Resist adhesion promoters

Successful treatments exhibiting semiconductor resist adhesion promotion... 

Uses Crosslinking agent improving soivyabrasion/temp. resist., adhesion promoter for PU coatings and adhesives Features Compat. with most waterborne PU systems contains no org. soivs. fast cure, delayed reaction allows heat-sealing of resin before curing... 

Chem. Descrip. 50% Methacrylamidoethylethyleneurea, 20% methacrylic acid, 30% water, 2000 ppm hydroquinone inhibitor Uses Monomer for emulsion polymerization of acrylic, vinyl-acrylic, and styrene-acrylic latex paints with improved wet adhesion, wet scrub resist., solv. resist. adhesion promoter in water- and solv.-based coatings and adhesives... 

Uses Crosslinking agent for actylic/vinyl resins PVC plastisol comonomer (reduces initial vise, and oil extractability. and improves ultimate hardness, heat distort., hot tear strength, and stain resistance) adhesion promoter hardener used in cast acrylic sheet and rod, contact lens, elastomers, ion exchange resins, dental polymers, adhesives, coatings (paper, plastic), cosmetics, paints, sealants, photopolymers, electronics (photoresists, solder masks)... 

Several adhesion promoters were described in Section III.A.2.a., but only a few of these are heat-resistant adhesion promoters. One of these is itaconic anhydride which has been shown to improve the heat resistance of allyl cyanoacrylate. As shown in Table X, BTDA is an effective heat resistance promoter and other anhydrides from ref. 79 may also be effective. Recently, phthalic anhydride was described as a heat and moisture resistance promoter for cyanoacrylates. These patent examples illustrate the effect... 

The discussion of heat durability in this section should make clear that this is a complex phenomenon. Embrittlement, retropolymerization, thermoplasticity, and the loss of adhesion are all factors affecting the adhesive s performance on metal surfaces. Based on the published state of the art, optimum cyanoacrylate heat durability could be achieved using a combination of a heat-resistant adhesion promoter, a crosslinking agent, and a plasticizer. The heat durability promoters discussed in this section are summarized in Table XI. 

The use of a primer to promote adhesion and fill in voids in the substrate can help to improve part appearance and quality. The use of adhesion promoters on olefinic substrates such as TPO and PP not only is necessary for adhesion but also dramatically influences other properties such as gasoline, gasohol, and even gouge resistance. Adhesion promoters for TPO and polypropylene (PP) are commonly chlorinated based polyolefin (CPO) primers (64) that contain a co-resin, conductive carbon black, and hydrocarbon solvents for optimum CPO solubUity. Other resins can also be beneficial in improving adhesion especially under humidity conditions (65). 

Plasma processing technologies ate used for surface treatments and coatings for plastics, elastomers, glasses, metals, ceramics, etc. Such treatments provide better wear characteristics, thermal stability, color, controlled electrical properties, lubricity, abrasion resistance, barrier properties, adhesion promotion, wettability, blood compatibility, and controlled light transmissivity. 

Although the primary function of sealants is to seal, adhesion promoters are often added, which allows them to adhere to the adjoining base materials. It is therefore sometimes difficult to distinguish between an adhesive and a sealant. For example, structural silicone adhesives are used in the building construction industry owing to their sealing, adhesive, elastomeric properties, and their resistance to harsh environmental conditions [67,70,77]. 

PARTICULATE Organic Residual resist Contaminated cleaning reagents or adhesion promoters. Dirty spin coating equipment or drying ovens. Human debris such as dandruff, hair, etc. 

Other classes of silanes, namely alkoxy, halogenated, and other silanes [3, 9], are known to react with —OH containing compounds, and, therefore, should also function as adhesion promoters or surface modifiers for —OH containing substrates. Texas Instruments, for example, employed a 2% xylene solution of phenyltrichlorosilane to provide resist image adhesion to various oxide wafer substrates [10]. References 3, 9, and 10 describe many of these materials applied to silicone dioxide substrates. As for HMDS treatment, ESCA evidence of reactions to verify covalent bonding to surface silanol groups will be provided in... 

Additional adhesion promoters were tested on a silicon substrate. A 5.5 tm thick negative resist was employed and 75 fim deep moats were etched in the silicon using HN03-HF-acetic acid (8 4 3) at 10-15°C. Again, edge definition was examined by optical microscopy. 

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