Quad flat package

Yoo HY, et al. Novel die attach adhesive for thin quad flat package, wwwJienkelna.coni/ industrial/white-papers-8082.htm. Accessed August 2010. [Pg.342]

Yoo, H. Y., etal.. Novel Die Attach Adhesive for Thin Quad Flat Package, www.ablestik.com/pdfs/tqfpadh.pdf (Aug. 2002)... [Pg.389]

Many other variations of DIP technology are readily available, such as SH-DIP (shrink DIP), SIP (single in-line package), SOP (small outline package), and QFP (quad flat package, as shown in Fig. lb (courtesy of Shinko Electric Industries Co. Ltd.)). The basic techniques are the same as DIP, but the variants provide different form factors and different arrangements of the pins. [Pg.2644]

Ceramic quad flat package with J leads (CQFJ). [Pg.860]

Shrink quad flatpack (or flat package) (SQFP), typically a 64-pin small quad flat package (1/4height of QFT) with a lead pitch of 0.016 in or less. Also known as quarter quad flat pack (QQFT). Square surface mounting (SSM). [Pg.864]

Very small (and thin) quad flat package (VQFP). Lead pitch is 0.5 mm, with 32, 48, 64, 80, 100, 128, and 208 pins per package. [Pg.865]

A custom CMOS integrated circuit measuring 0.35 x 0.35 x 0.022 in. is mounted in a 1-in. square ceramic quad flat package (QFP). The device dissipates 10 W during normal operation. Find the thermal resistance from junction to case. [Pg.123]

ECTC Electronic Components and Technology Conference PQFP plastic quad flat package... [Pg.282]

SOP (small outline package) QFP (quad flat package) package)... [Pg.142]

Gull-wing leaded BQFP 132 0.64 (25) Bumpered quad flat packages... [Pg.679]

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