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Nozzle temperature

Melt temperature Cylinder temperature Nozzle temperature... [Pg.650]

Unstable conformers of trans- and cis-hexatriene have been detected by means of the combination of matrix-isolation infrared spectroscopy and photoexcitation (or the high-temperature nozzle technique)84. Ab initio MO calculations at the HF/6-31G level have been performed for several conformers of 1,3,5-hexatriene93. The observed infrared bands of unstable conformers have been attributed to the gTt (major species) and gTg (minor species) conformers of /raw.s -hexalricne and the gCt conformer of cw-hexatriene93. It is noted that, in the previous paper93, the notation c is used for twisted structures for the sake of simplicity. The calculated torsional angles around C—C bonds for the gTt, gTg and gCt conformers are in the range between 32° and 45°. The observed and calculated vibrational frequencies of gTt and gCt are reported in Reference 93. [Pg.166]

Having determined the temperature, nozzle efficiency may be determined firom equation (14.7), which compares the actual outlet temperature ratio given by... [Pg.168]

The characteristics of the particles produced using SCF technology are influenced by the properties of the solute (drug, polymer, and other excipients), type of SCF used, and process parameters (such as flow rate of solute and solvent phase, temperature and pressure of the SCF, pre-expansion temperature, nozzle geometry, and the use of coaxial nozzles)t " ]. The influence of drug and polymer properties is discussed below. [Pg.217]

Spectroscopy on heavy molecules that have low vapor pressure could be done by vaporizing them in a high-temperature oven that could easily be placed in the vacuum chamber. Another possibility that is being pursued is to use a high-temperature nozzle source to form rare-gas metal-atom dimers. [Pg.269]

Smaller or no gaps generate solid layers in which filaments are thermally bonded together. Bond formation is solely driven by thermal energy of the molten material. The heat transfer necessary to join two adjacent filaments is influenced by thermal properties of the material as well as the hquefier and envelope temperatures, nozzle... [Pg.189]

Solder can be applied to the board as a paste, solid pre-form, or solder-coated pad. In all cases, the component must be held down during the soldering process to ensure contact of component leads with bonding pads. Proper gas pressure, temperature, nozzle translation speed, and flux are required to effect joint formation. Otherwise, the same reflow considerations are required for this technique as for any other. Heating ramp rate, solder paste preheating, peak temperature, liquidus duration, etc., must be observed for successful joint formation and joint reliability considerations. [Pg.1131]

In 1972 Hagena and Obert [86] studied the effect of pressure, temperature, nozzle size as well as the nature of the supercritical-fluid solvent, on the size... [Pg.76]

The effect of drying temperature, nozzle gas mass flow, and suspension mass flow was studied for each investigated Suspension 1 and 2 using design of experiments (DoE). [Pg.402]

The high-temperature nozzle (Fig. 19.4) consist of two parts the gas nozzle and the nozzle for the liquid feed the gas nozzle may heat up to the maximum... [Pg.759]

Key Words melt temperature, nozzle, injection molding. [Pg.2177]


See other pages where Nozzle temperature is mentioned: [Pg.151]    [Pg.161]    [Pg.285]    [Pg.54]    [Pg.3]    [Pg.224]    [Pg.460]    [Pg.228]    [Pg.112]    [Pg.151]    [Pg.161]    [Pg.49]    [Pg.556]    [Pg.197]    [Pg.346]    [Pg.345]    [Pg.151]    [Pg.152]    [Pg.829]   
See also in sourсe #XX -- [ Pg.211 ]




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