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Titanium-silicon alloy

Titanium silicalite Titanium silicates Titanium-silicon alloy Titanium slag Titanium suboxides... [Pg.998]

Titanium pyrophosphate, 25 57 Titanium sesquioxide, 25 14 Titanium sesquisulfide, 25 58 Titanium silicates, 25 56, 102 Titanium silicides, 25 55—56 Titanium—silicon alloy, 22 520 Titanium silicon compounds, 25 55—56 Titanium slag, 19 388, 389 Titanium sponge... [Pg.955]

Win73] Winstone, M.R., Rawlings, R.D., and West, D.R.F., Dynamic Strain Aging in Some Titanium-Silicon Alloys, J. [Pg.80]

Aluminum drillpipe is generally made of 2014 type aluminum-copper alloy. Composition of this alloy is 0.50 to 1.20% silicon, 1.00% iron maximum, 3.90 to 5.0% copper, 0.40 to 1.20% manganese, 0.25% zinc maximum and 0.05% titanium. The alloy is heat treated to T6 conditions that represent 64 ksi tensile strength, 58 Ksi yield strength, 7% elongation and a Hbn of 135- Aluminum drillpipe generally comes with steel tool joints that are threaded on to ensure maximum strength that cannot be attained with aluminum joints. [Pg.1258]

Copper is intrinsically a better metal than aluminum for the metallization of IC s. Latest developments in MOCVD show that it can be readily deposited without major changes in existing processing equipment. Diffusion problems are minimized and it appears that present barrier materials, such as titanium nitride or titanium-tungsten alloys, should provide adequate diffusion barriers for the copper-silicon couple, certainly up to the highest temperatures presently used in IC s processing (see Ch. 6). The development of CVD copper for semiconductor metallization is on a considerable scale at this time.Clt ]... [Pg.371]

Vanadium—Silicon. Vanadium—silicon alloy is made by the reduction of vanadium oxides with silicon in an electric furnace. Application is essentially the same as that of the titanium alloys. Vanadium alloys sometimes offer the most economical way of introducing vanadium into molten steel. [Pg.541]

Iron—manganese alloy, see Ferromanganese, 4383 f Iron pentacarbonyl, see Pentacarbonyliron, 1808a Iron pyrites, see Iron disulfide, 4395 Iron—silicon alloy, see Ferrosilicon, 4384 Iron—titanium alloy, see Ferrotitanium, 4385 t Isobutene, see 2-Methylpropene, 1577 t Isobutyl acetate, 2496... [Pg.2103]

Lead—tin alloys, 4877 Lead—zirconium alloys, 4878 Lithium—magnesium alloy, 4676 Lithium—tin alloys, 4677 Plutonium bismuthide, 0231 Potassium antimonide, 4668 Potassium—sodium alloy, 4641 Silicon—zirconium alloys, 4904 Silver—aluminium alloy, 0002 Silvered copper, 0003 Sodium germanide, 4412 Sodium—antimony alloy, 4791 Sodium—zinc alloy, 4792 Titanium—zirconium alloys, 4915... [Pg.2238]

Discaloy [Westinghouse], TM for an austenitic iron-base alloy containing nickel, chromium, and relatively small proportions of molybdenum, titanium, silicon, and manganese. This alloy is precipitation-hardened and was developed primarily to meet the need for improved gas-turbine disks, one of the most critical components of jet engines. [Pg.469]

High-temperature treatment of silicon- or titanium-containing alloys leads to the formation of crystalline titania or silica surface layers with thicknesses in the micrometer range, as demonstrated by Seo et al., who used these materials for the construction of heat exchangers with catalyti-cally active surfaces [166]. However, the thermal treatment of nickel alloys that also contain iron leads to a layer of amorphous iron oxide, which is not suitable for depositing catalytic materials [167]. [Pg.86]

The titanium alloys are not heat resisting materials being inferior to stainless steel in this respect. Recently titanium-based alloys alloyed with silicon, aluminium, zirconium (elements which considerably enhance heat resistance of technical metals Fe, Co, Ni) were elaborated in IPMS of NASU... [Pg.253]

Cathodic protection by impressed current involves the use of a rectifier connected to a power line. Contrary to sacrificial anodes, which operate at a fixed potential, the use of a rectifier permits to adjust the voltage (or the current) to the particular requirements of a protection scheme. This not only allows one to optimize the electrochemical conditions for protection, but the method is also well suited to protect large surfaces. On the other hand, protection by impressed current needs more maintenance than the use of sacrificial anodes. In order to protect buried structures by impressed currents one uses consumable anodes such as scrap iron or, more often, non-consumable anodes made of iron-silicon alloy, graphite or of titanium coated with noble-metal oxides. [Pg.566]

The cells can be made of either an Li-Al or lithium-silicon alloy as the anode and a GVD thin film of titanium disulfide as the cathode. [Pg.300]

Fig. 9.4 High-temperature titanium-tsase alloys for aircraft-engine applications. Year of introduction and operating-temperature capability under optimum stress conditions. The suffix S indicates that a small amount of silicon (usually 0.25 wt%) has been added to the basic formulation [Ble85]. Fig. 9.4 High-temperature titanium-tsase alloys for aircraft-engine applications. Year of introduction and operating-temperature capability under optimum stress conditions. The suffix S indicates that a small amount of silicon (usually 0.25 wt%) has been added to the basic formulation [Ble85].
Kri85 ] Krishnamurthy, S., Jackson, A.G., Weiss, I., and Froes, FJI., Aging Response of Rapidly Solidified Titanium-Ibngsten Alloys with Nickel and Silicon Additions, in Rapidly Solidified Materials, P.W. Lee and R.S. Carbon-ara, Ed., American Society for Metals, 1985, p. 121-127... [Pg.75]

Ti-5621S is a semicommercial alloy developed by RMI Titanium Company in the mid-1960s to extend the use of titanium-base alloys to 540 °C (1000 °F). The 3-lean a-t- 3 alloy combines a well-selected alpha base with small additions of the p-sta-bilizers molybdenum and silicon to optimize creep resistance and thermal stability. n-5621S has good tensile and stress-rupture properties up to 540 °C (1000 °F), combined with excellent creep. It can be machined and formed at room temperature or warm forming temperatures of 425 to 540 °C (800 to 1000 °F) and can be welded. [Pg.253]

Figure 31 Structure of IBM s solder bumps fabricated at the wafer scale before integrated circuits are connected to wiring boards by the flip chip technology (a) integrated circuit with an area array of solder bumps (b) exploded view showing the bump structure with silicon substrate 1, aluminium bonding pad 2, silicon dioxide 3, silicon nitride passivation 4, titanium-tungsten alloy 5, sputtered copper 6, plated copper 7, and reflowed plated... Figure 31 Structure of IBM s solder bumps fabricated at the wafer scale before integrated circuits are connected to wiring boards by the flip chip technology (a) integrated circuit with an area array of solder bumps (b) exploded view showing the bump structure with silicon substrate 1, aluminium bonding pad 2, silicon dioxide 3, silicon nitride passivation 4, titanium-tungsten alloy 5, sputtered copper 6, plated copper 7, and reflowed plated...
Other alloying elements are added for improved corrosion resistance, fabricability, and variations in strength. These elements include appreciable amounts of nickel, molybdenum, copper, titanium, silicon, aluminum, sulfur, and many others that cause pronovmced metallurgical changes. The commonly recognized standard types of stainless steels follow. The chemical compositions of stainless steels are given in App. F. [Pg.711]

Pan] Panseri, C, Guastalla, B., Investigations on the Permanent Modifieation of Euteetie Aluminium-Silicon Alloys. I.-Influence of Titanium Additions as the Third Component (in Italian), 10(5), 202-227 (1941) (Phase Diagram, Experimental, Review, 161)... [Pg.268]


See other pages where Titanium-silicon alloy is mentioned: [Pg.541]    [Pg.541]    [Pg.539]    [Pg.335]    [Pg.840]    [Pg.234]    [Pg.539]    [Pg.2426]    [Pg.398]    [Pg.2338]    [Pg.139]    [Pg.10]    [Pg.412]    [Pg.206]    [Pg.335]    [Pg.701]    [Pg.414]    [Pg.256]    [Pg.102]    [Pg.252]    [Pg.323]    [Pg.208]    [Pg.221]    [Pg.176]    [Pg.191]    [Pg.898]    [Pg.899]   


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