Copper physical parameters

Main Physical Parameters of Copper and Silver in SI Units... 

In all our measurements we used crystals of copper metaborate prepared in the Institute of Physics SB RAS [5], The crystalline structure of CuB204 is tetragonal with space group I42d (d ) and has lattice parameters... 

Some cautioning remarks, however, should be added. Although an expression of the form of Equation (4) is in good agreement with the low-temperature oxidation data on copper, the physical significance of the two parameters, W and especially V, remains somewhat speculative. The general validity of Equation (4) should be evaluated systematically... 

Variation of heats of adsor-ption on different major crystal faces of copper. The effect of the crystal face of the adsorbent on physical adsorption has been treated theoretically by Barrer (153) for covalent surfaces and by Orr (151) and by Lenel (154) for dielectric surfaces. The vertical interactions between a nonpolar molecule and a polycrystalline metal surface have been independently treated by Lennard-Jones (155), by Bardeen (156), and by Margenau and Pollard (157). Considering the theoretical limitations involved in the last treatment, the observed agreement between the values calculated theoretically and the experimental values is acceptable. At present no explicit theoretical treatment of the physical adsorption of a nonpolar gas molecule on a single crystal metal surface in terms of the crystal parameter and geometry of the latter is available. 

Finally, we have proposed a model framework for copper CMP simulation. Characterization methods (masks with physical, electrical test structures) for single- and multi-level pattern-dependencies are also under development, and we are pursuing ways to overcome challenges in model parameter extraction and validation. 

Biological, chemical, and physical effects of airborne metals are a direct function of particle size, concentration, and composition. The major parameter governing the significance of natural and anthropogenic emissions of environmentally important metals is particle size. Metals associated with fine particulates are of concern particles larger than about 3-fjim aerodynamic equivalent diameter are minimally respirable, are ineffective in atmospheric interactions, and have a short air residence time. Seventeen environmentally important metals are identified arsenic, beryllium, cadmium, chromium, copper, iron, mercury, magnesium, manganese, nickel, lead, antimony, selenium, tin, vanadium, and zinc. This report reviews the major sources of these metals with emphasis on fine particulate emissions. 

The plasma parameters of f=5 cm mln (at STP), p=0.015 torr and w 100 watts are the same In all cases. The ESCA data Immediately affirm that both molybdenum and copper are Incorporated Into the polymer films although as previously noted the method of cathode erosion must be different In the two cases, (chemical plasma etching versus physical sputtering). Consideration of the relative signal Intensities, corrected for the total relative sensitivities of the core levels, derived from standard homogeneous samples, allows estimates of the empirical formulae to be written for these materials as follows [C3F4 oOo.6 °0.3ln... 

Figure 4.15 Effect of phase shift variations, as characterized by a CuOs phase shift adjustment parameter Af0( on values of structural parameters obtained for a silica-supported osmium-copper catalyst containing 2 wt% Os and 0.66 wt% Cu (32). (Fitting errors in lower two fields of figure provide a measure of the quality of data fit obtained.) (Reprinted with permission from the American Institute of Physics.)...

Parameter b is a fiinction of the physical properties of the additive and of the inhibition constant Ki . The exponent p was introduced arbitrarily to widen the range of fluxes over which inhibition occurs and obtain rounding of interior comers. It was determined necessary to have an exponent less than one to obtain rounded comers of the deposited copper profiles. 

A mass transfer model has been developed for the pulse plating of copper into high aspect ratio sub-0.25 micron trenches and vias. Surface and concentration overpotentials coupled with the shape change due to the deposition on the sidewalls and the bottom of the tiench/via with time have been explicitly accounted for in the model. Important parameters have been identified and their physical significance described. The resulting model equations have been solved numerically as a coupled non-linear free boundary problem. A complete parametric analysis has been performed to study the effect of the important parameters on the step coverage and deposition rate. In addition, a linear analytical model has also been developed to obtain key physical trends in the system. 

In processes traditionally referred to as physical adsorption there are considerable sensitivity and selectivity in the systems studied. Although Rhodin s[10] beautiful measurements on copper single crystals show a variation of physical adsorption parameters with crystal face... 

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