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Electrical probes

Figure. 3.3. Schematic illustration of a gun experiment. The electrical probes measure the projectile velocity. Additional probes (not shown) measure the tilt at Impact. A vacuum is drawn before the experiment to prevent gas cushioning of the impact. Figure. 3.3. Schematic illustration of a gun experiment. The electrical probes measure the projectile velocity. Additional probes (not shown) measure the tilt at Impact. A vacuum is drawn before the experiment to prevent gas cushioning of the impact.
Gidon, S., Lemonnier, O., Rolland, B., Bichet, O., and Dressier, C., Electrical Probe Storage Using Joule Heating in Phase Change Media, Appl. Phys. Lett., Vol. 85, 2004, pp. 6392-6394. [Pg.62]

Figure 31. Current-voltage characteristics of an electric probe. The ion and electron current are f and 1, and the floating and plasma potentials are Vf and Vp, respectively. Figure 31. Current-voltage characteristics of an electric probe. The ion and electron current are f and 1, and the floating and plasma potentials are Vf and Vp, respectively.
Benzodiazepines also act on two other brain regions that we have discussed in relation to anxiety. One of these areas is the lateral septum. The septum, as you will recall, is involved in the expression of aggressive behavior. Curiously, benzodiazepines infused into the lateral part of the septum decrease electric probe burying but do not interfere with... [Pg.72]

Swift, J. D., Schwar, M. J. R. Electrical Probes for Plasma Diagnostics, New York, Elsevier, 1971... [Pg.40]

Chung, P. M., Talbot, L. Touryan, K. J. Electric Probes in Stationary and Flowing Plasmas Theory and Application, New York, Springer-Verlag, 1975... [Pg.40]

Probe Methods. See Electrical Probe Technique in Ref 75 and Probe Methods of Ionization Determination in Ref 36, p 144 and diagrams 7.1 7.2... [Pg.306]

L.D. Pitts, "Electrical Probe Technique for Measurement of Detonation and Deflagration Velocities , 4thONRSympDeton(1965), 616-26. In these experiments the probe consisted of a length of resistance wire sandwiched between two strips of insulating material. After placing the probe adjacent to the wall of the metallic test cylinder, a constant current was forced thru the probe. Detonation, or deflagration front pressure... [Pg.341]

Electronic properties semiconductor and metal conductivity, magneto-resistance, emission of electrons, electronic devices of the molecular size, information recording, diodes, field transistors, cold cathodes, materials for displays, quantum wires and dots, cathodes for X-ray radiation, electric probes, etc. [Pg.12]

Electrical probe technique for measurement of detonation and deflagration 4 D341... [Pg.595]

A FIGURE 15.6 ApH meter with its electrical probe dipping into a grapefruit. An accurate value of the pH (3.7) is shown on the meter. [Pg.623]

Before the other ant responds, the gold one removes an electrical probe from a pouch and twists it up a single hideous hole in the center of its face. Bob put his fingers over his nose. The creature s body exudes the ammoniac smell of piss and sweat. [Pg.85]

The larger one with the golden abdomen says, I hear them. Its voice sounds as if it is warped by some kind of artificial translation device. Again, it twists an electrical probe up its huge nostril. [Pg.109]

An electric technique to measure the gas holdup was implemented by Linek and Mayrhoferova (1969). In this method, the surface elevation of the gas-liquid interface of the nonaerated and aerated liquid in the vessel is detected at certain selected points by means of an electrical probe. The height is determined by the vertical position of the probe at which the sum of contact times equals one-half of the measurement period. The gas holdup is then calculated from the total surface elevation, the cross-section of the reactor, and the liquid volume. The accuracy of the measured value of the total surface elevation is claimed by the authors to be +0.2 mm. [Pg.170]

The method of the S research was described in [9,10]. A platinum-silver ribbons of 5 /mi thickness were a potential electrical probes to a sample. The measurements were performed as at the constant gradient of T, and also at the progressive reducing of one, when the heat supply was cut off ( regular thermal regime). As can be seen, the relative changes of S in the both cases are approximately the same the exhibited data agrees well with the results of S measurements, received formerly [9, 14]. [Pg.671]

A recent experiment in a laboratory MHD channel at Stanford ( ) has shown that, under MHD conditions (high potassium loading), the addition of phosphorus, even in amounts much greater than those found in coal, has a much smaller effect on electron concentration and conductivity than would be predicted by the above modeling. That experiment Involved simultaneous measurement of electron concentration by submillimeter interferometry, of positive ion concentration by a swept electric probe, and of plasma temperature by the emission-absorption (line-reversal) technique, made in an ethanol-fueled, potassium-seeded combustion plasma. [Pg.603]

Figure 3.9. Electrical probe yield of meander patterns versus design feature size and wavelength. The vertical bars indicate the total yield range for the wafer tested. (Reproduced with permission from reference 23.)... Figure 3.9. Electrical probe yield of meander patterns versus design feature size and wavelength. The vertical bars indicate the total yield range for the wafer tested. (Reproduced with permission from reference 23.)...
STM) based on the quantum mechanical effect of tunneling. The instrument scans an electrical probe, a sharp stylus, over a surface and detects a weak electric current flowing between the tip and the surface. The stylus is so sharp that its tip consists of only one atom ... [Pg.109]

At the end of the wafer processing, the wafer with the IC devices is inspected for defects and reviewed with relevant metrology. If the defect level is acceptable, the IC wafer is sent to the testing facility, where it is electrically probed to check for electrical performance. Next, the IC wafer is stress tested, which involves operating it at the extremes of its specified typical use conditions. If the IC wafer passes the functional and stress tests, it is sent to the packaging facility, where bond pad... [Pg.772]


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See also in sourсe #XX -- [ Pg.661 ]




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