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Metallization devices

Metallic devices have been used to repair and replace parts of the human body for centuries. Archaeological evidence clearly indicates that surgical procedures were performed in several ancient civilisations. The use of surgical metal implants in humans was first recorded in 1562 when a gold prosthesis was used to close a defect in a cleft palate. ... [Pg.468]

In this section the electronic structure of metal/polymcr/metal devices is considered. This is the essential starting point to describe the operating characteristics of LEDs. The first section describes internal photoemission measurements of metal/ polymer Schottky energy barriers in device structures. The second section presents measurements of built-in potentials which occur in device structures employing metals with different Schottky energy barriers. The Schottky energy barriers and the diode built-in potential largely determine the electrical characteristics of polymer LEDs. [Pg.495]

Efforts to improve IUDs have led to the use of medicated devices. Two types of agents are generally used—contraceptive metals and steroid hormones. The metal device is exemplified by the CU-7, a polypropylene plastic device in the shape of the number 7. Copper is released by a combination of ionization and chelation from a copper wire wrapped around the vertical limb. This system is effective for up to 40 months. [Pg.524]

Primer cap A small metal device containing an impact-sensitive primary high explosive commonly found in ammunition or used in initiators. [Pg.196]

Finally, it is practically impossible to assess the retention of metallic deposits from construction materials because the amounts in the feed gas entering the catalyst are totally unknown. Only in a few instances have analyses of used catalysts for elements deriving from construction materials been made available (10, 25). Significant differences in the content of Fe, Cr, or Ni of used catalysts have been noted when upstream of the examined catalyst there were situated metallic devices operating at high temperatures, such as thermal reactors, or reduction base metal catalysts (50). [Pg.326]

For high-pressure applications and very secure run of chemical reactions, diffusion-bonded metal devices are the optimum choice. As a result of the process... [Pg.10]

Besides numerous biomedical metallic devices, platinum is now used chnicaUy in several important antitumor drugs notably Cisplatin (di-[PtCl2(NH3)2]), Carboplatin (di-[Pt(l,l-ciclobutanedicarboxilato)(NH3)2]), and Oxali-platin ([Pt(oxalato)(tran5 -L-diaminocyclohexane)]), which are... [Pg.3891]

We have described how a molecule which has an internal electronic asymmetry should exhibit rectifying properties. However, since we are interested in current flow rather than simply charge separation within the molecule, we must characterize the molecule as part of a circuit. It is important to realize that the measurements being made are of the junction as a whole rather than just the molecular properties. That is to say, the electrical response is a convolution of the molecular properties, the external circuit and, in particular, the contacts between the molecule and the electrodes. The interactions at the interfaces are responsible for many of the effeets that are observed in metal-insulator-metal devices. [Pg.3319]

In the 1930s a special nail was developed to hold bone fragments together to allow them to heal better. A few years later a metal device was invented to replace the head of a femur (thigh bone), which formed part of the hip joint and often would not heal after being fractured. A total hip joint was later invented and it continues to be revised and improved to allow the patient maximum use and flexibility of the leg. [Pg.687]

Fig. 6 Cross-section of a three-level metal device showing the trench isolation, W plugs, metal, and interlevel dielectric layers. (View this art in color at www.dekker.com.)... Fig. 6 Cross-section of a three-level metal device showing the trench isolation, W plugs, metal, and interlevel dielectric layers. (View this art in color at www.dekker.com.)...
An alternative physical method for fouling control uses inserts within the tubes of a shell and tube exchanger. An example is the Spirelf system that consists of a spiral flexible metal device that is inserted and fixed into the tubes.The action of the device is to vibrate in response to the flow of fluid through the tube in which it is situated, thereby keeping the tube surface clean. The vibration is controlled to avoid erosion of the tube surface. It is claimed that the payback time is low of the order of months. [Pg.1207]

Kersting R., Plettner J., Leo K., Averin S. and Kurz H. (1993), Time-resolved luminescence study of ultrafast carrier transport in GaAs metal-semiconductor-metal devices , App/. Phys. Lett. 62, 732-734. [Pg.138]

As a result of these factors, the universal paradigm for inorganic solar cells, the p-n junction, cannot be adapted for organic semiconductors. The contrast with inorganic semiconductors is shown schematically in Fig. 7.2. The alternative of a metal-semi-conductor-metal device structure, where photocurrent is directed by the difference in work function between the two metals, also cannot be used because the electric field created by available asymmetric contact materials is insufficient to separate the singlet exciton into electron and hole polarons. Therefore, alternative device architectures are needed. [Pg.456]

Several studies have examined the influence of film morphology on sensor behavior [109, 168-178]. Two main areas of interest are the influence of film thickness and grain size on the time scale for sensor response as well as the magnitude (sensitivity) of sensor response. Other factors that may influence the conductivity response are the nature of the semiconductor-metal device contacts, as well as charge accumulation at other device interfaces, such as the gate oxide in field effect sensor devices. [Pg.103]

Figure 7.3. Typical indium tin oxide (lTO)/polymer/metal device structure. Figure 7.3. Typical indium tin oxide (lTO)/polymer/metal device structure.

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See also in sourсe #XX -- [ Pg.71 , Pg.72 , Pg.73 , Pg.74 , Pg.75 , Pg.76 ]




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