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Thermosets compounding

In recent years there has been some concern in the thermosetting material industry that usage of these materials is on the decline. Certainly the total market for thermoset compounds has decreased in Western Europe. This has happened for a number of reasons. One is the image that thermosets tend to have as old-fashioned materials with outdated, slow production methods. Other reasons include the arrival of high temperature engineering plastics... [Pg.7]

Consist of a range of chemicals which promote cross-linking can initiate cure by catalysing ( catalysts , hardeners, initiators), speed up and control cure (activators, promoters) or perform the opposite function (inhibitors) producing thermosetting compounds and specialised thermoplastics (e.g. peroxides in polyesters, or amines in epoxy formulations). The right choice of a cure system is dependent on process, process temperature, application and type of resin. [Pg.777]

Briefly, a measured amount of the thermosetting compound is placed in the cavity of a heated mould which is attached to the platens of an hydraulic press. The temperature of the mould may be (as an instance) 150°C. When the press is closed and heat and pressure applied the material flows and fills the cavity excess (known as flash ) escapes from the mould. Heat applied causes cross-linking and hardening of the material the moulding sets in the shape of the cavity and after a pre-determined time (perhaps three minutes) can be removed. Pre-heating the material (to, say, 70°C) can be employed as a method of shortening cycle times. [Pg.152]

Caston produced a low-melting amber-coloured resin which was then reacted with phthalic anhydride to produce a thermoset compound. [Pg.24]

The ejector pins should have an adequate cross-sectional area to minimize the possibility of distorting or puncturing the molded plastic at the time of ejection from cavities, as most of the thermoset compounds are slightly soft during that time. [Pg.290]

In this context, unsaturated resins are usually compounds containing C=C double bonds that, by polymerization and crosslinkage with the respective monomers, can be transferred into saturated thermosetting compounds that no longer contain double bonds. Here again the basis are resin and hardener components that cure after mixing at room temperature or in the heat. [Pg.39]

Cold molding takes place when thermosetting compounds are introduced into a room-temperature steel mold that is closed under pressure. The mold is subsequently opened, and the formed article is transferred to a heating oven, where it is baked until it becomes hard. [Pg.1325]

ASTM D3419-93, Practice for in-line screw injection moulding of tet specimens from thermosetting compounds, American Society for Testing Materials Publication. Philadelphia, 1993. ASTM 3297-93. Practice for moulding and machining tolerances for PTFE resin parts. American Society for Testing Materials Publication, Philadelphia. 1993. [Pg.138]

ASTM Dl896-93. Practice for transfer moulding test specimens of thermosetting compounds and extrusion materials, American Society for Testing Materials Publication. Philadelphia. 1993. [Pg.138]

This company has posted product information for a new line of structural thermoset compounds on a new microsite in the Products section of its website. The new high-performance product line builds on the most popular properties of the company s standard thermoset products, such as corrosion resistance and durability, and adds mechanical strength and exceptionally light weight. The new product postings provide detailed product information that allows design engineers to evaluate their use for current applications. [Pg.42]

For the processing of thermoplastic polymeric nanocomposites, standard equipment for the preparation of high viscosity thermoplastic compounds can be used the co-rotating twin-screw extruder with its flexible processing unit which allows for controlled dispersing shear and elongational flow. In the case of low viscosity components for the production of thermoset compounds, common mixing and dispersion techniques can be used. [Pg.336]

Various binder systems have been used in ceramic injection molding, which can be classified into five types (i) thermoplastic compounds, (ii) thermosetting compounds, (iii) water-based systems, (iv) gelation systems, and (v) inorganics. Among these, thermoplastic compounds are the most widely used and understood, which are mainly commercial polymers. The ratio of powder to binder is a key parameter. [Pg.271]

The nozzle temperature is controlled to maintain a proper balance between a hot mold (350-400 " F), and a relatively cool barrel (150-200° F). Molded-in inserts are commonly used with thermosetting materials. However, since the screw-injection process is automatic, it is desirable to use post-assembled inserts rather than molded-in inserts because molded-in inserts require that the mold be held open each cycle to place the inserts. A delay in the manual placement disrupts an automatic cyclic operation, affecting both the production rate and the product quality. Thermosetting materials used in screw-injection molding are modified from conventional thermosetting compounds. [Pg.139]

Hot Press Moulding—Heated matched dies are loaded with thermosetting compound and pressed together until cured. [Pg.8]

Molding index n. A practical measure of the difficulty of molding of thermosetting compound. A calculated weight of the candidate molding powder, is placed into a flash-type cup mold that has been preheated to the temperature prescribed for the material. The mold is closed and the total minimum force required to close it is reported as the molding index of the compound. [Pg.630]

RF curing n. Hastening the final cross-linking of thermosetting compounds and laminates by application of radio-fi equency energy. [Pg.839]

Sheet-molding compound (SMC) n. A fiberglass-reinforced thermosetting compound in sheet form, usually rolled into coils interleaved with plastic film to prevent autoadhesion. This term was chosen to replace the term prepr, which was deemed to be confusing and insufficiently definitive. SMC can be molded into complex shapes with little scrap, and is low in cost. [Pg.876]

Typical applications include melamine dinnerware phenolic toaster legs and pot handles, electrical outlets, wall plates, and switches— parts which require the rigidity, dimensional stability, heat resistance, or electrical insulating properties typical of thermosetting compounds. [Pg.443]

Figure 6.17 A variety of electrical and electric components produced by transfer molding with thermosetting compounds. Figure 6.17 A variety of electrical and electric components produced by transfer molding with thermosetting compounds.
There are two types of spiral flow tests and molds one for the very soft flow encapsulation compounds generally associated with the encapsulation grades of the epoxy family of compounds (the Emmi mold) and a spiral flow mold (the Mesa flow mold) that is used when testing the high-pressure thermoset compounds. (See also spiral flow test). [Pg.209]

The Brabender Plasticorder was introduced as a more sophisticated means for measuring the rheology of thermosetting compounds applied to an extruder screw. There is a need to know the duration of a compound s flow life when exposed to both the initial barrel temperatures as the compound is prepared for its movanent into the mold and when the compound enters the much hotter mold. See also Brabender Plasticorder.)... [Pg.209]

A postcure or additional curing step, usually done out of the mold simply by placing the part in an air-circulating oven, will complete the cure. The part will then have achieved optimal properties, and further reaction will not be probable. Thermoset compounders generally can recommend postcuring cycles where appropriate. [Pg.455]

The best of the strippers for the thermosetting compounds are based on chlorinated solvents, usually methylene dichloride in combination with a small amount of an acid or base and perhaps in a blend with other solvents such as chlorobenzene. However, many thermoset resin formulations are virtually inert to the action of strippers. [Pg.533]

Transfer, or plunger molding, is a process in which high-flow B-stage resins, such as epoxies, are liquefied under heat and pressure in a transfer pot, after which the resultant liquid resin is transferred under pressure into mold cavities. The transferred resin is then heated to form cured, final parts that are then removed from the mold. Although compression and transfer molding are used principally with thermosetting compounds, the processes are occasionally used with thermoplastic material, often thermoplastic composites. [Pg.565]

In thermosetting compounds (which are in various forms for moulding by compression or by a modified form of injection), fibre lengths can be much higher. These are known as bulk moulding compounds (BMCs) or dough moulding compounds (DMCs). [Pg.38]


See other pages where Thermosets compounding is mentioned: [Pg.356]    [Pg.369]    [Pg.324]    [Pg.861]    [Pg.150]    [Pg.107]    [Pg.324]    [Pg.1]    [Pg.356]    [Pg.969]    [Pg.861]    [Pg.356]    [Pg.235]    [Pg.129]    [Pg.129]    [Pg.176]    [Pg.191]    [Pg.233]    [Pg.96]    [Pg.97]    [Pg.41]    [Pg.629]    [Pg.784]    [Pg.31]    [Pg.106]   
See also in sourсe #XX -- [ Pg.2 , Pg.64 ]




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