Multi-layer thin film

Reports have shown that multi-layer thin films can be fabricated by an alternating deposition of two kinds of molecules with affinity to each other. This... 

When one views the membrane as a multi-layer thin film device, he begins to understand how the interphases control its electrophysical properties and the reaction rates across its junctions (18) (29). 

Kim J-B, Lee H-Y, Lee K-S, Ltm S-H, Lee S-M (2003) Fe/Si multi-layer thin film anodes for lithium rechargeable thin film batteries. Electrochem Commun 5 544—548... 

Dauskardt, R.H., Lane, M., Ma, Q., 1998. Adhesion and debonding of multi-layer thin film structures. Eng. Fract. Mech. 61, 141—162. 

Interesting self-assembled multi-layer thin films 65 of covalently bonded porphyrins were utilized starting from chloromethylphenylsilylated oxide surfaces in the reaction with tetrapyridyl-substituted porphyrins and dichloro-/7-xylene [269]. The growth of the film was studied by monitoring the absorption intensity of the Soret-band. It is said that a highly ordered and closely packed film was obtained. 

An example of the use of the symmetric four-point flexure specimen for the experimental determination of interfacial fracture resistance in a multi-layer thin film structure is now considered. Figure 4.32 shows a typ-... 

Ellipsometry is a powerful tool to gain the optical properties of materials though measuring the change of polarization state of the probe light after interaction with the sample. It offers a sensitive, nondestructive and comprehensive way to accurately determine film thickness and optical constants of extensive materials, such as metals, ceramics, glasses, semiconductors, and its compounds and composites. These materials can be liquid phase or even gaseous phase, can be isotropic or anisotropic, and can be bulk materials or multi-layer thin films. 

Kim, G.H., Chang, H.W. and Lee, S.Y (2005) Characterizations of phosphorus doped ZnO multi-layer thin films to control carrier concentration. Superlattices and Microstructures, 38, 377. 

Periodic nanostructured layers promise wide applications in electronic and optoelectronic devices. Photoelectrochemical and electrochromic structures are among them [1]. The most suitable process for formation of such layers is electrochemical anodization of tantalum-aluminum multi-layer thin-fllm compositions. This process is inexpensive and permits to form nanostructured pillar layers of Ta205 with large surface area. Details of Ta20s pillar formation from two-layer Al/Ta thin film compositions were described in our previous papers [2,3]. The main purpose of our further investigations was to investigate the processes of anodization of a multi-layer Al/Ta/Al structure. It was found that application of the bottom A1 layer improves uniformity of nanostructured pillar layers due to more homogeneous current supply. Besides, this layer serves as an electrode of a metal/dielectric/metal (MDM) sfructure. Furthermore, such metals as Nb and Ti may be used instead of Ta layer. 

Furthermore, LEED is an important tool to study thin film growth, and can reveal the mechanism of thin film formation as well as the final stmcture of mono/multi topmost layers versus substrate [Attard et al., 1995]. 

Fig. 20.1. MAC Mode AFM three-dimensional images in air of (A) clean HOPG electrode (B) thin-film dsDNA-biosensor surface, prepared onto HOPG by 3 min free adsorption from 60 pg/mL dsDNA in pH 4.5 0.1 M acetate buffer (C) multi-layer film dsDNA biosensor, prepared onto HOPG by evaporation of three consecutive drops each containing 5pL of 50 pg/mL dsDNA in pH 4.5 0.1 M acetate buffer (D) thick-film dsDNA biosensor, prepared onto HOPG by evaporation from 37.5mg/mL dsDNA in pH 4.5 0.1M acetate buffer. With permission from Refs. [28,29].

Metallization. In the fabrication sequence described in Table I, metal layers are used as conductive paths between points on the same integrated circuit or as contact points between the IC and its package. The metal layers may be single component, multi-component alloys or multilayered thin films depending on the application. The methods used for depositing the metal are... 

A multi-layer module 18 consisting of thin insulating wafers 20 formed from a ceramic material is prepared. The wafers have a large number of thin film electrically-conducting leads on their surfaces. The leads end at points 22 located on the focal plane surface 24 of the module. The lengths of the ceramic wafers are staggered to give access to lead pads 26 on the face of each wafer. 

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