Dielectric electronic substrates

Foams have a large variety of applications. Solid foams are widely used as insulating materials. Due to the presence of air bubbles they have a low thermal conductivity. Polyurethane foams and Styrofoam are examples. Styrofoam is also used as a packing material. The light weight of polymer foams makes them attractive as filling materials to stabilize otherwise hollow structures. A natural solid foam is pumice stone. Metal foams are used in the automotive and aerospace industry as light and stable materials [567], Ceramic foams are developed for electronic applications as piezoelectric transducers and low dielectric constant substrates [568],... 

Amorphous polymeric dielectric films of phosphorus nitrides and oxynitrides ( Phoslon ) can be prepared on electronic substrates by chemical vapor deposition... 

As is evident from the data in Table 7.4, alumina is not the most suitable material to fidfill the requirements for an ideal electronic substrate. In particular, its thermal conductivity is among the lowest Hsted, the rather high dielectric permittivity may lead to inductive crosstalk and noise generation as well as signal delay in the... 

Of equal importance for this particular application, however, is the dielectric permittivity, e, which determines the velocity of propagation (Vp) of electric signals. As Vp l/Vi, the dielectric permittivity should be minimized to maximize the speed of signal transmission. Figure 11.14 shows different ceramic substrate materials in a plot. Clearly, a compromise is always required, and target materials suitable for electronic substrate and chip carrier apphcation should be... 

Thermally conducting but electrically insulating materials are needed for encapsulations, dielectrics and substrates used in electronic packaging. In order to provide thermally conducting but insulating polymer matrix composites, fillers such as diamond, boron nitride and silicon carbide are used [16, 17],... 

As a tme thermoplastic, FEP copolymer can be melt-processed by extmsion and compression, injection, and blow molding. Films can be heat-bonded and sealed, vacuum-formed, and laminated to various substrates. Chemical inertness and corrosion resistance make FEP highly suitable for chemical services its dielectric and insulating properties favor it for electrical and electronic service and its low frictional properties, mechanical toughness, thermal stabiUty, and nonstick quaUty make it highly suitable for bearings and seals, high temperature components, and nonstick surfaces. 

Electrical Properties. Polysulfones offer excellent electrical insulative capabiUties and other electrical properties as can be seen from the data in Table 7. The resins exhibit low dielectric constants and dissipation factors even in the GH2 (microwave) frequency range. This performance is retained over a wide temperature range and has permitted appHcations such as printed wiring board substrates, electronic connectors, lighting sockets, business machine components, and automotive fuse housings, to name a few. The desirable electrical properties along with the inherent flame retardancy of polysulfones make these polymers prime candidates in many high temperature electrical and electronic appHcations. 

It is a valve metal and when made anodic in a chloride-containing solution it forms an anodic oxide film of TiOj (rutile form), that thickens with an increase in voltage up to 8-12 V, when localised film breakdown occurs with subsequent pitting. The TiOj film has a high electrical resistivity, and this coupled with the fact that breakdown can occur at the e.m.f. s produced by the transformer rectifiers used in cathodic protection makes it unsuitable for use as an anode material. Nevertheless, it forms a most valuable substrate for platinum, which may be applied to titanium in the form of a thin coating. The composite anode is characterised by the fact that the titanium exposed at discontinuities is protected by the anodically formed dielectric Ti02 film. Platinised titanium therefore provides an economical method of utilising the inertness and electronic conductivity of platinum on a relatively inexpensive, yet inert substrate. 

In the first model, the mnneling electron mainly interacts with the electronic polarization of water ( = 1.88) since tunneling was assumed to be fast in comparison with the orientational response of the dipolar molecules of the liquid. Considering water as a dielectric continuum between a jellium spherical tip and planar substrate yields an effective barrier for tunneling that is about 1 eV lower than that for the vacuum case [95]. This result is consistent with photoemission studies of metal/aqueous interfaces, which reveal electron emission into water at 1 eV below the vacuum level [95-97]. Similar models have been employed to examine the effect of thermal fluctuations on the tunneling current [98-100]. Likewise, a related model assessing the noise associated with the reorientation of adsorbed molecules has been presented [101]. 

---