Porous silicon dissolution rate

Porous silicon was discovered over 35 years ago by Uhlir.28 The porous material is created by electrochemical dissolution in HF-based electrolytes. Hydrofluoric acid, on its own, etches single-crystal Si extremely slowly, at a rate of only nanometers per hour. However, passing an electric current between the acid electrolyte and the Si sample speeds up the process considerably, leaving an array of deep narrow pores that generally run perpendicular to the Si surface. Pores measuring only nanometers across, but micrometers deep, have been achieved under specific etching conditions. 

Porous silicon in aqueous conditions undergoes hydrolysis to form orthosihcic acid and the reaction is catalyzed by OH- hence the rate of dissolution increases with increasing pH. Dissolution of unoxidized sihcon can be described with a simplified two-step process ... 

Porous silicon template could be carefully removed via selective chemical etching in tetramethyl ammonium hydroxide (TMAH) solution at 40-90 °C. Such dissolution process is crucial and not so easy to control. The etch rate is not the same for different Si templates. It depends on the Si dopant type and level as well as on the pore depth and diameter. The removal of template could be done using KOH solution, but the etching behavior is completely different from the case of TMAH. Ethylene diamine pyrocatechol is also reported as a chemical etch solution at 115 °C to successfully... 

Many theories on the formation mechanisms of PS emerged since then. Beale et al.12 proposed that the material in the PS is depleted of carriers and the presence of a depletion layer is responsible for current localization at pore tips where the field is intensified. Smith et al.13-15 described the morphology of PS based on the hypothesis that the rate of pore growth is limited by diffusion of holes to the growing pore tip. Unagami16 postulated that the formation of PS is promoted by the deposition of a passive silicic acid on the pore walls resulting in the preferential dissolution at the pore tips. Alternatively, Parkhutik et al.17 suggested that a passive film composed of silicon fluoride and silicon oxide is between PS and silicon substrate and that the formation of PS is similar to that of porous alumina. 

For homogeneously doped silicon samples free of metals the identification of cathodic and anodic sites is difficult. In the frame of the quantum size formation model for micro PS, as discussed in Section 7.1, it can be speculated that hole injection by an oxidizing species, according to Eq. (2.2), predominantly occurs into the bulk silicon, because a quantum-confined feature shows an increased VB energy. As a result, hole injection is expected to occur predominantly at the bulk-porous interface and into the bulk Si. The divalent dissolution reaction according to Eq. (4.4) then consumes these holes under formation of micro PS. In this model the limited thickness of stain films can be explained by a reduced rate of hole injection caused by a diffusional limitation for the oxidizing species with increasing film thickness. 

---