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Plating bath

An analysis to determine the concentration of Cu in an industrial plating bath uses a procedure for which Zn is an interferent. When a sample containing 128.6 ppm Cu is carried through a separation to remove Zn, the concentration of Cu remaining is 127.2 ppm. When a 134.9-ppm solution of Zn is carried through the separation, a concentration of 4.3 ppm remains. Calculate the recoveries for Cu and Zn and the separation factor. [Pg.203]

Following the separation outlined in Example 7.10, an analysis is to be carried out for the concentration of Cu in an industrial plating bath. The concentration ratio of Cu to Zn in the plating bath is 7 1. Analysis of standard solutions containing only Cu or Zn give the following standardization equations... [Pg.204]

Butynediol is principally used in pickling and plating baths. Smak amounts are used in the manufacture of brominated derivatives, useful as flame retardants. Itwas formerly used in awkd oat herbicide, Carbyne (Barban), 4-chloro-2-butynyl-A/-(3-chlorophenyl)carbamate [101-27-9] C H Cl2N02 (77). [Pg.106]

Fluoroboric acid is used as a stripping solution for the removal of solder and plated metals from less active substrates. A number of fluoroborate plating baths (27) require pH adjustment with fluoroboric acid (see Electroplating). [Pg.165]

Lead—copper alloys are also used as tank linings, tubes for acid mist precipitators, steam heating pipes for sulfuric acid or chromate plating baths, and flashing and sheeting (see Tanks AND pressure vessels). [Pg.60]

Many electroless coppers also have extended process Hves. Bailout, the process solution that is removed and periodically replaced by Hquid replenishment solution, must still be treated. Better waste treatment processes mean that removal of the copper from electroless copper complexes is easier. Methods have been developed to eliminate formaldehyde in wastewater, using hydrogen peroxide (qv) or other chemicals, or by electrochemical methods. Ion exchange (qv) and electro dialysis methods are available for bath life extension and waste minimi2ation of electroless nickel plating baths (see... [Pg.134]

Metallurgy. The extraction and separation of metals and plating baths have involved quinoline and certain derivatives (see Electroplating Metal SURFACE TREATiffiNTs Exthaction). [Pg.393]

Uses. Isoquinoline and isoquinoline derivatives are usehil as corrosion inhibitors, antioxidants, pesticides, and catalysts. They are used in plating baths and misceUaneous appHcations, such as in photography, polymers, and azo dyes (qv). Numerous derivatives have been prepared and evaluated as pharmaceuticals. Isoquinoline is a main component in quinoline stiH residue bases, which are sold as corrosion inhibitors and acid inhibitors for pickling iron and steel. [Pg.398]

Concentrated waste solutions are obtained from spent metal plating baths and etchants. However, the majority of metal wastes are soflds or sludges obtained from the hydrolysis of metal-bearing solutions and industrial process effluents. Most of these water-insoluble wastes are composed of hydroxides or basic salts of the contained metals. Eor processing by hydrometallurgical routes the materials must be brought into solution usually by acid or ammoniacal or alkaline digestion. [Pg.562]

Chromium Plating. Sodium selenate or selenic acid are added to chromium-plating baths to improve corrosion protection from pitting. [Pg.336]

Selenium and selenium compounds are also used in electroless nickel-plating baths, delayed-action blasting caps, lithium batteries, xeroradiography, cyanine- and noncyanine-type dyes, thin-film field effect transistors (FET), thin-film lasers, and fire-resistant functional fluids in aeronautics (see... [Pg.338]

Electroplating. Most silver-plating baths employ alkaline solutions of silver cyanide. The silver cyanide complexes that are obtained in a very low concentration of free silver ion in solution produce a much firmer deposit of silver during electroplating than solutions that contain higher concentrations. An excess of cyanide beyond that needed to form the Ag(CN)2 complex is employed to control the concentration. The silver is added to the solution either directly as silver cyanide or by oxidation of a silver-rod electrode. Plating baths frequently contain 40—140 g/L of silver cyanide... [Pg.92]

Hydrated Stannic Oxide. Hydrated stannic oxide of variable water content is obtained by the hydrolysis of stannates. Acidification of a sodium stannate solution precipitates the hydrate as a flocculent white mass. The colloidal solution, which is obtained by washing the mass free of water-soluble ions and peptization with potassium hydroxide, is stable below 50°C and forms the basis for the patented Tin Sol process for replenishing tin in staimate tin-plating baths. A similar type of solution (Staimasol A and B) is prepared by the direct electrolysis of concentrated potassium staimate solutions (26). [Pg.66]

Potassium staimate, K2Sn(OH) (mol wt 298.93), and sodium stannate [12058-66-17, Na2Sn(OH), mol wt 266.71, are colorless crystals and are soluble in water. The solubiUty of potassium stannate in water is 110.5 g/100 mL water at 15°C and that of sodium stannate is 61.5 g/100 mL water at 15°C. The solubihty of sodium stannate decreases with increasing temperature, whereas the solubiUty of potassium stannate increases with increasing temperature. The solubihty of either sodium or potassium stannate decreases as the concentration of the respective free caustic increases. Hydrolysis of stannates yields hydrated stannic oxides and is the basis of the Tin Sol solution, which is used to replenish tin in stannate tin-plating baths (28,29). [Pg.66]

The use of drip pans to catch products, in cases such as a dairy or ice-cream manufacturing plant, instead of flushing this material to the sewer, considerably reduces the organic load. A similar case exists in the plating industry where a drip pan placed between the plating bath and the rinse tanks win reduce the metal dragout. [Pg.176]


See other pages where Plating bath is mentioned: [Pg.114]    [Pg.170]    [Pg.416]    [Pg.209]    [Pg.252]    [Pg.751]    [Pg.770]    [Pg.802]    [Pg.802]    [Pg.891]    [Pg.949]    [Pg.225]    [Pg.230]    [Pg.315]    [Pg.385]    [Pg.385]    [Pg.499]    [Pg.387]    [Pg.335]    [Pg.358]    [Pg.391]    [Pg.132]    [Pg.133]    [Pg.139]    [Pg.197]    [Pg.10]    [Pg.393]    [Pg.41]    [Pg.201]    [Pg.256]    [Pg.260]    [Pg.527]    [Pg.394]    [Pg.395]    [Pg.369]    [Pg.120]   
See also in sourсe #XX -- [ Pg.249 ]

See also in sourсe #XX -- [ Pg.249 ]




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