Single-in-line Package

Many other variations of DIP technology are readily available, such as SH-DIP (shrink DIP), SIP (single in-line package), SOP (small outline package), and QFP (quad flat package, as shown in Fig. lb (courtesy of Shinko Electric Industries Co. Ltd.)). The basic techniques are the same as DIP, but the variants provide different form factors and different arrangements of the pins. 

SINGLE-IN-LINE PACKAGE (sip) Component package system with one line of connectors, usually spaced 0.100 in apart. 

With the conventional technology, ICs are mounted individually in plastic or ceramic single-chip packages (SCPs), such as dual-in-line packages (DIPs) or chip carriers, and the SCPs are interconnected on printed wiring boards (PWBs). The number of pins on SCPs has increased significantly, and line widths on PWBs, like IC feature sizes, have followed a historical downward trend (2). However, the basic SCP-on-PWB approach has remained predominant. 

Adhesives are also tailored to meet specific requirements of the packaging or assembly technology used (Table 5.9). Thus, the requirements for single-chip packaging in hermetically sealed ceramic packages such as CERDIPs will be somewhat different from those of plastic dual-in-line packages (PDIPs) and plastic-encapsulated microcircuits (PEMs). 

Even more conveniently, instrumentation amplifiers are also available from a range of semiconductor companies as a single device—a monolithic instrumentation amplifier. There are many such products available from many producers such as the AD624 made by Analog Devices, or as shown in Figure 27.13, the INA121 made by Texas Instruments. This particular device has FET inputs, is available in surface mount and dual in-line packages, and is a versatile, easy-to-use amplifier with wide applicability. 

The depalletizer in a packaging line accepts stacked bottles on pallets that have dividers and discharges one container at a time in single file. Sizing of the depalletizer for unsorted containers must be analyzed with respect to the product mix ratios, type and speed of the filler, and the condition of the pallets, conveyors, and containers. 

In-Line Production Using a single location for production and packaging of eggs. 

FIGURE 47.31 In-line single-vapor heating system schematic. (Reprinted with permission from Electronic Packaging and Production, November 1982, p. 63, Fig. 1). 

GE E-seminars (http //www. ge-plastics.com/resins/designsolutiony seminar/) GE s virtual conference center offers the ability to interact with GE Plastics real-time in live on-line conferences. E-Seminar examples include Material Selection, which provides the attendee with the knowledge, skills and competencies to determine how application requirements influence the material specification process and Materials for Single-Use Microwave Food Packaging, which reviews trends in the growing Freezer-to-Microwave Food Packaging industry. 

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