Sealing thermal

However, these advantages may be offset by the use of high temperature seals and the fact that the components will be subject to more stress. Besides mechanical stress due to seals, thermal stresses may appear because of temperature gradients and cycling. Few results related to the performance of this type of SOFCs have been published. An area power density of 0.12 W/cm2 has been reported without any specification of oxidant and fuel composition and utilization [117]. 

Absorption of hydrogen by titanium metal above 400 °C gives a solid whose stoichiometry approaches TiH2, but a true dihydride does not appear to exist. This hydride has been used for the formation of glass-to-metal and ceramic-to-metal seals. Thermal desorption above 600 °C provides a source of very pure hydrogen. ... 

Reduction in passive air exchange by instalhng sealed, thermally insulated and/or soundproof windows. 

Qian, LL, ZY Jin and L Deng (2007). Preparation of inclusion complex of cinnamalde-hyde and /8-cyclodextrin by sealed thermal control method. Food and Fermentation Industries, 33(12), 13-16 (in Chinese). 

Thermal sealing (thermal heat sealing) n. A method of bonding two or more layers of plastics by pressing them between heated dies or tools that are maintained at a relatively constant temperature. 

Because of their excellent radiation resistance, aromatic polyimides are used for valve seats and seals, thermal and... 

P. Palanisamy and K. E. Ewing, Self Sealing Thermally Sensitive Resistor and Method of Making Same, U.S. patent no. 4,452,726, June 5, 1984. 

Positive-displacement meters are normally rated for a limited temperature range. Meters can be constmcted for high or low temperature use by adjusting the design clearance to allow for differences in the coefficient of thermal expansion of the parts. Owing to small operating clearances, filters are commonly installed before these meters to minimize seal wear and resulting loss of accuracy. 

As a tme thermoplastic, FEP copolymer can be melt-processed by extmsion and compression, injection, and blow molding. Films can be heat-bonded and sealed, vacuum-formed, and laminated to various substrates. Chemical inertness and corrosion resistance make FEP highly suitable for chemical services its dielectric and insulating properties favor it for electrical and electronic service and its low frictional properties, mechanical toughness, thermal stabiUty, and nonstick quaUty make it highly suitable for bearings and seals, high temperature components, and nonstick surfaces. 

Attempts have been made to perform thermal retorting ia a gas barrier flexible pouch or tray. The retort pouch, under development for many years, has a higher surface-to-volume ratio than a can and employs a heat seal rather than a mechanical closure. Similarly, plastic retort trays have higher surface-to-volume ratios and are usually heat seal closed. Plastic cans iatended for microwave reheating are composed of bodies fabricated from multilayer plastic including a high oxygen barrier material, plus double-seam aluminum closures. 

The estabhshment of safe thermal processes for preserving food in hermetically sealed containers depends on the slowest heating volume of the container. Heat-treated foods are called commercially sterile. Small numbers of viable, very heat-resistant thermophylic spores may be present even after heat treatment. Thermophylic spores do not germinate at normal storage temperatures. 

Thermal Properties. Many commercial glass-ceramics have capitalized on thek superior thermal properties, particularly low or zero thermal expansion coupled with high thermal stabiUty and thermal shock resistance properties that are not readily achievable in glasses or ceramics. Linear thermal expansion coefficients ranging from —60 to 200 x 10 j° C can be obtained. Near-zero expansion materials are used in apphcations such as telescope mirror blanks, cookware, and stove cooktops, while high expansion frits are used for sealing metals. 

In the electronics industry. Pis find wide appHcations as a dielectric material for semiconductors due to thermal stabiHty (up to 400°C) and low dielectric constant. Pis are being considered for use in bearings, gears, seals, and prosthetic human joints. The intended part can be machined or molded from the PI, or a film of PI can be appHed to a metallic part. Because of their superior adhesion, dielectric integrity, processing compatibUity, and lack of biological system impact. Pis have been used in many biological appHcations with particular success as body implants. 

With a batch process, such as hot isostatic compaction (HIP), heat exchange as used in a continuous reactor is not possible, and it is common practice to provide a furnace within the pressure vessel which is thermally insulated to ensure that the temperature of the vessel does not rise above 300°C. Most HIP operations involve gas pressures in the range 70—200 MPa (10—29,000 psi) and temperatures of 1250—2000°C, occasionally 2250°C (74). The pressure vessel may have a bore diameter from 27 to 1524 mm (75) and is nearly always provided with threaded closures sealed with O-rings made of elastomer provided the temperature is low enough. 

Thermal drying has been studied in conjunction with a rail shipment of ca 1200 km from North Dakota to Illinois. Oil was appHed at 6-8 L/t to suppress dust loss, and cracks around the doors in the base of the cat were sealed to prevent ignition. Stable shipment and stockpiling were then possible (31). Thermal drying may be carried out to further reduce the moisture content as requited for briquetting or for mote efficient pulverizing and combustion. 

The thermal expansivity of Ni—Fe alloys vary from ca 0 at ca 36 wt % Ni (Invar [12683-18-OJ) to ca 13 x 10 / C for Ni. Hence, a number of compositions, which are available commercially, match the thermal expansivities of glasses and ceramics for sealing electron tubes, lamps, and bushings. In addition, the thermal expansion characteristic is utilized ia temperature controls, thermostats, measuriag iastmments, and condensers. 

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