4,4-oxydianiline

Poly(phenylquinoxaline—arnide—imides) are thermally stable up to 430°C and are soluble in polar organic solvents (17). Transparent films of these materials exhibit electrical insulating properties. Quinoxaline—imide copolymer films prepared by polycondensation of 6,6 -meth5lene bis(2-methyl-3,l-benzoxazine-4-one) and 3,3, 4,4 -benzophenone tetracarboxyUc dianhydride and 4,4 -oxydianiline exhibit good chemical etching properties (18). The polymers are soluble, but stable only up to 200—300°C. 

An all aromatic polyetherimide is made by Du Pont from reaction of pyromelUtic dianhydride and 4,4 -oxydianiline and is sold as Kapton. It possesses excellent thermal stabiUty, mechanical characteristics, and electrical properties, as indicated in Table 3. The high heat-deflection temperature of the resin limits its processibiUty. Kapton is available as general-purpose film and used in appHcations such as washers and gaskets. Often the resin is not used directly rather, the more tractable polyamide acid intermediate is appHed in solution to a surface and then is thermally imidi2ed as the solvent evaporates. 

Hedrick et al. reported imide aryl ether ketone segmented block copolymers.228 The block copolymers were prepared via a two-step process. Both a bisphenol-A-based amorphous block and a semicrystalline block were prepared from a soluble and amorphous ketimine precursor. The blocks of poly(arylene ether ether ketone) oligomers with Mn range of 6000-12,000 g/mol were coreacted with 4,4,-oxydianiline (ODA) and pyromellitic dianhydride (PMDA) diethyl ester diacyl chloride in NMP in the presence of A - me thy 1 morphi 1 i nc. Clear films with high moduli by solution casting and followed by curing were obtained. Multiphase morphologies were observed in both cases. 

The kinetics of PAA, synthesized from 4,4 -oxydianiline and pyromellitic dianhydride, solid-state imidization both in filler absence and with addition of 2 phr Na+-montmorillonite was studied [1], The nanofiller was treated by solution of P-phenylenediamine in HC1 and then washed by de-ionized water to ensure a complete removal of chloride ions. The conversion (imidization) degree Q was determined as a function of reaction duration t with the aid of Fourier transformation of IR-spectra bands 726 and 1014 cm 1. The samples for FTIR study were obtained by spin-coating of PAA/Na+-montmorillonite mixture solution in N,N-dimethylacetamide on KBr disks, which then were dried in vacuum for 48 h at 303 K. It was shown, that the used in paper [1] method gives exfoliated nanocomposites. The other details of nanocomposites polyimid/Na+-montmorillonite synthesis and study in paper [1] were adduced. The solid-state imidization process was made at four temperatures 7) 423, 473, 503 and 523 K. 

Polyimides derived from 3,3, 4,4 -benzophenone tetracarboxylic acid dianhydride (BTDA), I, and 3,3 -diaminobenzophenone (m,m -DABP), IIA, 4,4 -diaminobenzophenone (p,p -DABP), IIB, or 4,4 -oxydianiline, IIC, (and to which have been added numerous metal compounds) have been prepared. The synthetic procedure em-... 

Further work in this area is underway employing polyamic acid systems which are known to produce higher viscosity solutions (e.g. polyimides derived from 4,4 -oxydianiline and either BTDA or pyromellitic dianhydride). This is being carried out in the belief that higher viscosity solutions will give rise to higher quality, less brittle films and will, thereby, enable a broader spectrum of metal systems to be studied regarding the adhesive and electrical conductance properties of metal ion filled polyimides. 

Example the source-based name poly[(benzene-l,2,4,5-tetracarboxylic 1,2 4,5-dianhydride)-a/t-(4,4 -oxydianiline)] is ambiguous ambiguity about the structure is removed by writing poly(amide-acid) [(benzene-1,2,4,5-tetracarboxylic 1,2 4,5-dianhydride)-a/t-(4,4 -oxydianiline)] to accompany the graphical structure-based representation... 

I. poly(amide-acid) [(pyromellitic dianhydride) -a/i-(4,4 -oxydianiline)] (Both carboxy groups result from the polymerization reaction.)... 

The polyimide is formed by the thermal polycyclocondensation of the poly(amide acid). For this purpose, 5 ml of poly(amide acid) solution are placed on a watch glass (diameter 10 cm) and kept in a vacuum oven at 50 °C for 24 h.The solvent evaporates and at the same time cyclization to the polyimide takes place the resulting film is insoluble in dimethylformamide.The formation of the polyimide can be followed by IR spectroscopy the NH-band at 3250 cm disappears while imide bands appear at 1775 and 720 cm" Once the initial drying process has raised the solid content to 65-75%, the polyimide formation can be accelerated by heating the poly(amide acid) film to 300 °C in a vacuum oven for about 45 min.The polyimide made from pyromellitic dianhydride and 4,4 -oxydianiline exhibits long-term stability in air above 200 °C. 

Naphthylamine, 4-aminodiphenyl, 4-chloro-2-toluidine, benzidine, 2,4,5-trimethylaniline, 2,4-diaminoanisol, 2,4-toluylenediamine, 2-amino-4-nitrobenzene, 3,3 -dichlorobenzidine, 3,3 -dimethoxybenzidine, 3,3 -dimethylbenzidine, 3,3 -4,4 -diaminodiphenylmethane, 4,4 -diaminodiphenybnethane, 4,4 -methylene-bis-(2-chloroaniline), 4,4 -Oxydianiline, 4,4 -thiodianiline, 2-aminoazotoluene,... 

Adhesive films consisting of thermoplastic polyimides were prepared by Yanagida et al. (3) consisting of 4,4 -oxydianiline, p-phenylenedi amine, and... 

The key to acetylene terminated polyimides is the availability of the end-capper which carries the acetylene group. Hergenrother (130) published a series of ATI resins based on 4-ethynylphthalic anhydride as endcapping agent. This approach first requires the synthesis of an amine-terminated amide acid prepolymer, by reacting 1 mole of tetracarboxylic dianhydride with 2 moles of diamine, which subsequently is endcapped with 4-ethynylphthalic anhydride. The imide oligomer is finally obtained via chemical cyclodehydration. The properties of the ATI resin prepared via this route are not too different from those prepared from 3-ethynylaniline as an endcapper. When l,3-bis(3-aminophenox)benzene was used as diamine, the prepolymer is completely soluble in DMAc or NMP at room temperature, whereas 4,4 -methylene dianiline and 4,4 -oxydianiline based ATIs were only partially soluble. The chemical structure of ATIs based on 4-ethynylphthalic anhydride endcapper is shown in Fig. 45. 

Polyamideimides (PAI) are generally prepared by the condensation polymerization of a trifunctional acid anhydride (e.g., trimellitic anhydride, TMA) with an aromatic diamine (e.g., 4,4 -methylene- or 4,4 -oxydianiline, MDA and... 

Aromatic polyimides have excellent thermal stability in addition to their good electrical properties, light weight, flexibility, and easy processability. The first aromatic polyimide film (Kapton, produced by DuPont) was commercialized in the 1960s and has been developed for various aerospace applications. The structure of a typical polyimide PMDA/ODA prepared from pyromellitic dianhydride (PMDA) and 4,4 -oxydianiline (ODA), which has the same structure as Kapton, is shown in (1). Aromatic polyimides have excellent thermal stability because they consist of aromatic and imide rings. 

The two-step poly(amic acid) process is the most commonly practiced procedure. In this process, a dianhydride and a diamine react at ambient temperature in a dipolar aprotic solvent such as N,N- dimethyl acetamide [127-19-5] (DMAc) or N-methylpyrrolidinone [872-50 4] (NMP) to form apoly(amic acid), which is then cyclized into the polyimide product. The reaction of pyromellitic dianhydride [26265-89 4] (PMDA) and 4,4 -oxydianiline [101-80-4] (ODA) proceeds rapidly at room temperature to form a viscous solution of poly(amic acid) (5), which is an ortho-carboxylated aromatic polyamide. 

Aminophenyl Ether (4,4-Oxydianiline, 4,4-Diaminodiphenyl Oxide, N-Phenylbenzeneamine)... 

E.K. Weisburger, et al., Neoplastic response of F344 rats and B6C3F1 mice to the polymer and dyestuff intermediates 4,4-Methylenebis (N,N-dimethyl)-benzenamine, 4,4-Oxydianiline and 4,4-Methylenedianiline. J. Natl. Cancer Inst. 72 1457-1463,... 

Polyimides have excellent dielectric strength and a low dielectric constant, but in certain electrolyte solutions they can electrochemically transport electronic and ionic charge. Haushalter and Krause (5) first reported that Kapton polyimide films derived from 1,2,4,5-pyromellitic dianhydride (PMDA) and 4,4 -oxydianiline (ODA) undergo reversible reduction/oxidation (redox) reactions in electrolyte solutions. Mazur et al., (6) presented a detailed study of the electrochemical properties of chemically imidized aromatic PMDA- derived polyimides and model compounds in nonaqueous solutions. Thin films of thermally... 

Systems that employed HREELS for interfacial-composition determinations included poly(ethylene oxide)-polystyrene diblock copolymer on Si wafers formaldehyde poly(oxymethylene) films on Cu(lOO) and Lang-muir-Blodgett films of 4,4 -oxydianiline-pyromellitic dianhydride polyimide on Au and on highly ordered pyrolytic graphite. ... 

Poly(imides) contain the group -C(0)-NH-C(0)- in their structure. Many poly(imides) with practical applications have a more complicated formula and contain oxygen atoms and aromatic rings in the backbone [1]. One example is poly(pyromellitic dianhydride-a/f-4,4 -oxydianiline) or PMDA-ODA, CAS 25038-81-7, which is obtained from pyromellitic anhydride and oxybis(benzenamine) by water elimination as follows ... 

Name Poly(pyromellitic dianhydrlde-a/f-4,4 -oxydianiline) or Poly(1,3,5.7-telraoxo-2,3,6.7-tetrahydro-(1H,5H)-2,6-benzo[1,2c 4,5c )-dipyrrol-diyl-1,4-phenylene-oxy-1,4-phenylene)... 

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