Resists adhesion

Chemical treatments commonly appHed to cormgated paperboard packaging materials include additives that impart various degrees of water resistance, humidity resistance, oil and grease resistance, product abrasion resistance, product corrosion resistance, adhesion release properties, flame-retardant properties, nonskid properties, and static electricity control properties to the finished package (1,2). 

Phenolic resin substantially increases open time and peel strength of the formulation (80). For example, higher methylol and methylene ether contents of the resin improves peel strength and elevated temperature resistance. Adhesive properties are also influenced by the molecular weight distribution of the phenoHc low molecular weight reduces adhesion (82). 

Because of concerns about long term stability and transfer resistance, adhesives based on saturated SBCs, primarily SEBS, have dominated this application. Over time, cost pressures have encouraged the use of unsaturated rubbers, both SIS and... 

This group includes such items as surface hardness, i.e. scratch and abrasion resistance, adhesion and resistance to chipping, crazing and impact. All of... 

Ionomer High melt and tensile strength tough resilient oil and solvent resistant adhesives, coatings. (Continues)... 

Piali L, Weber C, LaRosa G, et al. The chemokine receptor CXCR3 mediates rapid and shear-resistant adhesion-induction of effector T lymphocytes by the chemokines IP10 and Mig. Eur J Immunol 1998 28(3) 961-972. 

P. Huber, BelgP 644290 (1964), claims polystyrene and/or polyisobutylene (3-5%) can be used as a gelling agent for inflammable hydrocarbons other org liquids, such as CS2. Depending on the intended use, the compositions can be made shock-resistant, adhesive, and/or productive of thick black smoke... 

Glass transition temperatures were determined refractometrically, as described by Wiley (20), with an Abbe refractometer supplied by Bellingham and Stanley. This instrument can normally be used only at temperatures up to 70°C. The prisms of this instrument were coated with a heat resistant adhesive (epoxy-phenolic resin mixture). After this modification the refractometer can be used at temperatures up to 200°C. 

Successful treatments exhibiting semiconductor resist adhesion promotion... 

The type of adhesion dealt with in the examples in the second paragraph above and Fig. 1 is mechanical or structural while for the lithographic resist adhesion requirements described in this paper a more practical definition of adhesion, one first proposed by Mittal [16], is being referenced and used. Resist patterning layer-substrate adhesion is required only to process or pattern a particular device layer. After the circuit layer is patterned, the resist layer is removed and does not become an integral part of the circuit, as opposed to a PI interlevel metal dielectric layer which does. As such, it is not required to possess high mechanical adhesion strength. In fact, the resist layer must be quantitatively removed after the circuit required layer has been patterned. If the resist layer adheres too well and becomes difficult to remove, it actually interferes with successful circuit fabrication. 

Resist adhesion must be high enough so that the film does not peel off during development. Trapped voids, either in the bulk or at the wafer interface, must be removed completely. Trapped voids in the bulk are eliminated by proper choice of solvent, which must evaporate slowly to avoid... 

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