Adhesion photo-resist material

In the case of a photoresist, the ultimate definable feature size together with the ability of the material to withstand either chemical etchants or plasma environments determines the domain of utility. The feature size is in turn determined by the wavelength required for exposure, the sensitivity and contrast of the resist, and the dimensional stability of the material during exposure, development, and subsequent processing. Adhesion of the resist to the substrate is critical both for patterning and use, and adhesion can be affected by surface preparations, and by residual stresses developed during deposition and cure. While photo-imagable polyimides have been introduced, their principal intended application is as a component of the finished part, either as passivant or interlevel dielectric (see below). 

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