Packaging hierarchy

The Electronic Packaging Hierarchy. Electronic packaging is broadly defined as the physical interconnection of electronic and electromechanical components to provide an enclosed system that provides for power and signal distribution, allows heat dissipation, and protects the components from the environment (1). Efficient construction and configuration of an electronic system is obtained through the packaging hierarchy (1) shown in Figure 1. 

To have the proper perspective on where PWBs fit into electronic systems, it will be helpful to describe briefly the packaging hierarchy of electronic systems. Some time ago, the Institute for Interconnecting and Packaging Electronic Circuits (IPC) proposed eight categories of... 

In this fashion, we can build up a hierarchy of basic types and operators—not only the syntactic definitions but also their meanings And because the basics can be different for different modeling and programming languages—for example, not all have exactly the same idea of the passage of time—different packages can be supplied for users of different dialects and can be referenced as stereotypes. 

A product hierarchy comprises product line, product group, product and article. Product line and product group combine products by common characteristics on two aggregation levels. A product is the direct input or output of a production process articles include also packaging information. Therefore, one product can be filled into multiple articles. 

Figure 1. Hierarchy of packaging structures in a large electronic system. (Reproduced with permission from reference 4. Copyright 1983 Scientific...

Subclassifications of Fuel-Cycle Wastes. As shown in the third level of the hierarchy in Figure 1.1, transuranic waste and low-level waste are further divided into different subclasses. The subclassification of transuranic waste as contact handled or remotely handled is based on the level of external radiation in contact with a waste package. This subclassification is related to requirements for protection of workers during waste operations, but it is not related to requirements for protection of the public following disposal. 

Although the primary thermal transport mechanisms and the commonly used heat removal techniques vary substantially from one packaging level to the next, in general, heat removal can be addressed hierarchically. The first level of the hierarchy is at the chip package (IC) level where heat conducts from the chip or component to the package surfaces through interface materials and is then rejected from the outer surfaces (heat sink and the board) into ambient air (Figure 4). 

The hierarchy of interconnection is typically as follows Zero level—interconnection of elements on the IC chip itself. This level of interconnection is intrinsically part of the chip design. First level—connection of the IC chip to the next-higher level, usually an IC package, either by wire bonding or, more recently, by TAB. 

Polymers are playing increasingly important roles in packaging and interconnection as the versatility of being able to customize their mechanical and electrical properties becomes better established and more well known. The rest of this book presents specific chapters on polymeric materials and their applications in this field. In reading them it is hoped the reader will keep in mind the increasingly important roles of these materials, their consequent market value, and their place in the hierarchy of electronic packaging and interconnection. 

S. A. Kuhn, M. B. Kleiner, P. Ramm, W. Weber. Performance improvement of the memory hierarchy of RISC-systems by application of 3-D technology. IEEE Trans. On Components, Packaging, and Manufacturing Technology, Part B Advanced Packaging, Vol. 19 No. 4,... 

Every mBuild hierarchy also maintains a network of bonds between its Particles in the form of a graph as provided by the NetworkX package [13]. This graph is maintained by the root (top level component) of the given hierarchy. When two Compounds with bonds are added together, their bond graphs are composed. 

Erom the top to the bottom of the template hierarchy the scope and the content of the respective templates increase considerably, e.g., from simple geometry to complex system representations. Furthermore also the complexity of the creation of the template and the required representation mechanisms increases rapidly for the template creator. One important challenge for end-user acceptance and to master the increasing and challenging template contents is to package the complexity for the end user in an easy-to use black box or grey box with defined interfaces to the other CAD elements at template instantiation. 

The Packaging Machinery Manufacturers Institute is the secretariat for the standard Safety Requirements for Packaging and Packaging-Related Converting Machinery. A revision of B 155.1 was approved by ANSI in July 2006 it replaced the version issued in 2000. In part, this is the guidance given on the use of the The Hazard Control Hierarchy, a five-step process ... 

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