Porous substrates

Infrared and Microwave Inks. These ate inks which have been formulated to absorb these radiant energies. The energy causes the inks to heat and dry through the partial evaporation of solvent. Absorption of the ink into a porous substrate can also be part of the overall drying mechanism with these inks. They have not found wide commercial success due to the variabiHty of the it absorption with ink color and the energy inefficiency of microwave systems in drying nonwater-based inks. 

Formulas for representative floor poHshes are Hsted in References 3, 12, 13, and 25. An aqueous formula may contain 0—12 wt % polymer, 0—12 wt % resin, 0—6 wt % wax, 0.3—1.5 wt % tris(butoxyethyl)phosphate, 1—6 wt % glycol ether, and 0—1 wt % zinc, with water filling the rest. Water-clear floor finishes contain Htfle or no wax, whereas buffable products contain relatively large amounts of wax. Sealers contain Htfle wax and relatively large amounts of emulsion polymers (28). For industrial use, sealers are appHed to porous substrates to fiH the pores and prevent poHshes that are used as topcoats from soaking into the floor. 

Membranes. Membranes comprised of activated alumina films less than 20 )J.m thick have been reported (46). These films are initially deposited via sol—gel technology (qv) from pseudoboehmite sols and are subsequently calcined to produce controlled pore sizes in the 2 to 10-nm range. Inorganic membrane systems based on this type of film and supported on soHd porous substrates have been introduced commercially. They are said to have better mechanical and thermal stabiUty than organic membranes (47). The activated alumina film comprises only a miniscule part of the total system (see Mel rane technology). 

Fillers are added to emulsion adhesives to build the total soflds content, to reduce penetration into a porous substrate, and to lower costs. 

Cyanoacrylate adhesives are particularly valuable because of their speed of action, which allows the joining of intricate parts without the need for complex jigs and fixtures. Within very broad limits the more monomer that is used to make a joint the less will be the strength. These adhesives have in fact no gapfilling ability, nor can they be used on porous substrates. Whilst they have good heat and solvent resistance their weathering behaviour is limited and joints should not be in frequent contact with water. 

Some rubber base adhesives need vulcanization to produce adequate ultimate strength. The adhesion is mainly due to chemical interactions at the interface. Other rubber base adhesives (contact adhesives) do not necessarily need vulcanization but rather adequate formulation to produce adhesive joints, mainly with porous substrates. In this case, the mechanism of diffusion dominates their adhesion properties. Consequently, the properties of the elastomeric adhesives depend on both the variety of intrinsic properties in natural and synthetic elastomers, and the modifying additives which may be incorporated into the adhesive formulation (tackifiers, reinforcing resins, fillers, plasticizers, curing agents, etc.). 

All of the eommereial alkyl eyanoaerylate monomers are low-viseosity liquids, and for some applications this can be an advantage. However, there are instances where a viseous liquid or a gel adhesive would be preferred, sueh as for application to a vertical surface or on porous substrates. A variety of viscosity control agents, depending upon the desired properties, have been added to increase the viscosity of instant adhesives [21]. The materials, which have been utilized, include polymethyl methacrylate, hydrophobic silica, hydrophobic alumina, treated quartz, polyethyl cyanoacrylate, cellulose esters, polycarbonates, and carbon black. For example, the addition of 5-10% of amorphous, non-crystalline, fumed silica to ethyl cyanoacrylate changes the monomer viscosity from a 2-cps liquid to a gelled material [22]. Because of the sensitivity of cyanoacrylate esters to basic materials, some additives require treatment with an acid to prevent premature gelation of the product. 

Isothermal Infiltration. Several infiltration procedures have been developed, which are shown schematically in Fig. 5.15.P3] In isothermal infiltration (5.15a), the gases surround the porous substrate and enter by diffusion. The concentration of reactants is higher toward the outside of the porous substrate, and deposition occurs preferentially in the outer portions forming a skin which impedes further infiltration. It is often necessary to interrupt the process and remove the skin by machining so that the interior of the substrate may be densified. In spite of this limitation, isothermal infiltration is used widely because it lends itself well to simultaneous processing of a great number of parts in large furnaces. It is used for the fabrication of carbon-carbon composites for aircraft brakes and silicon carbide composites for aerospace applications (see Ch. 19). 

Ernst K, Sieber I, Neumann-SpaUart M, Lux-Steiner M-Ch, Kdnenkamp R (2000) Characterization of II-VI compounds on porous substrates Thin Solid Films 361-362 213-217... 

Porous Membranes of Nanoparticies from Templating Against AAO Membranes Using LB Technique. AAO-porous substrate has broad applications in making metal and semiconductor nanowires, aligned mesostructured nanorods, inorganic nanotubes. 

The above discussion emphasizes the limitations imposed by the use of metal particles on porous substrates, and calls for further efforts in designing model systems for better understanding of PSEs in complex multistep electrochemical reactions. 

Hence, Tct is seen to increase with pore density and pore radius. However, a problem appears at a porous substrate when thin films are to be deposited during metallization to form interconnections, thin-film capacitors, etc.335 Sputtered material falls deep into the pores, which affects the planarity of the deposited layer and the electrical resistivity of the oxide layer underneath.335 To cope with this effect, the porous oxide should be padded by inorganic (A1203 and Si02) or organic (polyimide, negative photoresist) layers. 

The cost of Pd-alloy membranes used for hydrogen separation may be reduced by depositing a thin Pd-alloy film on a suitable porous substrate to form a composite membrane. Almost all of the Pd-alloy membrane development efforts are, thus, focused on preparing thin yet defect-free Pd-alloy composite membranes (e.g., Hopkins, 2007 Coulter, 2007 Delft et al., 2005 Damle et al., 2005 Mardilovich et al., 2002). A detailed review of the Pd-alloy membrane research has been prepared by Paglieri and Way (2002) with an extensive bibliography of the palladium membrane research to date. An updated review has been recently prepared by Collot (2003) and Paglieri (2006). 

Moller, J. Fischer, Ch.-H. Muffler, H.-J. Konenkamp, R. Kaiser, I. Kelch, C. Lux-Steiner, M. C. 2000. A novel deposition technique for compound semiconductors on highly porous substrates ILGAR. Thin Solid Films 361-362 113-117. 

The effect of charge density is, however, the same as for polyelectrolyte adsorption by non-porous substrates, i.e. the lower the charge density the higher the level of adsorption. For example, the... 

Structure EANPS = electrostatic agglomerated nonporous substrate, EAWPS = electrostatic agglomerated wide-pore substrate, PGPS = polymer grafted porous substrate, SMPSS = silane modified porous silica substrate, CMS = chemically modified substrate, APCS = adsorbed polymer coated substrate. 

All of the examples of PEMs discussed within Section 3.3 unhl now have been composed of only one polymer system without any other compounds present—be they small molecules, polymers, or solid-state materials. A wide variety of different polymer blend and composite PEMs has been made. However, in this section, only a brief overview highlighting some of the more interesting examples that have been reported in the literature will be presented. Eor discussion, these types of PEMs have been divided into three categories polymer blends, ionomer-filled porous substrates and reinforced PEMs, and composite PEMs for high-temperature operation and alternative proton conductors. 

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