DMS-E process

FIGURE 10.13 Scheme of printed circuit board metallization by the DMS-E process = direct metallization 3,4-ethyienedioxythiophene (EDT). 

In the mid-1990s, a process for the direct metallization of copper through-holes in printed wiring boards (PWBs) and other multilayer structures called the Envision (a registered trademark of Enthone, Inc.) DMS-E process was developed [124-126], This process competes with the traditional chemical copper deposition procedures that employ strong complexing agents (such as ethylenediamine-lV,lV,lV, lV -tetraacetic acid)... 

PEDT is also used in electronic technology (DMS-E process) for the production of electrically conductive layers of conductive plates. The first conductive layer in this process is prepared from EDT forming PEDT with a lower resistivity than usual in the present normally used technical process. This new process yields in electrically conductive layers of higher quality than by the other used technical processes in shorter time combined with easier handling [63]. PEDT has qualified itself especially as an excellent material that can be used for through-hole electroplating by electroless deposition. 

Again, the left-hand side could be rewritten as in Eq. (6). Equation (11) contains the assumption that molecular and turbulent diffusion are independent processes and thus additive, as indicated by terms of the form (Dm + e. ). Mickelsen (63) made and justified this assumption. As noted by Sayre and Chang (82), however, it is really only of academic interest in open-channel flows, as the turbulent diffusion coefficients are typically several orders of magnitude greater than Dm- For this reason, Dm will be neglected in subsequent presentations of the equation. 

Another method of applying conducting polymers to direct electrolytic metallization of circuit boards was introduced by Blasberg Oberflachentechnik [89]. They reported an in situ polymerization route to deposit polypyrrole [89] and poly-3,4-ethylenedioxythiophene [91] on the surface of a circuit board. The overall process is depicted in Fig. 32.24. The substrate is first selectively coated with an oxidant solution. The monomer (pyrrole or 3,4-ethylenedioxythiophene) is subsequently introduced followed by acid-induced in situ polymerization of the monomer. The conducting polymer-coated board can then be directly electrolytically copper plated. The polypyrrole process referred to as DMS-2 was marketed by Blasberg Oberflachentechnik in 1990 [89]. The polythiophene process, DMS-E, has also since been mar-... 

Principal process steps of the DMS-E direct metallization process, (a) Swelling and etching with aqueous potassium permanganate, (b) dipping in 3,4-ethylenedioxythiophene microemulsion, and fixing with sulfonic acid (c) galvanic copper. 

When performing chemical reactions it is necessary to consider conceivable deviations (e.g., upsets, abnormal situations, failures) from the normal operation of a process and equipment and their possible effects on the reaction enthalpy AHr, the gas volume M produced and the rate of gas production (dM/dt), the heat flow balance (dQR/dt) - (dQ /dt) and the maximum permissible temperature TeXo for thermal stability under the applicable process conditions. Upsets (abnormal situations, failures) can be divided into two categories, and their consequences can be assessed using the following tables3 ... 

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Becanse there are many factors involved in the dynamic mechanical compression of polyolefin foams, the Taguchi method was employed in a Perkin Elmer DM A7 dynamic mechanical analyser to establish a method to improve the measurement process. The signal-to-noise ratio was measured to determine how the variability could be improved. Control and noise factors were evaluated and levels chosen, with details being tabulated. Appendix A describes some of the factors. Tests were conducted on two closed cell foams. NA2006 foam is 48 kg/cu m LDPE and NEE3306 foam is 32 kg/cu m EVA. Different factors were shown to influence results for E and tan delta but an optimum combination is proposed for the simultaneous measurement of both properties. The results were less variable as frequency was increased. Small differences in the dynamic response of different materials should be measurable because of the low variability in the experimental results. 18 refs. 

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