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Fabrication procedures

Probably the most critical aspect of the introduction of a new process is that of the education and training of the personnel involved. It is vital that the people have a qualitatively correct overall picture of the importance of the different stages of the bonding operation, and of the health and safety considerations. The use of an untrained workforce is likely to cause problems sooner rather than later  [Pg.187]

The time elapsed between surface pretreatment and applieation of the adhesive should generally be kept as short as possible, in order to minimise subsequent contamination. By priming the adherend surfaees involved, either at the job-site or elsewhere, more [Pg.187]

Physical and mechanical quality control test procedures should ideally be carried out alongside the actual fabrication, and these are reviewed briefly below. [Pg.188]


The American Society of Mechanical Engineers (ASME) United Engineering Center 345 East 47th Street New York, NY 10017 The ASME Boiler and Pressure Vessel Code, under the cognisance of the ASME PoHcy Board, Codes, and Standards, considers the interdependence of design procedures, material selection, fabrication procedures, inspection, and test methods that affect the safety of boilers, pressure vessels, and nuclear-plant components, whose failures could endanger the operators or the pubHc (see Nuclearreactors). It does not cover other aspects of these topics that affect operation, maintenance, or nonha2ardous deterioration. [Pg.26]

Another important orienting fabricating procedure concerns applying directional properties to reinforced plastics. This subject is reviewed in Chapter 3, DESIGN CONCEPT, Reinforced Plastic Directional Property. [Pg.457]

McGregor SM, Dharmadasa IM, Wadsworth 1, Care CM (1996) Growth of CdS and CdTe by electrochemical technique for utilisation in thin film solar cells. Opt Mater 6 75-81 Morris GC, Das SK (1992) Some fabrication procedures for electrodeposited CdTe solar cells. Int J Sol Energy 12 95-108... [Pg.152]

One should distinguish between true catalyst supports and diluents. A catalyst support (or carrier) is a material on which a thin layer of catalyst is deposited a diluent is an inert material thoroughly mixed with the catalyst to enhance the binding properties of a powdered catalyst or to assist in pelleting or extrusion fabrication procedures. [Pg.200]

Fu et al. (2002) report the optimization of a fabrication procedure for microspheres based on the poly( anhydride-co-ether) P(SA-EG). The microspheres are fabricated by solvent removal process that produces a porous structure with densities in the range of 0.344 and 0.077 g cm-3 and sizes that are optimized for delivery to the deep lung by inhalation (Fu et al., 2002). An appropriate in vitro cell culture model for characterization of the particle-epithelia system was also developed (Fiegel et al., 2003). [Pg.213]

Fig. 7.4 Fabrication procedures of a multicavity fiber FPI sensor. Reprinted from Ref. 11 with permission. 2008 Optical Society of America... Fig. 7.4 Fabrication procedures of a multicavity fiber FPI sensor. Reprinted from Ref. 11 with permission. 2008 Optical Society of America...
The fabrication procedure affects the product s microstructure including grain size, grain-boundary width, and porosity. In addition, different procedures introduce various amounts of impurities to the product. Therefore, the electrical conductivity and activation energy are affected by the fabrication procedure since, as mentioned above,... [Pg.41]

Figure 21.1 A-Structure of the host PAPAM dendrimer. B-Fabrication procedure for metal-dendrimer nanocomposites. C- Pd and Pt dendrimer encapsulated nanoparticles prepared by displacement reactions [66]. D, E -External and internal dendrimer nanocomposite topologies, respectively [70,77],... Figure 21.1 A-Structure of the host PAPAM dendrimer. B-Fabrication procedure for metal-dendrimer nanocomposites. C- Pd and Pt dendrimer encapsulated nanoparticles prepared by displacement reactions [66]. D, E -External and internal dendrimer nanocomposite topologies, respectively [70,77],...
Other efforts have also been made to modify the CL microstructure by controlling the agglomerate size in the catalyst ink. Uchida et al. [145] proposed a colloidal ink fabrication procedure using low-dielectric-constant solvents to generate a good network and a uniformity of perfluorinated... [Pg.95]

Figure 48 represents one type of mask structure that has been developed at Bell Laboratories and used successfully to replicate devices with one-micron features. The reader is referred elsewhere for a detailed discussion of mask fabrication procedures (72). [Pg.80]

In the electronics industry, for example, the magnetic properties of the iron oxides are used extensively, but the dielectric losses associated with mixed iron valences represent a problem to be minimized by fabrication procedures. [Pg.3]

Figure 11.6 Fabrication procedure of an IDA microelectrode. An oxidized silicon wafer (A) is coated with platinum (B). Carbon film is pyrolyzed on it (C). The substrate is coated with photoresist, which is exposed and developed (D) unnecessary portions are then removed by reactive ion etching (E). After removing the photoresist, an Si3N4 layer is deposited on the substrate (G). The substrate is coated with photoresist, which is exposed and developed (H) then the desired shape of the carbon electrode is exposed by reactive-ion etching (I). [Adapted from Ref. 36.]... Figure 11.6 Fabrication procedure of an IDA microelectrode. An oxidized silicon wafer (A) is coated with platinum (B). Carbon film is pyrolyzed on it (C). The substrate is coated with photoresist, which is exposed and developed (D) unnecessary portions are then removed by reactive ion etching (E). After removing the photoresist, an Si3N4 layer is deposited on the substrate (G). The substrate is coated with photoresist, which is exposed and developed (H) then the desired shape of the carbon electrode is exposed by reactive-ion etching (I). [Adapted from Ref. 36.]...
Fig. 2 Schematic cartoon (a), and chemical structures (b) of the general fabrication procedure of a sensitive fluorescent monolayer on glass i) silanation of the glass slide with N-[3-(trimethoxysilyl)propyl]ethylenediamine to form the amino-terminated monolayer, ii) reaction with an amino-reactive fluorophore, iii) covalent attachment of a binding molecule... Fig. 2 Schematic cartoon (a), and chemical structures (b) of the general fabrication procedure of a sensitive fluorescent monolayer on glass i) silanation of the glass slide with N-[3-(trimethoxysilyl)propyl]ethylenediamine to form the amino-terminated monolayer, ii) reaction with an amino-reactive fluorophore, iii) covalent attachment of a binding molecule...

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