Cu foils

Fig. 10. Coefficient of H atom recombination on Ni-Cu alloy catalysts as a function of the alloy composition, at 20°C. A, on Ni-Cu foils (59), O, on Ni-Cu evaporated films af ter their previous homogenization at 400°C (65,65a) d, on Ni-Cu foils after a multiple hydrogen absorption-desorption treatment (64a).

The substrate was also found to influence the properties of the electrolessly deposited vertical media CoNiMnP, CoNiReMnP, and CoNiReP. The c-axis orientation had a larger degree of perpendicular orientation for films deposited on electroless NiP than for those deposited on Cu foil, presumably because of the smaller roughness of the former substrate [43]. The double-layer (magnetically soft interface, magnetically hard bulk) properties of CoNiReP deposited on a NiMoP underlayer [57] have already been discussed. 

Some Cu substrates have been used, including Cu foils, etched foils, and vapor deposited Cu on glass. There does not appear to be a significant difference in the quality of deposits formed on Cu vs. Au, beyond those expected from considerations of lattice matching. 

The sample was in the shape of a slab of 10.03 x 3.38 x 0.43cm3 and a mass m = 19.88 g. The Torlon slab was enveloped in a 7 xm Cu foil glued on the whole sample area by means of a thin layer of diluted GE 7031 Varnish in order to get an isothermal sample. The internal thermalization time of the enveloped sample was evaluated to be [32] ... 

Cu frame Torlon sample 7 pm Cu foil NbTi wires... 

Electrochemical synthesis was utilized to prepare labeled compounds. Tetramethyllead labeled with 14C was prepared in a double compartment cell in DMF with NaClC>4, by electrolyzing 14CH3l on lead electrodes. The method is reported as superior to transmet-allation with methylmagnesium halide. It is also possible to incorporate lead isotopes. 2i°Pb2+ ions were deposited on a Cu foil and the latter was used as a sacrificial electrode in solutions of CH3I. The yield of labeled tetramethyllead was 85%65. Synthesis of 210Pb-labeled chlorotrimethylplumbane was also described66. 

Ru electrodes were prepared as previously described by plating Ru metal onto spectroscopic carbon rods, except for the electrode used for Auger analysis (before and after carbon dioxide reduction) which was plated on Ti (2.). Cu electrodes were prepared from Cu foil as previously described (Kim, J. J. Summers, D. P. Frese, K. W., Jr. J. Electroanal- Chem. in press.). Each entry in the tables and figures was obtained on different days with the electrode kept in ordinary laboratory air overnight between runs. 

Fig. 5.14 (a) Schematic of SEED process of metal NP deposition on metai surface supported nanoparticie. (b) Example of Au NP deposition on CVD grown graphene on Cu foil, scale 1pm. Reproduced with permission from [143], (2012) Elsevier. 

A1 and Cu foils are used as current collectors for cathode and anode materials, respectively, in lithium... 

Figure 22. Normalized Cu K XANES for Cu foil ( ), CU2O (dots), and upd Cu on Pt/C at 0.05 V vs SCE (dashes). (Reproduced with permission from ref 73. Copyright 1991 Elsevier Sequoia S.A., Lausanne.)...

Fig. 21. Comparison of Pt- and Cu-foil probes simultaneously exposed to exhaust. [From Williams and Baron (95).]...

JP 05125345 (Japanese) 1993 Poly(vinyl butyral) blend adhesive composition for flexible printed circuit boards Ube Industries, Japan H Inoe, S Takabayashi, T Muramatsu, T Funakoshi Formulated resins having good flexibility and heat resistance are useful adhesives for polyimide/Cu foil laminated circuit boards Maleimide-terminated siloxane-imide block copolymers were formulated with poly(vinyl butyral) and melamine resins to give adhesive compositions. 

JP 05306386 (Japanese) 1993 Heat-resistant adhesive composition Ube Industries, Japan H Inoe, S Takabayashi, T Muramatsu, T Hirano Resin formulation useful for bonding Cu foils to polyimide films for electronic applications Heat-resistant adhesives were formulated to include imide-siloxanes with softening points <300° C. Diaminopolysiloxanes and aromatic amines were used maleimide termination also utilized. 

Figure 5.1.4 Dependence on the potential (with respect to SHE) of the current density and selectivities toward products in the C02 reduction in methanol under pressure and using Cu-foil electrode. Adapted from [16a].

Li1.1V0.9O2, PVDF, Super P were mixed together to be coated on a Cu foil to make the electrode, and commercial electrolyte (Samsung Electric Co.) was used in this system. Li metal was used as cathode and a thin pouch was used to seal the cell. 

Fabrication procedure of gold nanodisk electrodes (NEEs) is schematically shown in Fig. 3.14 (Menon and Martin 1995 Pereira et al. 2006). Step I A piece of the Au/Au-PC/Au membrane is first affixed to a piece of adhesive aluminum foil tape (Fig. 3.14a). Step II A rectangular strip of a copper foil, with a conductive adhesive, is then affixed to the upper Au-coated surface of the Au/Au-PC/Au membrane (Fig. 3.14b). This Cu foil tape acts as a current collector and working electrode lead for the NEE. Step III The upper Au surface layer from the portion of the Au/Au-PC/Au membrane not covered by the Cu foil tape is then removed by simply applying and then removing a strip of Scotch tape. Removal of the Au surface layer exposes the disk-shaped ends of the Au nanowires within the pores of the membrane (Fig. 3.14c). These nanodisks will become the active electrode elements. Step IV The NEE assembly is heat treated at 150°C for 15 min. This produces a water-tight seal between the Au nanowires and the pore walls. Finally, strips of strapping tape are applied to the lower and upper surfaces of the assembly to insulate the Al and Cu foil tapes (Fig. 3.14d). 

A soln. of RaD-E-F of about 50 me strength la freed from moat of the Po by agitation of 6 Cu foils. Thereafter,... 

Figure 7.39. XAFS CASE STUDY surface characterization of dispersed CuO catalysts on silica and alumina/silica supports. Shown are (A) EXAFS of the Cu K-edge of the catalyst calcined in air at 543 K. The thick and thin lines indicate Si/Al and Si supports, respectively (B) EXAFS of the Cu K-edge of the catalyst reduced under a H2 flow at 543 K (C) Cu K-edge XANES spectra of the calcined catalyst on (a) Si02, (b) Si02/Al203 supports, along with references of (c) Cu foil, (d) CU2O, and (e) CuO (D) XPS spectrum of the Cu 2p core level of the calcined catalyst on a Si support (E) XPS spectrum of the catalyst on a Si/Al support. Reproduced with permission from Gervasini, A. ManzoU, M. Martra, G. Ponti, A. Ravasio, N. Sordelli, L. Zaccheria, F. J. Phys. Chem. B 2006,110, 7851.

Figure 30 Cu K-edge EXAFS spectrafor (a) Cu foil, (b) CU2O, (c) CuO and (d) Cu(OH)2...

Hydrogenation of cyclopentadiene to cyclopentane cyclopentene (T=165-240°C) Pd-Cu (foil) 5 for cyclopentene higher than Fixed bed reactor Zhemosek et al., 1979... 

A SEM image of diamond particles is shown in Figure 9.15. Unlike past works, diamond film surfaces were well facetted with (111) and (100) faces, or consisted of cubo-octahedrons. Under certain conditions, either (111) or (100) faces of diamond particles were nearly parallel to the substrate surface. It is of intrigue that the (1 ll)-oriented diamond grains have hexagonal faces, as seen in Figure 9.15, rather than triangles that were seen in Refs. [186, 187]. Thus, both (111)- and (100)-textured diamond films were demonstrated to be synthesized on poly-crystalline Cu foils. 

Figure 9.15. 11 l>-oriented diamond crystals grown on Cu foil [191],... 

PrOH was also produced with both GDEs. The selectivity for EtOH formation became poorer and the current density lesser than that for CuO/ZnO-GDEs of the standard composition. Faradaic efficiencies of the reduced GDE are larger than those of the as-prepared GDE. Ti(EtOH)Max of 16.2% at -1.25 V, r (C02)Max of 40.5% at -1.30 V, and T](total)Max of 66.4% at -1.30 V were obtained with the Ha-reduced GDE. These tendencies are similar to those observed for the Cu foil electrode, even though in the different electrolyte, i.e. 0.1 M KHCOs aq. soln. [6]. 

Since metallic Sn has a high capacity for reversible Li insertion, pure Sn as well as its intermetallic compounds have been considered as promising anode materials in lithium ion batteries. In intermetallic compounds of Sn, the second metal is normally electrochemically inactive and cannot be alloyed with Li. Such an inactive metal performs as a buffer to accommodate volume variations during Li insertion/deinsertion in Sn.224 Among various Sn intermetallic compounds, Ni3Sn4232-235 and CU6S115236 237 are the most commonly studied materials. Intermetallic compounds of Sn with Ni and Cu can be electrochemically deposited. Templates are conventionally used to improve the morphological properties and, thus, the electrochemical behavior of the electrodeposited Sn and Sn intermetallic compounds. Copper nanopillars can be electrodeposited within alumina templates on a Cu foil to provide a unique template for the subsequent electrodeposition of Sn or its intermetallic compounds. 

---