Composites adhesion

Polyphenylquinoxalines (PPQ) are easier to make than the polyquinoxalines and offer superior solubiHty, processibiHty, and thermooxidative stabiHty (65). The PPQs exhibit excellent high temperature adhesive, composite, and film properties. However, to increase the use temperature of PPQs, acetylene... 

Knoevenagel condensation of malonic acid with heptaldehyde [111-71-7] followed by ring closure, gives the fragrance y-nonanoic lactone [104-61-0] (6) (14). Beside organic synthesis, malonic acid can also be used as electrolyte additive for anodization of aluminum [7429-90-5] (15), or as additive in adhesive compositions (16). 

Even the earliest reports discuss the use of components such as polymer syrups bearing carboxylic acid functionality as a minor component to improve adhesion [21]. Later, methacrylic acid was specifically added to adhesive compositions to increase the rate of cure [22]. Maleic acid (or dibasic acids capable of cyclic tautomerism) have also been reported to increase both cure rate and bond strength [23]. Maleic acid has also been reported to improve adhesion to polymeric substrates such as Nylon and epoxies [24]. Adducts of 2-hydroxyethyl methacrylate and various anhydrides (such as phthalic) have also been reported as acid-bearing monomers [25]. Organic acids have a specific role in the cure of some blocked organoboranes, as will be discussed later. 

Part of adhesive composition responsible for adhesive forces. 

It should also be noted that for many of the applications where volume expansion is required (adhesives, composites, etc.) a crosslinked product is desirable and some monomers have been designed with this in mind. This does, however, make the products difficult to characterize. Some monomers with potential for double ring-opening are reported in fable 4.8. 

Aqueous, removable, pressure-sensitive adhesive compositions, useful for high-performance applications, comprise a mixture of a copolymer of alkyl (meth)acrylate and N-substituted (poly)amide of (meth)acrylic acid and a copolymer of alkyl (meth)acrylate and ethylenically unsaturated carboxylic acid, where at least one of the copolymers is an emulsion copolymer. Polyoxyalkyl-enes and phosphate esters may be used as surfactants [234]. 

Example Three Component Multiresponse Optimization. An adhesive composition consisting of three components was under developmental evaluation. Twelve formulations were prepared consisting of compositions within the following pseudocomponent ranges ... 

Used industrially as a chemical intermediate in the production of rayon, carbon tetrachloride, xanthogenates, flotation agents, and pesticides used in the cold vulcanization of vulcanized rubber, in adhesive compositions for food packaging as a solvent for phosphorus, sulfur, selenium, bromine, iodine, fats, resins, rubbers, waxes, lacquers, camphor, resins and in the production of optical glass, paints, enamels, varnishes, paint removers, tallow, putty preservatives, rubber cement, soil disinfectants, explosives, rocket fuel, and electronic vacuum tubes. 

Adhesive bonds, 1 501-502 breaking, 1 513-517 practical strength of, 1 517-521 Adhesive compositions, 1 524-525 Adhesive joints, 1 501-502 Adhesive polychloroprene grades, 19 852 Adhesive resins, amino acid resins,... 

Thermosetting resins have been used extensively in industry for applications such as structural adhesives, composites, RIM, coatings and sealants which need to resist severe service conditions. Thermosetting resins are generally composed of low molecular weight oligomers which allow fabrication convenience. 

SS-LINKED POLYMERS ARE USED in a wide variety of aerospace, automotive, building construction, and consumer product applications. Not all paints, adhesives, composites, and elastomers are cross-linked, but cross-linking systems are often used in these applications when resistance to solvents, resistance to high temperatures, and high mechanical performance are required. These important properties can be traced directly to the three-dimensional interconnected molecular network that is characteristic of cross-linked systems. 

A pressure-sensitive self-adhesive composition capable of compensating for substrate unevennesses was prepared by Massow et al. (2) and consisted of natural rubber and tackiher resins. 

Perhaps the biggest thrust for the development of high performance polymers over the next 10 years will be in the aerospace industry where materials will be required for a fleet of high speed civil transports (supersonic transports). At a speed of Mach 2.4, an aircraft surface temperature of about 150 to 180°C will be generated. The life requirement of materials at these temperatures will be about 60000 hours. Many different types of materials such as adhesives, composite matrices, fuel tank sealants, finishes and windows will be needed. These materials must exhibit a favorable combination of processability, performance and price. The potential market for these materials total several billions of US dollars. 

Silicone functionalized PIB is particularly suitable as a pressure sensitive adhesive composition in medical applications including transdermal drug delivery applications (83). 

The above described pressure sensitive adhesive compositions are especially suitable for assisting in delivering a bioactive agent, such as a drug to a bioactive-agent-accepting substrate, i.e., the patient s skin. The pressure sensitive adhesive composition may be employed in three modes of bioactive agent delivery (83). 

The first mode is by incorporating the bioactive agent in the pressure sensitive adhesive composition, which is thereafter attached to the substrate to commence delivery. 

The second mode of delivery is by attaching a membrane of the pressure sensitive adhesive composition to the substrate and contacting a reservoir or matrix including a bioactive agent to the attached membrane. The bioactive agent may then pass from the reservoir or matrix through the attached membrane and to the substrate for absorption. 

D.K. Fisher, Hot melt pressure sensitive adhesive composition for attaching roofing membranes, US Patent 6794449, assigned to Adco Products, Inc. (Michigan Center, MI), September 21, 2004. 

P.W. Pretzer and R.P. Sweet, Silicone pressure sensitive adhesive composition containing functionalized polyisobutylene, US Patent 5 939 477, assigned to Dow Coming Corporation (Midland, MI), August 17,1999. 

A hot melt adhesive composition has been described that contains two types of EVA, further a hydrogenated petroleum hydrocarbon resin. This resin is obtained from a petroleum feedstock followed by hydrogenation (25). 

Hot melt adhesive compositions are used among others to bond edgebands. During edgebanding, the hot melt adhesive is maintained in the molten state in the glue pot of the edgebanding apparatus for extended periods of time. Fillers are added to hot melt adhesive compositions in order to decrease the costs of the adhesive composition and to improve the break action, such that it provides a clean break from the roller during the application procedure (25). 

H. Okazaki and T. Ohkubo, Vinyl acetate-ethylene copolymer emulsion and aqueous emulsion adhesive composition containing the emulsion, US Patent 4446274, assigned to Denki Kagaku Kogyo Kabushiki Kaisha (Tokyo, JP), May 1,1984. 

C.A. Jones and L. Chernyak, Ethylene-vinyl acetate hot melt adhesive composition and article and method incorporating the same, US Patent 6 765 054, assigned to H. B. Fuller Licensing Financing Inc. (St. Paul, MN), July 20,2004. 

Zinc oxide is used as a catalyst in organic syntheses (e.g., of methanol), often in conjunction with other oxides. It is present in some adhesive compositions. 

Three classes of PSAs used most widely in transdermal systems are polyisobutylene (PIB), polyacrylate, and polydimethylsiloxane (silicone). More recently, hydrophilic adhesive compositions, hydrogels composed of high-molecular-weight polyvinylpyrrolidon (PVP) and oligometric polyethylene oxide (PEO), have been shown to be compatible with a broad range of drugs and are used in several commercial products.60... 

In Secs. 13.2-13.3 the principles of toughening of thermosets by rubber particles, and the role of morphologies, interfacial adhesion, composition, and structural parameters on the toughening effect are analyzed. Section 13.4 is devoted to the use of initially miscible thermoplastics for toughening purposes. The effect of core-shell rubber particles is discussed in Sec. 13.5 and, in Sec. 13.6, miscellaneous ways of toughening thermosets (liquid crystals, hybrid composites, etc.), are analyzed. 

Miktoarm stars of the type (PS-b-PI)n(PI)m prepared using DVB as linking agent were employed in adhesive compositions, showing a good balance of tack, peel strength and hold power near room temperature due to their reduced cohesive strength and viscosity without any reduction in the service temperature... 

JP 05125345 (Japanese) 1993 Poly(vinyl butyral) blend adhesive composition for flexible printed circuit boards Ube Industries, Japan H Inoe, S Takabayashi, T Muramatsu, T Funakoshi Formulated resins having good flexibility and heat resistance are useful adhesives for polyimide/Cu foil laminated circuit boards Maleimide-terminated siloxane-imide block copolymers were formulated with poly(vinyl butyral) and melamine resins to give adhesive compositions. 

JP 05306386 (Japanese) 1993 Heat-resistant adhesive composition Ube Industries, Japan H Inoe, S Takabayashi, T Muramatsu, T Hirano Resin formulation useful for bonding Cu foils to polyimide films for electronic applications Heat-resistant adhesives were formulated to include imide-siloxanes with softening points <300° C. Diaminopolysiloxanes and aromatic amines were used maleimide termination also utilized. 

JP 05311144 (Japanese) 1993 Heat-resistant adhesive compositions containing polyimide-siloxane block copolymers Ube Industries, Japan H Inoe, S Takabayashi, T Funakoshi, K Sonoyana Useful for Cu-clad laminates of printed circuit boards and tape-automated bonding with good flexibility and heat resistance Formulated compositions containing siloxane-imide block copolymers made from aromatic tetracarboxylic acids and aromatic diamines and aminosiloxanes... 

Morishige S, Kaneda K, Terajima K, Takeda T, Sakamoto Y, Suzuki T. Polyimide adhesive compositions for ceramics and semiconductor devices. Eur Pat Appl EP 531867 A1 930317 10 pp... 

Inoue H Takabayash S Muramatsu T, Funagoshi T, Hirano T. Polyimide-siloxane block copolymer-based heat-resistant adhesive compositions. US Patent 5180627 A 930119 11 pp... 

Tyres, footwear, moulded goods, paints Foam padding, surfaces, elastomers Barrier, extrusion, moulded goods Surface coatings, adhesives, composites Personal care products... 

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