Poly electronic applications

Laskarakis A, Logothetidis S, Kassavetis S et al (2007) Surface modification of poly(ethylene terephthalate) polymeric films for flexible electronics applications. Thin solid films 516 1443-1448... 

Of all the commercially available organic and inorganic polymeric materials, RTV silicone elastomer has proved to he one of the most effective encapsulants used for mechanical and moisture protection of the Integrated Circuitry (1C) devices. A general overview of the RTV silicone elastomer and its commercial preparation and cure mechanism are described. Improved electrical performance of the RTV silicone encapsulant, by immobilizing the contaminant ions, such as Na, K" , Cl , with the addition of the heterocyclic poly-ethers as the contaminant ion scavengers seems to have a potential application as the contaminant ionic migration preventor in the electronic applications. 

A particularly interesting example is the synthesis of alkyne-bridged oligomers and polymers, which are attractive materials for optical and electronic applications. Bunz and coworkers were able to modify the Mortreux catalyst system [Mo(CO)6 and a suitable phenol]11 and reaction conditions to perform acyclic alkyne metathesis of 1,4-dipropynylated benzenes to produce high-molecular-weight poly(p-... 

PEN film for audio- and videotape and various electronic applications and blow molded PEN containers for hot-fill applications are already being marketed in Japan. NDA is unlikely to ever become as inexpensive as terephthalic acid but novel NDA-based polyesters will become available if a market need exists. One example could be the experimental polyester PBN (Celanese Corp.) this is the NDA analogue of PBT, poly(l,4-butylene naphthalene-2,6-dicarboxylate) [28779-82-0]. It has a high rate of crystallization, faster even than that of PBT, and its combination of physical properties is well-suited for injection molding. 

The second approach has the advantage that it provides flexibility in the choice of means to perform the printing. Figure 10.14 shows a stamp with this construction, designed for plastic electronics applications [42]. It consists of a thin layer of PDMS on top of a sheet of polyimide. The relatively high in-plane modulus of the poly-imide prevents distortions that can frustrate registration. Its small thickness enables the stamp to be bent in a manner that facilitates printing. 

Regioregular poly(5,5 -(4,4 -dihexyl-2,2 -bithiazole)), (I), was prepared by Curtis [4] and used in electronic applications such as LED s, rechargeable batteries, and electrolytic capacitors. 

Enzymatically synthesized polyphenol derivatives are expected to have great potential for electronic applications. The surface resistivity of poly(p-phe-nylphenol) doped with nitrosylhexafluorophosphate was around 105 Q.4a The iodine-labeled poly(catechol) showed low electrical conductivity in the range from 10 6 to 10 9 S/cm.48 The iodine-doped thin film of poly (phenol- co- tetradecyloxyphenol) showed a conductivity of 10 2 S/cm, which was much larger than that obtained in aqueous 1,4-dioxane.24a The third-order optical nonlinearity (%3) of this film was 10 9 esu. An order of magnitude increase in the third-order nonlinear optical properties was observed in comparison with that prepared in the aqueous organic solution. 

The most important commercial blends of BPA-PC are poly(acrylonitrile-butadiene-styrene) (PC/ABS) and polybutylene terephthalate (PC/PBT) or polyethylene terephthalate (PET). Commercial grades of PC/ABS include CYCOLOY (GE), Bayblend (Bayer), and PULSE (Dow). PC/ABS blends exhibit improved flow and processability and enhanced low-temperature impact strength in comparison to PC (Fig. 3). These blends are widely used in applications requiring enhanced impact resistance, such as interior automotive parts and computer and electronics applications such as computer housings and cell phones. Non-halogenated flame-retardant PC/ABS blends are widely available. Poly(acrylic-styrene-acrylonitrile) (PC/ ASA) blends (GELOY , GE Luran , BASF) provide improved weatherability for outdoor applications such as exterior automotive parts, but exhibit reduced impact performance at low temperatures in comparison to PC/ABS. PC/PBT or PET blends (XENOY , GE Makroblend , Bayer) provide enhanced chemical resistance and weatherability for applications such as lawn and garden equipment and automotive bumpers and fasdas. 

Poly thiophene [78] is a promising material for certain future electronic applications, due to its relatively high stability and processability in the substituted form [79-81]. Upon substitution, with e.g. alkyl side-chains [79, 80], polythiophene exhibit properties such as solvatochromism [82] and thermochromism [83]. Presently, a large variety of substituted polythiophenes with various band gaps exists (for example see Ref. [81]). 

Other studies reported in the literature involve the fractionation of a high molecular weight silicone oil, a poly(dimethyl)siloxane (Krukonis, 1983c). In the early 1980s, the material was being tested for an electronics application. 

PolvCvinvl chloride). The application of poly(vinyl chloride) as wire and cable insulation occurred after the development of flexible formulations in the mid-1930s. Typical compositions for insulation purposes contain from 50 to 70% poly(vinyl chloride) the remainder is plasticizers, fillers, lubricants, and stabilizers. These formulations provide a combination of attractive features such as good mechanical properties, resistance to oil and moisture, and low flammability. Its main applications are in building wire for connection of outlets and switches with main panels, in equipment and apparatus cables, and in 1ow-temperature electronic applications it is also found in flexible and retractable cords, in telephone wires, and in power cables. 

Polv(ethylene terephthalate). Poly(ethylene terephthalate) film is a widely used industrial product. However, only a small fraction of the total film production is used in electrical applications (see also section on polymers for electronic applications). 

Macdonald and C.G. Willson, Poly(N alkysl o nitroamides) A new class of thermally stable photosensitive polymers, in Polymer Materials for Electronic Applications, ACS Symposium Series 184, E.D. Feit and C. Wilkins, Jr., Eds., American Chemical Society, Washington, D.C., pp. 73 82 (1982). A. Reiser, Photoreactive Polymers The Science and Technology of Resists, p. 267, John Wiley Sons, Hoboken, NJ (1989). 

Glass-filled, toughened poly(ethylene terephthalate) (PET) resins can be readily moulded into highly impact-resistant structural parts for appliances and automotive components. The PET-based compounds are also suitable for construction (e.g. as structural members), equipment housings (e.g. printer and copier parts), agricultural applications (e.g. mower and tractor engine covers), materials handling (e.g. pallets and ttays), furniture (e.g. office chair bases), as well as electrical and electronic applications. 

Another group of thermally stable polymeric materials for electronic application includes poly(ether-imide-benzoxazolejs. Mercer and McKenzie [228] prepared the polymer by polycondensation of 2,2 -bis[2-(4-aminophenoxy)benzoxazole-6-yl] hexafluoropropane with pyromellitic, biphenyl, benzophenone etc., followed by thermal imidization of polyamic acid films. The polymers showed an onset temperature for polymer degradation in the range of 424°-456°C and glass transition temperatures in the range of 299 -337°C. 

Polymeric derivatives of aryloxazoles have been investigated for use in optical and electronic applications. These have been prepared by doping existing poly-... 

Melt blending poly(phenylene ether), poly(styrene) and curable epoxy resins yields materials that are suitable for use as adhesives in electronics applications. In particular, the composition is useful in laminating films for electronic applications. 

R. K. Goyal, A. N. Tiwari, U. P. Muhk, and Y. S. Negi. Novel high performance Al203/poly(ether ether ketone) nanocomposites for electronics applications. Compos. Sci. Tech., 67(9) 1802-1812, luly 2007. 

Figure 1.3 OE-A roadmap for the charge carrier mobility of semiconductors for organic electronics applications. The values refer to materials that are available in commercial quantities and to devices that are manufactured in high throughput processes. The values for amorphous silicon (a-Si) and polycrystalline silicon (poly-...

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