Multilayer thin films

Copper/Polyimide Thin Film Multilayer Interconnect Structure... 

Figure 16. Cross section of thin-film multilayer interconnections on a pinned cofired ceramic substrate, with face-up tape-automated-bonded chip and thermal vias. (Reproduced with permission from reference 79. Copyright 1988 Materials Research Society.)...

Material Options for Thin-Film Multilayer Interconnections... 

A typical polyimide (BDTA-ODA-MPD) for thin-film multilayer interconnections... 

Figure 17. Subtractive approach for processing thin-film multilayer structures.

Figure 1. Proposed approach for multichip packaging using thin film multilayer Cu/polyimide interconnections.

The investigated samples are thin film multilayer nanostructures [3-6]. Each structure unit is a nanolayer wdth a locally distributed nanociystal array inside it. The geometry of the nanostructures can be tuned by controlling the thicknesses and the arranging of the sensitizing and complementary, buffer or matrice, components. Every nanolayer can be designed as one material, as composition of nanocrystals, of clusters of two materials [3-5]. 

C. P. Chang, Y.H. Lee, S.Y. Wu, Optimization of a thin-film multilayer design by use of the generalized simulated-annealing method, Optics Letters, 15 (1990) 595. 

Dry-chemistry immunoassay systems that require no liquid reagents and no sample pretreatment have also been developed for One system uses a thin-film multilayer... 

Typical Thin Film Multilayer Package Structure... 

Table 2.4. Binary metal/metal systems observed to exhibit solid-state amorphiz-ation by interdiffusion or other type of driven mixing (e.g. mechanical codeformation). The table lists the type of experiment, the typical reaction temperature, TR (for the case of interdiffusion reaction) and references. (B thin-film bilayer diffusion couples, M thin-film multilayer diffusion couple, S interdiffusion of polycrystalline layer of one component with single crystal of another component, MA mechanical alloying of the metals, MAT thermal reaction of a mechanically deformed composite...

In the previous sections, we summarized the current understanding of mechanical stresses in several individual thin films. One more significant fact has to be mentioned the stress behavior of thin film multilayer stacks is not simply the sum of the stresses of the individual layers. Instead, stacked thin films can pronouncedly affect each Ollier s properties [41]. Consequently, this influence has to be considered when selecting materials for an application. 

An important theme of this volume is the interrelationships among materials chemistry, photonic and optoelectronic properties, and device performance. The design and synthesis of novel polymer compositions and architectures aimed at enhanced properties are emphasized in some chapters. Other contributions feature the development of novel approaches to processing and fabrication of photonic and optoelectronic polymers into thin films, multilayers, fibers, waveguides, gratings, and device structures. These approaches, which emphasize polymer synthesis, processing, and device fabrication, are complementary and synergistic. 

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