Sputter-deposited films

In physical vapor-deposited as well as sputter-deposited films, incorporated gases can also increase stress and raise annealing temperatures. Similar effects are present in electron beam-evaporated films. 

Figure 1. A Rutherford backscattering spectrum for a thin (40/ig/cm2) MoSt sputter-deposited film. Conditions 4He ions normally incident at 3.0 MeV, and scattered ions detected at a 135° angle by a surface-barrier diode detector. Note the scale factor for other than the Mo peak and the Si substrate. The sample layer configuration is indicated at the upper left.

We conclude that the microscopic etch mechanism must be the same for single crystals and sputter deposited, polycrystalline ZnO Al. For the latter, the tendency for crater formation is masked by inhomogeneous chemical or physical properties like porosity, composition or, in case of dynamic deposition, multilayered ZnO Al films. This multilayer structure results from the fact that structural properties of ZnO Al deposited by a sputter process varies depending on the position of the film relative to the race track of the sputter target [131,132]. This dependence is important for the etch rate of in-line sputter deposited films [133]. 

However, it appears that BST films deposited by MOC VD have lower defect density, by at least an order of magnitude compared to sputter deposited films, thus, smaller N. This can be inferred from the film thickness independent leakage current density (J) vs. applied field strength (E) of the MOCVD films" whereas J increases with increasing film thickness at a given applied field for sputtered films. ... 

Another technique that requires less instrumentation than those discussed above involves the analysis of the sputter deposited film from the alloy. A flat metallic plate is positioned so that it intercepts part of the sputtered flux without being resputtered by the ion beam. The sputter deposited layer should be built up for periods longer than it takes to generate a steady state surface on the sputtered alloy to insure that the sputtered film has reached a composition equal to the bulk alloy and yet be several times thicker than the analysis depth of the surface technique. If the angular distribution of the sputtered flux of A and B is not uniform, then the deposited film composition will differ at different locations. It is often assumed that the sticking coefficient of each element is identical. Of course if one element in the alloy is volatile the method will fail. 

As mentioned above, Hackenberger et al. [41] concluded that stoichiometric or nearly stoichiometric BN films contained the highest amount of the cubic phase. In sputter deposited films both from the hBN target and the B4C target, atomic ratios B N 1 in the films were achieved [21,24,54]. 

Cross-section TEM investigations of these sputter deposited films revealed the typical phase evolution well known for cBN films. Electron diffraction patterns indicated that in our films the c-axis ([0002]) of turbostratic BN is parallel to (111) direction of cBN and both are perpendicular to the substrate normal [58]. 

FIGURE 7.5. Evolution of the optical properties (a,b) and film thickness(c) as a function of time for a polypyrrole film grown potentiostatically on a Pt sputter-deposited film electrode at +0.60 V (SCE) using an aqueous solution of pyrrole (0.025 M) and KNO3 (0.5 M). (From Ref. 19). 

Busch JD, Johnson AD (1990) Shape-memory properties in Ni — Ti sputter deposited film. J Appl Phys 68 6224-6228... 

Fractal dimensions of some non-living and living systems including crystallization patterns, electro-deposited aggregates, polymers, chemical dissolution patterns, dielectric breakdown, sputter deposited film of NbGcj, retinal vessel and bacterial growth are given in Table 13.3. 

Atanasoska LL, Vemstrom GD, Haugcai GM, Atanasoski RT (2011) Catalyst durability for fuel cells under start-up and shutdown conditions evaluation of Ru and Ir sputter-deposited films on platinum in PEM environment ECS Trans 41(l) 785-795... 

Suzuki S, Onodera T, Kawaji J, Mizukami T, Takamori Y, Daimon H, Morishima M (2011) Optimum surface composition of platinum-ruthenium nanoparticles and sputter-deposited films for methanol oxidation reaction. Electrochem 79 602-608... 

Fig. 1.39. Average internal stress versus argon pressure of Cr, Gd, Rh, Mo and Ta sputter-deposited films, taken from the works of Thornton (1977) and Thornton et al. (1979). Also shown are results for an electroplated Cr target from Hoffman and Thornton (1979).

For example, the residual film stress in post cathode magnetron-sputtered deposited films depends on the relative orientation of the him with respect to the post cathode orientation and the sputtering pressureJ A major problem with energetic neutral bombardment of the growing him is that it is very dependent on pressure and is often not recognized nor controlled. 

The properties of sputter-deposited films can be very dependent on the gas pressure. 

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