Single-chip packages

With the conventional technology, ICs are mounted individually in plastic or ceramic single-chip packages (SCPs), such as dual-in-line packages (DIPs) or chip carriers, and the SCPs are interconnected on printed wiring boards (PWBs). The number of pins on SCPs has increased significantly, and line widths on PWBs, like IC feature sizes, have followed a historical downward trend (2). However, the basic SCP-on-PWB approach has remained predominant. 

Single-Chip Packaging. Dual-ln-Line Package. The predominant... 

Conventional single-chip packages have limited packing density on printed wiring boards (PWBs) and limit the system speed due to the large delay time for signals propagated between chips. 

Adhesives are also tailored to meet specific requirements of the packaging or assembly technology used (Table 5.9). Thus, the requirements for single-chip packaging in hermetically sealed ceramic packages such as CERDIPs will be somewhat different from those of plastic dual-in-line packages (PDIPs) and plastic-encapsulated microcircuits (PEMs). 

Kamath SM, Tummala RR (2001) Fundamentals of single chip packaging. In Tummala RR (ed) Fundamentals of microsystems packaging. McQraw-Hlill, Boston... 

Single Chip Package First Level Package... 

You must achieve a smaller form factor than is possible with single chip packaging. Often integrating the digital components onto an MCM-L provides the most cost effective way in which to achieve the required size. MCM-D provides the greatest form factor reduction when the utmost smallest size is needed. 

It is highly desirable that the final MCM package be compatible with single-chip packaging assembly techniques to facilitate manufacturability. 

Sometimes, this higher concentration of heat in an MCM can work to the designer s advantage. If the MCM uses one larger heat sink, as compared with the multiple heat sinks required on the single-chip packaged version, then there is the potential for cost savings. 

The most common definition of a hybrid circuit is a circuit that contains two or more components, one of which must be active, which are mounted on a substrate that has been metallized by one of the film technologies. This definition is intended to eliminate single-chip packages, which contain only one active component, and also to eliminate such structures as resistor networks. A hybrid circuit may, therefore, be as simple as a diode-resistor network or as compKcated as a multilayer circuit containing in excess of 100 integrated circuits. 

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