C epoxy resin

Fig 11 a-c Epoxy resins used to study epoxy network fracture, (a) DGEBA (diglycidyl ether of Bisphenol A) (b) DGEB (diglycidyl ether of butane diol (c) TGDDM (teraglycidyl of diaminodi-phenyl methane)... 

Shipment, Stora.ge, ndPrice. Butyrolactone is shipped in unlined steel tank cars and plain steel dmms. Plain steel, stainless steel, aluminum, and nickel are suitable for storage and handling mbber, phenoHcs, and epoxy resins are not suitable. Butyrolactone is hygroscopic and should be protected from moisture. Because of its low free2ing point (—44° C), no provision for heating storage vessels is needed. 

Epoxy Resins. The chemistry of epoxy resin adhesives is quite varied. However, the most widely used is that formed from the reaction of 4,4 -isopropyhdene diphenol (bisphenol A) [80-05-7] and epichlorohydrin [106-89-8] C H CIO. This epoxy resin is more commonly known as... 

Composite-Based Laminates. Grade CEM-1 are laminates with continuous-filament glass cloth surfaces and a cellulose core, all with a flame-resistant epoxy resin binder. With good punching practice, sheets up to and including 2.4 mm (0.094 in.) in thickness may be punched at temperatures not less than 23°C (73°F). These laminates meet UL94 V-0 when tested in accordance with UL94. 

The reaction is completed after 6—8 h at 95°C volatiles, water, and some free phenol are removed by vacuum stripping up to 140—170°C. For resins requiring phenol in only trace amounts, such as epoxy hardeners, steam distillation or steam stripping may be used. Both water and free phenol affect the cure and final resin properties, which are monitored in routine quaHty control testing by gc. OxaHc acid (1—2 parts per 100 parts phenol) does not require neutralization because it decomposes to CO, CO2, and water furthermore, it produces milder reactions and low color. Sulfuric and sulfonic acids are strong catalysts and require neutralization with lime 0.1 parts of sulfuric acid per 100 parts of phenol are used. A continuous process for novolak resin production has been described (31,32). An alternative process for making novolaks without acid catalysis has also been reported (33), which uses a... 

Aqueous dispersions are used in fiber bonding, paper coating, friction and abrasive appHcations, and laminates and wood bonding. PhenoHc dispersions improve the strength of latex-contact adhesive appHcations. Epoxy-modified phenoHc dispersions are prepared by dispersion of the phenoHc epoxy resin. The systems are used for baked primer appHcations and bonding requirements. Minimum baking conditions are 20 min at 150°C (25). 

Fig. 8. Flexural properties at elevated temperatures. Laminates constmcted from alternating pHes of 46.7-g (1.5-02) mat and 746-g/m (24-o2/yd ) woven roving at a nominal glass content of 45%. A represents bisphenol fumarate (T = 130° C) B, novolak epoxy methacrylate (T = 130° C) C, epoxy dimethacrylate (T = 100° C) D, isophthaUc resin (T = 100° C) and E, oAy f -phthahc resin (T = 80° C).

Practical methods for synthesis and elucidation of the optimum physical forms were developed at Du Pont (13). The violets fill the void in the color gamut when the inorganics are inadequate. The quinacridones may be used in most resins except polymers such as nylon-6,6, polystyrene, and ABS. They are stable up to 275°C and show excellent weatherabiUty. One use is to shade phthalocyanines to match Indanthrone Blue. In carpeting, the quinacridones are recommended for polypropylene, acrylonitrile, polyester, and nylon-6 filaments. Predispersions in plastici2ers ate used in thermoset polyesters, urethanes, and epoxy resins (14). 

Fig. 1. Structures of commercial epoxy resins (a) phenolic novolac epoxy resin, (b) glycidated polybasic acid, (c) glycidated polyamine (A,A,A, A -tetraglycidyl-4,4 -diaminodiphenylmethane [28768-32-3] (TGMDA)), and (d) glycidated bisphenol A.

This low viscosity resin permits cure at low (70°C) temperatures and rapidly develops excellent elevated temperature properties. Used to increase heat resistance and cure speed of bisphenol A epoxy resins, it has utihty in such diverse appHcations as adhesives, tooling compounds, and laminating systems. A moleculady distilled version is used as a binder for soHd propellants (see Explosives and propellants) and for military flares (see Pyrotechnics). Its chief uses depend on properties of low viscosity and low temperature reactivity, particularly with carboxy-terminated mbbers. 

Advancement Process. In the advancement process, sometimes referred to as the fusion method, Hquid epoxy resin (cmde diglycidyl ether of bisphenol A) is chain-extended with bisphenol A in the presence of a catalyst to yield higher polymerized products. The advancement reaction is conducted at elevated temperatures (175—200°C) and is monitored for epoxy value and viscosity specifications. The finished product is isolated by cooling and cmshing or flaking the molten resin or by allowing it to soHdify in containers. 

To improve the weatherabUity of epoxies, which normally chalk and yeUow, epoxy—polyester aUoys or hybrids are used. These powders with improved overbake resistance cure at temperatures as low as 130°C. They have film flexibiHty similar to epoxy resins, but their hardness is slightly decreased. Corrosion resistance is equivalent to epoxy powders in most cases, although solvent and alkaH resistance is inferior. 

A tank with a fixed cover of plain carbon steel for storing 60°C warm, softened boiler feed water that had a tar-pitch epoxy resin coating showed pits up to 2.5 mm deep after 10 years of service without cathodic protection. Two separate protection systems were built into the tank because the water level varied as a result of service conditions. A ring anode attached to plastic supports was installed near the bottom of the tank and was connected to a potential-controlled protection rectifier. The side walls were protected by three vertical anodes with fixed adjustable protection current equipment. 

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