Thin film vapor deposition technologies

One of the most obvious markets for thin-film vapor-deposited organic materials is in flat panel displays [123], a market currently dominated by LCDs. Over the last two decades, a great improvement in the lifetime and efficiency of OLEDs have been achieved. OLED displays can already be found in simple applications such as automobile stereos, mobile phones, and digital cameras. However, to exploit the advantages of the technology fully, it is necessary to pattern the OLEDs to form monochrome, or more preferentially, full-color displays. This section will consider the difficulties involved in addressing such displays (either passively or actively) and the variety of patterning methods that can be used to produce full-color displays. 

Bare die and other chip devices are attached with electrically conductive or nonconductive adhesives to ceramic substrates having defined circuit patterns produced by thin-film vapor deposition and photoetching of metals or by screen-printing and firing of thick-film pastes. With recent advancements in fine-line printed-circuit boards, adhesives are also finding use in attaching bare die to PWBs, a technology known as chip-on-board (COB). 

Thin film science and technology is the deposition and characterization of layered structnres, typically less than a micron in thickness, which are tailored from the atomic scale upwards to achieve desired functional properties. Deposition is the synthesis and processing of thin films under controlled conditions of chemical processing. Chemical vapor deposition (CVD) and gas-phase molecular beam epitaxy (MBE) are two processes that allow control of the composition and structure of the films. Characterization is the instrumentation that use electrons, X-ray, and ion beams to probe the properties of the film. Epitaxial films of semiconductors are used for their electronic properties to emit light in the infrared (IR) and the ultraviolet rays. 

Germanium difluoride can be prepared by reduction (2,4) of GeF by metallic germanium, by reaction (1) of stoichiometric amounts of Ge and HF in a sealed vessel at 225°C, by Ge powder and HgF2 (5), and by GeS and PbF2 (6). Gep2 has been used in plasma chemical vapor deposition of amorphous film (see Plasma TECHNOLOGY Thin films) (7). 

The U.S. electronics industry appears to be ahead of, or on a par with, Japanese industry in most areas of current techniques for the deposition and processing of thin films—chemical vapor deposition (CVD), MOCVD, and MBE. There are differences in some areas, thongh, that may be cracial to future technologies. For example, the Japanese effort in low-pressure microwave plasma research is impressive and surpasses the U.S. effort in some respects. The Japanese are ahead of their U.S. counterparts in the design and manufacture of deposition equipment as well. 

GaN as a semi-conducting material for electronics is about to be launched on the market, especially for the use in blue- and UV-emitting LEDs and laser diodes [2]. The material is deposited on crystalline substrates like sapphire using thin-film epitactical techniques. Often, metal-organic chemical vapor deposition (MOCVD) is used. The necessity for such technologies limits the production rate and pushes up costs. 

Compares ink jet printing and vapor phase deposition technologies for thin films preparation... 

Thin semiconductor films (and other nanostructured materials) are widely used in many applications and, especially, in microelectronics. Current technological trends toward ultimate miniaturization of microelectronic devices require films as thin as less than 5 nm, that is, containing only several atomic layers [1]. Experimental deposition methods have been described in detail in recent reviews [2-7]. Common thin-film deposition techniques are subdivided into two main categories physical deposition and chemical deposition. Physical deposition techniques, such as evaporation, molecular beam epitaxy, or sputtering, involve no chemical surface reactions. In chemical deposition techniques, such as chemical vapor deposition (CVD) and its most important version, atomic layer deposition (ALD), chemical precursors are used to obtain chemical substances or their components deposited on the surface. 

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