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Vinyl acetate compounds

Figure 3. Rate of Heating vs Glass Transition Temperature for Poly (vinyl acetate) Compound. Figure 3. Rate of Heating vs Glass Transition Temperature for Poly (vinyl acetate) Compound.
Ethylene-Vinyl Acetate Copolymers (EVAc). The majority of EVAc is used for hard tack-free hot-melt adhesives. Pressure-sensitive properties can be achieved with types containing 40 - 60% vinyl acetate compounded with compatible resins. EVAc-based PSAs are used only for specialty tapes. [Pg.106]

Vinyl compounds. Vinyl chloride (prepared from acetylene and hydrogen chloride) 3 ields polyvinyl chloride (P.V.C.), which is employed as a rubber substitute and for other purposes. Vinyl acetate (from... [Pg.1015]

Uses. The a2obisnitriles have been used for bulk, solution, emulsion, and suspension polymeri2ation of all of the common vinyl monomers, including ethylene, styrene vinyl chloride, vinyl acetate, acrylonitrile, and methyl methacrylate. The polymeri2ations of unsaturated polyesters and copolymeri2ations of vinyl compounds also have been initiated by these compounds. [Pg.224]

This type of adhesive is generally useful in the temperature range where the material is either leathery or mbbery, ie, between the glass-transition temperature and the melt temperature. Hot-melt adhesives are based on thermoplastic polymers that may be compounded or uncompounded ethylene—vinyl acetate copolymers, paraffin waxes, polypropylene, phenoxy resins, styrene—butadiene copolymers, ethylene—ethyl acrylate copolymers, and low, and low density polypropylene are used in the compounded state polyesters, polyamides, and polyurethanes are used in the mosdy uncompounded state. [Pg.235]

Pentaerythritol is used in self-extinguishing, non dripping, flame-retardant compositions with a variety of polymers, including olefins, vinyl acetate and alcohols, methyl methacrylate, and urethanes. Phosphoms compounds are added to the formulation of these materials. When exposed to fire, a thick foam is produced, forming a fire-resistant barrier (see Elame retardants) (84—86). [Pg.466]

A series of compounded flame retardants, based on finely divided insoluble ammonium polyphosphate together with char-forming nitrogenous resins, has been developed for thermoplastics (52—58). These compounds are particularly useful as iatumescent flame-retardant additives for polyolefins, ethylene—vinyl acetate, and urethane elastomers (qv). The char-forming resin can be, for example, an ethyleneurea—formaldehyde condensation polymer, a hydroxyethylisocyanurate, or a piperazine—triazine resin. [Pg.476]

Tetraethylene glycol may be used direcdy as a plasticizer or modified by esterification with fatty acids to produce plasticizers (qv). Tetraethylene glycol is used directly to plasticize separation membranes, such as siHcone mbber, poly(vinyl acetate), and ceUulose triacetate. Ceramic materials utilize tetraethylene glycol as plasticizing agents in resistant refractory plastics and molded ceramics. It is also employed to improve the physical properties of cyanoacrylate and polyacrylonitrile adhesives, and is chemically modified to form polyisocyanate, polymethacrylate, and to contain siHcone compounds used for adhesives. [Pg.363]

In order to increase the solubiUty parameter of CPD-based resins, vinyl aromatic compounds, as well as other polar monomers, have been copolymerized with CPD. Indene and styrene are two common aromatic streams used to modify cyclodiene-based resins. They may be used as pure monomers or contained in aromatic steam cracked petroleum fractions. Addition of indene at the expense of DCPD in a thermal polymerization has been found to lower the yield and softening point of the resin (55). CompatibiUty of a resin with ethylene—vinyl acetate (EVA) copolymers, which are used in hot melt adhesive appHcations, may be improved by the copolymerization of aromatic monomers with CPD. As with other thermally polymerized CPD-based resins, aromatic modified thermal resins may be hydrogenated. [Pg.355]

Ethylene vinyl acetate (EVA) polymers are used in thermoplastic and thermosetting jacketing compounds for apphcations that require flame retardancy combined with low smoke emission during the fire as well as the absence of halogen in the composition. [Pg.329]

Many different combinations of surfactant and protective coUoid are used in emulsion polymerizations of vinyl acetate as stabilizers. The properties of the emulsion and the polymeric film depend to a large extent on the identity and quantity of the stabilizers. The choice of stabilizer affects the mean and distribution of particle size which affects the rheology and film formation. The stabilizer system also impacts the stabiUty of the emulsion to mechanical shear, temperature change, and compounding. Characteristics of the coalesced resin affected by the stabilizer include tack, smoothness, opacity, water resistance, and film strength (41,42). [Pg.464]

Poly(vinyl acetate) emulsions can be made with a surfactant alone or with a protective coUoid alone, but the usual practice is to use a combination of the two. Normally, up to 3 wt % stabilizers may be included in the recipe, but when water sensitivity or tack of the wet film is desired, as in some adhesives, more may be included. The most commonly used surfactants are the anionic sulfates and sulfonates, but cationic emulsifiers and nonionics are also suitable. Indeed, some emulsion compounding formulas require the use of cationic or nonionic surfactants for stable formulations. The most commonly used protective coUoids are poly(vinyl alcohol) and hydroxyethyl cellulose, but there are many others, natural and synthetic, which are usable if not preferable for a given appHcation. [Pg.464]

Other. Vinyl acetate resins are useful as antishrinking agents for glass fiber-reinforced polyester mol ding resins (165). Poly(vinyl acetate)s are also used as binders for numerous materials, eg, fibers, leather (qv), asbestos, sawdust, sand, clay, etc, to form compositions that can be shaped with heat and pressure. Joint cements, taping compounds, caulks, and fillers are other uses. [Pg.471]

Siding. The resin most used for siding is poly(vinyl chloride) homopolymer, compounded with modifiers, stabilizers, and pigments. Modifiers are most often acryhc esters, followed by chlorinated polyethylene or ethylene—vinyl acetate, used at 6—8 phr (parts per hundred resin). The modifier increases the impact strength of the rigid PVC. [Pg.334]

The cadmium chalcogenide semiconductors (qv) have found numerous appHcations ranging from rectifiers to photoconductive detectors in smoke alarms. Many Cd compounds, eg, sulfide, tungstate, selenide, teUuride, and oxide, are used as phosphors in luminescent screens and scintiUation counters. Glass colored with cadmium sulfoselenides is used as a color filter in spectroscopy and has recently attracted attention as a third-order, nonlinear optical switching material (see Nonlinear optical materials). DiaLkylcadmium compounds are polymerization catalysts for production of poly(vinyl chloride) (PVC), poly(vinyl acetate) (PVA), and poly(methyl methacrylate) (PMMA). Mixed with TiCl, they catalyze the polymerization of ethylene and propylene. [Pg.392]

Although current matrix diffusional systems are most suitable for small-molecule compounds, it has been demonstrated (84) that soHd hydrophobic polymers allow dispersed powdered macromolecules of nearly any size, for example, ethylene—vinyl acetate copolymers containing dispersed polypeptides, to be released for periods exceeding 100 days. [Pg.144]

JKinj/ compounds ethylene, R = H styiene, R = CgH vinyl acetate, R = OOCCH3... [Pg.431]

Vinyl chloride-vinyl acetate copolymers have lower softening points than the homopolymers and compounds and may be processed at lower temperatures than... [Pg.345]


See other pages where Vinyl acetate compounds is mentioned: [Pg.22]    [Pg.22]    [Pg.111]    [Pg.419]    [Pg.1014]    [Pg.20]    [Pg.36]    [Pg.363]    [Pg.385]    [Pg.479]    [Pg.375]    [Pg.459]    [Pg.463]    [Pg.463]    [Pg.469]    [Pg.470]    [Pg.471]    [Pg.482]    [Pg.489]    [Pg.396]    [Pg.134]    [Pg.259]    [Pg.538]    [Pg.39]    [Pg.83]    [Pg.148]    [Pg.134]    [Pg.239]    [Pg.276]    [Pg.333]    [Pg.360]    [Pg.472]   
See also in sourсe #XX -- [ Pg.143 , Pg.144 , Pg.145 ]




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