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An example silicon

The point group of the wave vector P(q) at T is Oh. The classes of the factor group (R v) at T are given in Table 18.1. The characters are not reprinted here since at T[0 0 0] they are the characters of the point group Oh. When (i v) is (A Q), the characters for the basis ei e2) are those for A with the polar basis e), multiplied by two because /VR 2 in the notation of Chapter 9. When (R v) is (B w), the characters are zero since /VR 0 and the submatrices r,e (/i) occupy off-diagonal positions because the translation w exchanges the two atoms in the unit cell at i , and k2. Hence the characters x[(/t v)] at T are either 2 (R, 7 i ) or zero and so can be obtained from the character table for the point group Oh. This representation is reducible and, as shown in Table 18.1, [Pg.407]

The displacements at T are linear combinations of ei and e2 obtained by projecting an arbitrary, but suitably chosen, vector e(q) into the T and T2g subspaces using [Pg.407]

Note that the factor l u)p q) is omitted from the projection operator in eq. (4) and that common factors may also be omitted in the penultimate step of the derivations of eqs. (7) and (8) because the final eigenvector is always renormalized. [Pg.408]

(6) the two atoms in the unit cell vibrate in phase as in an acoustic mode, while in eq. (7) the two atoms in the unit cell vibrate in antiphase so that it is called an optic mode. [Pg.408]

The phase factor e = exp[—/q w] = exp[—inrj. Without this phase factor, the characters would be those of the point group C4V. [Pg.409]


This type of analysis requires several chromatographic columns and detectors. Hydrocarbons are measured with the aid of a flame ionization detector FID, while the other gases are analyzed using a katharometer. A large number of combinations of columns is possible considering the commutations between columns and, potentially, backflushing of the carrier gas. As an example, the hydrocarbons can be separated by a column packed with silicone or alumina while O2, N2 and CO will require a molecular sieve column. H2S is a special case because this gas is fixed irreversibly on a number of chromatographic supports. Its separation can be achieved on certain kinds of supports such as Porapak which are styrene-divinylbenzene copolymers. This type of phase is also used to analyze CO2 and water. [Pg.71]

Thin oxide films may be prepared by substrate oxidation or by vapour deposition onto a suitable substrate. An example of the fomrer method is the preparation of silicon oxide thin-films by oxidation of a silicon wafer. In general, however, the thickness and stoichiometry of a film prepared by this method are difficult to control. [Pg.941]

Figure Bl.22.4. Differential IR absorption spectra from a metal-oxide silicon field-effect transistor (MOSFET) as a fiinction of gate voltage (or inversion layer density, n, which is the parameter reported in the figure). Clear peaks are seen in these spectra for the 0-1, 0-2 and 0-3 inter-electric-field subband transitions that develop for charge carriers when confined to a narrow (<100 A) region near the oxide-semiconductor interface. The inset shows a schematic representation of the attenuated total reflection (ATR) arrangement used in these experiments. These data provide an example of the use of ATR IR spectroscopy for the probing of electronic states in semiconductor surfaces [44]-... Figure Bl.22.4. Differential IR absorption spectra from a metal-oxide silicon field-effect transistor (MOSFET) as a fiinction of gate voltage (or inversion layer density, n, which is the parameter reported in the figure). Clear peaks are seen in these spectra for the 0-1, 0-2 and 0-3 inter-electric-field subband transitions that develop for charge carriers when confined to a narrow (<100 A) region near the oxide-semiconductor interface. The inset shows a schematic representation of the attenuated total reflection (ATR) arrangement used in these experiments. These data provide an example of the use of ATR IR spectroscopy for the probing of electronic states in semiconductor surfaces [44]-...
As an example, we look at tire etching of silicon in a CF plasma in more detail. Flat Si wafers are typically etched using quasi-one-dimensional homogeneous capacitively or inductively coupled RF-plasmas. The important process in tire bulk plasma is tire fonnation of fluorine atoms in collisions of CF molecules witli tire plasma electrons... [Pg.2805]

Semiconductors may also be made from a maferial which is normally an insulator by infroducing an impurify, a process known as doping. Figure 9.9 shows fwo ways in which an impurify may promote semiconducting properties. In Figure 9.9(a) fhe dopanf has one more valence election per atom fhan fhe hosf and confribufes a band of filled impurify levels 1 close to fhe conduction band of fhe hosf. This characterizes an n-fype semiconductor. An example is silicon (KL3s 3p ) doped wifh phosphoms (KL3s 3p ), which reduces fhe band gap to abouf 0.05 eY Since kT af room femperafure is abouf 0.025 eY the phosphoms... [Pg.350]

Alternatively, as in Figure 9.9(b), a dopant with one valence electron fewer than the host contributes an impurity band 1 which is empty but more accessible to electrons from the valence band. An example of such a p-type semiconductor is silicon doped with aluminium KL3s 3p ) in which the band gap is about 0.08 eY... [Pg.351]

The implanted ion can be singly or multiply charged and can be any isotope. The mass separation system is used to avoid contamination. As an example, when implanting silicon the isotope is often used instead of to avoid contamination from the signals. After mass... [Pg.382]

The physical structures of microchip assemblies usually contain a number of thin films in contact, each of which plays a separate role in the performance of the device. As an example, in one structure a silicon thin film would be contacted on one face by a copper rod which conducts away die heat generated during computer operations, and on the other face by an aluminium thin film which acts as a connector to other silicon films. This aluminium film is in turn in contact with a ceramic layer containing other thin film devices, and widr copper pins which plug into the circuit board. [Pg.219]

As an example, a tank farm that is to be cathodically protected by this method is shown schematically in Fig. 11-4. As can be seen in the figure, injection of the protection current occurs with two current circuits of a total of about 9 A, via 16 vertically installed high-silicon iron anodes embedded in coke. These are distributed over several locations in the tank farm to achieve an approximately uniform potential drop. The details of the transformer-rectifier as well as the individual anode currents are included in Fig. 11-4. Anodes 4, 5 and 6 have been placed at areas where corrosion damage previously occurred. Since off potentials for 7/ -free potential measurements cannot be used, external measuring probes should be installed for accurate assessment (see Section 3.3.3.2 and Chapter 12). [Pg.300]

As an example of the use of AES to obtain chemical, as well as elemental, information, the depth profiling of a nitrided silicon dioxide layer on a silicon substrate is shown in Figure 6. Using the linearized secondary electron cascade background subtraction technique and peak fitting of chemical line shape standards, the chemistry in the depth profile of the nitrided silicon dioxide layer was determined and is shown in Figure 6. This profile includes information on the percentage of the Si atoms that are bound in each of the chemistries present as a function of the depth in the film. [Pg.321]

High mass resolution techniques are used to separate peaks at the same nominal mass by the very small mass differences between them. As an example, a combination of Si and H to form the molecular ion Si H , severely degrades the detection limit of phosphorous ( P) in a silicon sample. The exact mass of phosphorous ( P) is 31.9738 amu while the real masses of the interfering Si H and Si H2 molecules are 31.9816 amu and 31.9921 amu, respectively. Figure 8 shows a mass... [Pg.543]

An example of an analysis done on polysilicon and single-crystal Czochralski silicon (CZ) is shown in Table 1. As can be seen, polysilicon, which was used to grow the crystal, is dirtier than the CZ silicon. This is expected, since segregation coefficients limit the incorporation of each element into the crystal boule during the crystal growth process. All values shown in the table are from bulk analysis. Table 2 shows NAA data obtained in an experiment where surface analysis was accom-... [Pg.676]

As an example, consider again the back surface of the silicon wafer used in the mechanical profiler example. Eigure 4a, an SEM micrograph taken at 45° tilt, shows a surface covered with various sized square-shaped features that often overlap. This information cannot be discerned from the mechanical profiler trace, but can be obtained using a 3D optical profiler measurement. Eigures 4b and 4c are also... [Pg.701]

An example of the first type is the emulsion stabiliser as exemplified by sodium oleyl sulphate, cetyl pyridinium chloride and poly(ethylene oxide) derivatives. For a number of applications it is desirable that the latex be thickened before use, in which case thickening agents such as water-soluble cellulose ethers or certain alginates or methacrylates may be employed. Antifoams such as silicone oils are occasionally required. [Pg.355]

An example of a Maugis-Pollock system is polystyrene particles having radii between about 1 and 6 p.m on a polished silicon substrate, as studied by Rimai et al. [64]. As shown in Fig. 4, the contact radius was found to vary as the square root of the particle radius. Similar results were reported for crosslinked polystyrene spheres on Si02/silicon substrates [65] and micrometer-size glass particles on silicon substrates [66]. [Pg.159]

A WBL can also be formed within the silicone phase but near the surface and caused by insufficiently crosslinked adhesive. This may result from an interference of the cure chemistry by species on the surface of substrate. An example where incompatibility between the substrate and the cure system can exist is the moisture cure condensation system. Acetic acid is released during the cure, and for substrates like concrete, the acid may form water-soluble salts at the interface. These salts create a weak boundary layer that will induce failure on exposure to rain. The CDT of polyolefins illustrates the direct effect of surface pretreatment and subsequent formation of a WBL by degradation of the polymer surface [72,73]. [Pg.698]

Figure 8.30 shows an example of displacement ventilation in a silicon carbide furnace room. Ihe thermal stratification is very strong, as indicated in the graph on the right-hand side of the figure. [Pg.649]


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