Pick place machines

FIGURE 4.14 Cartesian gantry system of an SMD pick place machine... 

TABLE 4.1 Properties of the Kinematics of an SMD Pick Place Machine... 

SMD Pick Place Machine with Manually Operated Workpiece Carrier... 

One way of extending the 3D capability of an SMD pick place machine is to use a workpiece carrier with defined angular settings for the individual process surfaces of the MID (Fig. 4.15). These settings are presets deriving from the design of the... 

FIGURE 4.18 SMD pick place machine with integrated six-axis multiple-articulation robot... 

FIGURE 4.21 Automated workpiece carrier in SMD pick place machine Siplace HF... 

Pfeffer, M., Goth, C., Craiovan, D., Franke, J. 3D-Assembly of Molded Interconnect Devices with Standard SMD Pick Place Machines Using an Active Multi Axis Workpiece Carrier. In Proceedings 2011 IEEE International Symposium on Assembly and Manufacturing, ISAM 2011, Tampere (Finland), 25-27 May 2011. 

Verein Deutscher Ingenieure (VDI), Verband der Elektrotechnik Elektronik Informationstechnik (VDE) Placement of printed circuit boards determination of placement accuracy and performance of SMD pick place machines. Berlin Beuth-Verlag, 1991. 

In Table 4-2, we have the standard SMD component sizes. Note that usually, most pick and place machines cannot mount anything bigger than size 1515. So larger components may need to be hand-soldered. For ceramic capacitors, reliability requirements call for a certain... 

FIGURE 15.3 Die-on-wafer approach to 3D integration demonstrated by Markunas (Ref. 25) and Tong et al. (Ref 23). (a) A die pick-and-place machine populates a metallized wafer, (b) Cross section of stacked die on wafer-level interconnect. 

Bursters from the mortars and projectiles are fed into the burster washout machine (BWM) by a pick-and-place machine and processed in the BWMs to wash out all explosives. 

When the ERD receives the fuzes, booster cups, and miscellaneous parts from the WPMD, it heats them until they are deenergized (i.e., until they deflagrate or detonate). The shell of the ERD is maintained at 1,250°F (677°C) by electric-induction heating, and the parts are heated to 650°F (343°C) in about 5 minutes. One ERD is located in each of the two ECRs. The deenergized fuzes and booster cups then exit the ERD onto a conveyor that moves them to the batch MPT for 5X decontamination. Before exiting the ECR, washed burster tubes from the BWM are added to the same conveyor. In the parts transfer area, the conveyor material drops into a container, which is placed on the batch MPT conveyor by a pick-and-place machine. En route to the batch MPT, the containers stop to receive burster wells that have been removed at the WMDM. 

Bursters from the mortars and projectiles are fed into the BWMs by a pick-and-place machine and processed in the BWMs to wash out aU explosives (Parsons, 2000c). There is one BWM in each ECR (total of two). The BWM has a rotary carousel with multiple receptacles. Bursters are aligned with a multinozzle water-jet washout probe on the BWM so that the jet cuts into the explosive charge axially from the open end. The water jet, which contains no abrasive, is injected at about 12,000 psi, although lower pressures of 2,000 to 3,000 psi are being considered. When the jet reaches the end of the burste tube, the water-jet probe is withdrawn. The washed burster tubes are discharged from the BWM one at a time onto a conveyor for transport to a container-loading station in the parts transfer area and then conveyed to the batch MPT for 5X decontamination. 

Robot placement systems have till now been used primarily to place exotic THT components such as coils and plugs, whose assembly is not possible with pick-and-place machines. The application of... 

Anon., Software Enables Screen Printer to Communicate with Pick-and-Place Machine, Hybrid Circuit Technology, Vol. 7, No. 2, February 1990, pp. 23-24. Hall, S., Screen Printer Requirements for Low Defect Process Capability, Electronic Packaging and Production, Vol. 34(Suppl.), August 1994, pp. 4-6. 

A number of assembly-related issues must be addressed with odd-form components. First, it is necessary that correct pad dimensions be designed on the circuit board. Also, the stencil must have the correct aperture size to print an adequate quantity of solder paste. The pick-and-place machine may require custom tooling in order to handle these components. Lastly, odd-form parts are typically larger and heavier. Therefore, it is possible that they wiU not readily self-align while the solder is molten during the reflow process. 

Component Placement. The purpose of the component placement machine—also called the pick-and-place machine—is to select the proper component, orient it correctly, and then place it on the circuit board, all with degrees of accuracy and precision that minimize defects on the finished product. In addition, the component must be placed on the printed solder paste, the dispensed adhesive, or a combination of the two deposits with a controlled pressure or release distance that does not excessively spread out either material or damages the component package. Moreover, the placement machine must execute these tasks as quickly as possible in order to maximize the production volume. Lastly, the equipment must be sufficiently versatile to address continually changing electronic packages, specifically dimensions and I/O configurations. 

The selective coating process utilizes a robot similar to the automated pick-and-place machine to dispense coating only where it is needed. Four or five axis machines can be used to coat the sides of tall parts and around corners. 

Automated processes with adhesives are possible and can be combined with processes of pretreatment or further steps like applying electric pieces via pick-and-place machines. 

Accuracy, placement speed and high uptime make the parallel placement type of pick-and-place machine competitive for dome placement. For example, parallel operation of ten placement robots on a single platform achieves a maximum machine throughput greater than 42,000 domes per hour (or more than 84,000 domes per hour if the platform is populated with the maximum number of robots). 

Upon exit from the machine, the laminate is interleaved with paper to protect the domes, and then re-reeled. Currently, pick-and-place, screen printer, dispenser, and reflow specialists are working in partnership to produce a fully integrated flowline concept for dome processing and other reel-to-reel applications. The reflow machine is huilt on the same base as the pick-and-place machine (Figure 2) for placement of sticky foils onto PCBs. 

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