Deposition equipment

Performance in Colter. The modified monomer should perform well ia commercial deposition equipment. Performance considerations iaclude the growth rate of the coating, the uniformity of thickness of the coating over the chamber volume, and the efficiency with which the dimer is converted to useful coatings on the substrates. 

An important further constraint is the fact that economic considerations ia the constmction of deposition equipment normally lead to a preference for an ambient temperature deposition chamber. Control of deposition temperature is possible, but it adds both equipment expense and operational complexity. 

Figure 5.11. Atmospheric deposition equipment for Si02 and glass. (Source Watkins-Johnson, Palo Alto, CA)...

The U.S. electronics industry appears to be ahead of, or on a par with, Japanese industry in most areas of current techniques for the deposition and processing of thin films—chemical vapor deposition (CVD), MOCVD, and MBE. There are differences in some areas, thongh, that may be cracial to future technologies. For example, the Japanese effort in low-pressure microwave plasma research is impressive and surpasses the U.S. effort in some respects. The Japanese are ahead of their U.S. counterparts in the design and manufacture of deposition equipment as well. 

The application of this technique in conventional RF deposition equipment revealed the possibility of producing microcrystalline silicon at relatively low power densities and temperatures [501]. Depending on deposition conditions, (i.e., deposition cycle time, hydrogen exposure time, and power density), different microcrystalline fractions are found see [165,251,502]. 

The possibility to grow good-quality thin films at room temperature and normal pressure is the main advantage of SILAR relative to the gas-phase techniques. Moreover, since vacuum systems are not required, SILAR deposition equipment is simple and inexpensive. Similarly, toxic chemicals, such as selenium compounds, which are easier and safer to handle as solutions than as gases, can be more conveniently employed in SILAR. From the environmental point of view, a notable advantage of SILAR is that the system is totally closed and all the chemicals that are used are recyclable. Compared with other solution-phase methods, especially with CBD, an important advantage of SILAR is the facile control over film thickness using... 

Figure 8.2. First version of the SILAR deposition equipment (a) substrate, (b) rinsing vessel, (c) precursor vessel, and (d) electric motors to rotate and lift the substrate. Reprinted with permission from Lindroos 1997.

The advent of a new class of materials systems based on nanoscale particles dispersed or suspended in carrier and/or binders has captured the attention of the microelectronics technical community. These materials provide the opportunity to use inexpensive solution processing equipment versus expensive vacuum deposition equipment commonly used in the microelectronics manufacturing industry. Experts in the microelectronics industry have suggested that over the course of the next live years, the industry will experience a paradigm shift in manufacturing and, more importantly, will enjoy revenue streams created from never-before-seen products based on printed electronics. 

The VDP process takes place in two stages that must be physically separated but temporally adjacent. Figure 18.1 is a schematic oftypical Parylene deposition equipment and indicates the approximate process operating conditions. 

INORGANIC FILMS Oxide films Air oxidation Excessive heating O2 in deposition equipment Oxidative cleaning processes... 

Successjul p-Xylylene VDP Monomers, within the limits mentioned above, it is frequently possible, and often desirable, to modify the p-xylylene monomer by attaching to it certain substituents. Limitations on such modifications lie in the three areas reactivity, performance in the coaler (deposition equipment) and cost. 

Figure 32.1 IVD deposition equipment in the production line at Boeing, St. Louis, MO.

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