Temperature board

The major chemical changes in wood caused by fiberboard manufacture are secondary side reactions which are both beneficial and detrimental to the final properties achieved. Defibering is accomplished by hydrolytic breakdown of lignin and hemicelluloses under wet acidic conditions combined with high process temperatures. Board conversion and consolidation is attended by pyrolytic reactions which... 

The mats are moved along the line to the press loader. When the loader is filled and the press opens to remove the load of freshly pressed boards, the loader pushes the new boards into the unloader and deposits the load of mats on the press platens. The press closes as quickly as possible to the desired panel thickness. More pressure, as much as 4.8—6.9 MPa (700—1000 psi) is required to press high density dry-process hardboard, because the dry fiber exhibits much more resistance to compression and densification than wet fiber. Press temperatures are also higher, in the range of 220—246°C. No screens are used in the dry-process, but the moisture in the mats requires a breathe cycle during pressing to avoid blowing the boards apart at the end of the cycle. Because no screens are used, the products are called smooth-two-sides (S-2-S), in contrast to the wet-process boards, which have a screen pattern embossed into the back side and are known as smooth-one-side (S-l-S). 

Panels then move into a cooling device, normally a wheel or rack, where they are held individually and air is circulated between them to remove the majority of heat remaining in the boards after pressing. It is desirable to reduce the average board surface temperature to about 55°C. This temperature is sufficient to complete the cure of adhesive in the core of the board. The heat also helps to redistribute moisture uniformly within the boards, because the board surfaces are drier than the core when the boards come out of the press. Warm boards are normally stacked for several hours to a day to allow for resin cure and moisture equalization. 

Fiber-reiaforced panels covered with PVF have been used for greenhouses. Transparent PVF film is used as the cover for flat-plate solar collectors (114) and photovoltaic cells (qv) (115). White PVF pigmented film is used as the bottom surface of photovoltaic cells. Nonadhering film is used as a release sheet ia plastics processiag, particularly ia high temperature pressing of epoxy resias for circuit boards (116—118) and aerospace parts. Dispersions of PVF are coated on the exterior of steel hydrauHc brake tubes and fuel lines for corrosion protection. 

Because the heat distortion temperature of cured epoxy resins (qv) increases with the functionality of the curing agents, pyromellitic dianhydride is used to cross-link epoxy resins for elevated temperature service. The dianhydride may be added as a dispersion of micropulverized powder in liquid epoxy resin or as a glycol adduct (158). Such epoxies may be used as an insulating layer in printed circuit boards to improve heat resistance (159). Other uses include inhibition of corrosion (160,161), hot melt traffic paints (162), azo pigments (163), adhesives (164), and photoresist compounds (165). 

Ultem polyetherknides have appHcations in areas where high strength, dimensional stabiUty, creep resistance, and chemical stabiUty at elevated temperatures are important. Uses include electrical coimectors, wave guides and printed ckcuit boards for electronic equipment, food appHcations (microwaveable containers, utensils, and films), akcraft interior materials, and stetilizable medical equipment. 

Electrical Properties. Polysulfones offer excellent electrical insulative capabiUties and other electrical properties as can be seen from the data in Table 7. The resins exhibit low dielectric constants and dissipation factors even in the GH2 (microwave) frequency range. This performance is retained over a wide temperature range and has permitted appHcations such as printed wiring board substrates, electronic connectors, lighting sockets, business machine components, and automotive fuse housings, to name a few. The desirable electrical properties along with the inherent flame retardancy of polysulfones make these polymers prime candidates in many high temperature electrical and electronic appHcations. 

High Temperature Oxidation Resistant Coatings, Materials Advisory Board, National Academy of Science, Washington, D.C., 1970. 

Oxide fibers are manufactured by thermal or chemical processes into a loose wool mat, which can then be fabricated into a flexible blanket combined with binders and formed into boards, felts, and rigid shapes or fabricated into ropes, textiles and papers. The excellent thermal properties of these products make them invaluable for high temperature industrial appHcations. 

The outer packaging must protect the tea from light and moisture absorption. Polypropylene or coated ceUophane outer wraps for paper board tea packages provide a barrier to loss of tea aroma and retard permeation of oxygen and foreign flavors. Low temperature improves storage stabiHty. Properly packaged and stored teas retain acceptable flavor for about a year. 

Electrical and Electronic Applications. Silver neodecanoate [62804-19-7] has been used in the preparation of a capacitor-end termination composition (110), lead and stannous neodecanoate have been used in circuit-board fabrication (111), and stannous neodecanoate has been used to form patterned semiconductive tin oxide films (112). The silver salt has also been used in the preparation of ceramic superconductors (113). Neodecanoate salts of barium, copper, yttrium, and europium have been used to prepare superconducting films and patterned thin-fHm superconductors. To prepare these materials, the metal salts are deposited on a substrate, then decomposed by heat to give the thin film (114—116) or by a focused beam (electron, ion, or laser) to give the patterned thin film (117,118). The resulting films exhibit superconductivity above Hquid nitrogen temperatures. 

A number of BMI resias based on this chemistry became commercially available through Rhc ne Poulenc for appHcation ia priated circuit boards and mol ding compounds and Rhc ne Poulenc recognized the potential of bismaleimides as building blocks for temperature-resistant thermoset systems. The basic chemistry, however, was not new, because the Michael addition reaction had been employed by Du Pont to obtain elastomeric reaction products from bismaleimides and Hquid polymeric organic diamines (15). 

Two resin systems based on this chemical concept are commercially available from Shell Chemical Company/Technochemie under the COMPIMIDE trademark COMPIMIDE 183 (34) [98723-11-2], for use in printed circuit boards, and COMPIMIDE 796 [106856-59-1], as a resin for low pressure autoclave mol ding (35). Typical properties of COMPIMIDE 183 glass fabric—PCB laminates are provided in Table 8. COMPIMIDE 183 offers a combination of advantageous properties, such as a high glass transition temperature, low expansion coefficient, and flame resistance without bromine compound additives. 

---