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Thin coatings electronic

It is a valve metal and when made anodic in a chloride-containing solution it forms an anodic oxide film of TiOj (rutile form), that thickens with an increase in voltage up to 8-12 V, when localised film breakdown occurs with subsequent pitting. The TiOj film has a high electrical resistivity, and this coupled with the fact that breakdown can occur at the e.m.f. s produced by the transformer rectifiers used in cathodic protection makes it unsuitable for use as an anode material. Nevertheless, it forms a most valuable substrate for platinum, which may be applied to titanium in the form of a thin coating. The composite anode is characterised by the fact that the titanium exposed at discontinuities is protected by the anodically formed dielectric Ti02 film. Platinised titanium therefore provides an economical method of utilising the inertness and electronic conductivity of platinum on a relatively inexpensive, yet inert substrate. [Pg.165]

The principal use of gold is as a very thin coating about 0-05 /xm thick for electrical and electronic applications. Because of the thinness of gold electrodeposits, porosity must be very carefully controlled since seepage of corrosion products from substrate or undercoat exposed at these pores can have serious adverse effects on both appearance and electrical properties of the composite. The porosity can vary with the thickness of the deposit (Fig. 13.1), and with the type of plating bath and with its method of operation (Fig. 13.2), and the phenomenon has been extensively studied by Clarke and many other workers. [Pg.461]

The primary consideration for all AEM analysis is that the specimen be thin (generally carbon coated electron microscope grid either dry or in a suitable liquid. If a liquid suspension is used in preparing the specimen, it is important that all elements of interest are insoluble in that liquid. Only particles thin enough to meet AEM thin-film criteria (15) should be analyzed quantitatively. Scraping surface particles from a catalyst pellet for specimen preparation may be more useful than grinding the entire pellet. [Pg.365]

The ability to apply a planarizing, optically transparent, thermally stable polymer system that cures under relatively mild conditions has recently been demonstrated to have utility in the fabrication of multilayer devices such as advanced color liquid-crystal display31,32 The ability to apply this material as a dielectric or optical coating for thin-film electronics devices has also recently been demonstrated with the fabrication of an optical wave guiding device.33... [Pg.343]

In transmission studies of small aluminum spheres, Batson (22) has shown details of the generation of surface plasmons in the aluminum and in the thin coating oxide layer. Marks (23) and Cowley (24) have examined the surface plasmons and surface state excitations of small MgO smoke crystals. It is clearly evident that these excitations may be produced by electron beams passing the crystal in the vacuum, 3 nm or more away from the surface. [Pg.356]

The penetration depth of electrons into the substrate decreases at lower energy. Also, the surface dose per mA of beam current increases (see Figure 3.26) and thin coatings and inks can be cured with higher efficiency... [Pg.55]

Another relatively recent development is electron generators that are essentially sealed vacuum tubes with a 2.5 pm-thick silica ceramic window or a 5-10 pm titanium window as the beam exit. Such electron beam tubes or bulbs are capable of operating at 50 to 150 kV,64-67 71 and can be stacked into modules to cure wide webs. It is conceivable that a miniature electron beam could provide an efficient low-cost means to cure thin coatings, adhesives (clear and filled) and inks. Examples of such miniature electron beam equipment are shown in Figures 3.21 and 3.22. [Pg.58]

Photoresists - [ELECTRONIC MATERIALS] (Vol 9) - [PHOTOGRAPH/] (Vol 18) - [SULFONICACIDS] (Vol23) -as electronics coatings [ELECTRONICS, COATINGS] (Vol 9) -for printing processes [PRINTING PROCESSES] (Vol 20) -thin films for [THIN FILMS - MONOMOLECULARLAYERS] (Vol 23)... [Pg.759]

Due to its excellent properties h-BN is mainly used as ceramic material, as lubricant and serves also as thin coatings for electronic devices. [Pg.4]

Fabrics coated with FEP and PFA can be laminated and heat-sealed into protective garments, canopies, etc. FEP-coated polyimide films are used in electronics and as a wire tape. FEP-based anticorrosion coatings are used in the chemical industry and as chemical barriers.18 A thin coating of FEP or PFA can be used as a hot melt adhesive for a variety of substrates, including PTFE-coated fabrics and laminates. [Pg.136]

Figure 24.4 depicts the change of surface electron energy level as a function of the thickness of a plasma polymer. In this case, plasma polymer of acetylene/N2 was deposited on brass and the contact current was measured against nylon 66. The result indicates the following two important aspects of the surface state First, the surface state electron energy level at a thin-coating thickness is influenced by that of the substrate material but becomes independent of the thickness above a threshold... [Pg.492]

Electroplating Objects can be electroplated with a metal such as silver in a method similar to that used to refine copper. The object to be silver plated is the cathode of an electrolytic cell that has a silver anode, as shown in Figure 21-21. At the cathode, silver ions present in the electrolyte solution are reduced to silver metal by electrons from an external power source. The silver forms a thin coating over the object being plated. The anode consists of a silver bar or sheet, which is oxidized to silver ions as electrons are removed by the power source. Current passing through the cell must be carefully controlled in order to get a smooth, even metal coating. [Pg.687]

Use Thin coatings of high purity and uniformity on almost any substrate that will resist a high vacuum, as paper, fabric, polyethylene and polystyrene film, ceramics, metals, many solid chemicals electronic miniaturization systems capacitors thin film circuits. [Pg.947]


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