oblique angle polymerization method. Subsequently, these films were coated with cobalt by an electroless deposition method [104],... 

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